• 한국진공학회:학술대회논문집
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• 한국진공학회 2014년도 제46회 동계 정기학술대회 초록집
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• pp.342.1-342.1
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• 2014

The electrical, optical and structural properties of Ti doped $In_2O_3$ (TIO) ohmic contacts to p-type GaN were investigated using linear facing target sputtering (LFTS) system. Sheet resistance and resistivity of TIO films are decreased with increasing rapid thermal annealing (RTA) temperature. Although the $400^{\circ}C$ and $500^{\circ}C$ annealed samples showed rectifying behavior, the $600^{\circ}C$ and $700^{\circ}C$ annealed samples showed linear I-V characteristics indicative of the formation of an ohmic contact between TIO and p-GaN. The annealing of the contact at $700^{\circ}C$ resulted in the lowest specific contact resistivity of $9.5{\times}10^{-4}{\Omega}cm^2$. Based on XPS depth profiling and synchrotron X-ray scattering analysis, we suggested a possible mechanism to explain the annealing dependence of the properties of TIO layer on rapid thermal annealing temperature.

• 열처리공학회지
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• 제35권6호
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• pp.314-318
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• 2022

Transparent conducting ZnO/Ti/ZnO tri-layer films deposited on glass substrate with DC and RF magnetron sputtering were rapid thermal annealed at 150, 300 and 450℃ for 5 minutes and then effect of annealing temperature on the structural and optoelectronics properties of the films were investigated. The structural properties are strongly related to annealing temperature and the largest grain size is observed in the films annealed at 450℃. The electrical resistivity also decreases as low as 7.7 × 10^-4 Ωcm. The visible transmittance also depends on the annealing temperature. The films annealed at 450℃ show a higher transmittance of 80.6% in this study.

• Journal of Korean Vacuum Science & Technology
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• 제6권3호
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• pp.120-125
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• 2002

The aim of the present work is to optimized the annealing parameter in both front and back screen printed contacts realization on p-type multicrystalline silicon and with phosphorus diffused. The RTA treatments were carried out at various temperatures from 600 to 850$\^{C}$ and annealing time ranging from 3 min to 5 min in air, O$_2$and N$_2$ ambiance. The contacts parameters are obtained according to Transmission Line Model measurements. A good RTA cycle is obtained with a temperature plateau of 700$\^{C}$-750$\^{C}$ and annealing ambiance of air. Several processing parameters required for good cell efficiency are discussed with an emphasis placed on the critical role of the glass frit in the aluminum paste. A anamolus behaviour of Aluminum n-doping on p-type Si wafer, contact at high temperature have also been studied.

• 한국전기전자재료학회논문지
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• 제11권2호
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• pp.128-132
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• 1998

2/65/35 PLZT stock solution prepared by Sol-Gel processing was spin-coated on ITO coated glass and annealed by RTA(Rapid Thermal Annealing). The crystal structure of films was reported based on the observation of crystallization process and microstructure of the film fabricated at different fabrication condition. Films were crystallized into rhombohedral structure by annealing at $750^{\circ}C$ for 5 min. As the annealing temperature increased, the size of rosette structure of the films was grown up from $2.4{\mu}m$ to $15{\mu}m$, dielectric constant was increased, coercive field was decreased 33.82 kV/cm, remnant polarization was increased to 39.84 ${\mu}C/cm^2$ and Optical transmittance was decreased.

• Journal of Korean Vacuum Science & Technology
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• 제4권2호
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• pp.50-54
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• 2000

We studied the synthesis of S $i_{1-x}$ Cx (x=0.016) epitaxial layer using ion implantation and solid phase epitaxy (SPE). The activation energy Ea was obtained for the loss of substitutional carbon using fourier transform-infrared spectroscopy (FTIR) and high-resolution x-ray diffraction (HR-XRD). In FTIR analysis, the integrated peak intensity was used to quantify the loss of carbon atoms from substitutional to interstitial sites during annealing. The substitutional carbon contents in S $i_{0.984}$ $C_{0.016}$ were also measured using HR-XRD. By dynamic simulations of x-ray rocking curves, the fraction of substitutional carbon was obtained. The effects of annealing temperature and time were also studied by comparing vacuum furnace annealing with rapid thermal annealing (RTA))))))

• 한국진공학회:학술대회논문집
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• 한국진공학회 2012년도 제42회 동계 정기 학술대회 초록집
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• pp.376-376
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• 2012

본 연구는 Poly-Si에 이온 주입된 Boron의 Activation 거동을 연구하고자 SLS (Sequential Lateral Solidification) Poly-Si과 ELA (Excimer Laser Annealing) Poly-Si의 활성화 거동을 비교 분석하였다. SLS 및 ELA 결정화 방법으로 제조된 Poly-Si을 모재로 비 질량 분리 방식의 ISD (Ion Shower Doping) System을 사용하여 2.5~7.0 kV까지 이온주입 하였다. 이온주입 후 두 가지의 열처리 방법, 즉, FA 열처리(Furnace Annealing)와 RTA 열처리(Rapid Thermal Annealing)를 사용하여 도펀트 활성화 열처리를 수행하고 이온주입 조건 및 활성화 열처리 방법에 따른 결함 회복 및 도펀트 활성화 거동의 변화를 관찰하였다. TRIM-code Simulation 결과 가속 이온 에너지와 조사량이 증가 할수록 이온주입 시 발생하는 결함의 양이 증가하는 것을 정량적으로 계산하였다. 실험 결과 결함의 양이 증가 할수록 Activation이 잘되는 것을 관찰할 수 있었다. SLS Poly-Si에 비하여 ELA Poly-Si의 경우 도펀트 활성화 열처리 후 활성화 효율이 높게 나타났다. 본 결과는 Grain Boundary의 역할과 밀접한 관계가 있으며 간단한 정성적인 Model을 제시하였다. 활성화 효율의 경우 RTA 열처리 시편이 FA 시편에 비하여 높은 것이 관찰되었다. 본 결과는 열처리 온도 및 시간에 따라 변화하는 Boron의 특이한 활성화 거동인 Reverse Annealing 효과에 기인하는 것으로 규명되었다.

• 한국진공학회지
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• 제13권3호
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• pp.109-113
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• 2004

InP에서 열처리 온도와 시간 및 활성화 온도에 따른 Zn의 확산의 특성을 electrochemical capacitance-voltage 법으로 조사하였다. InP층은 metal organic chemical vapor deposition를 이용하여 성장하였으며, 화산방법으로는 $Zn_3P_2$ 확산과 박막과 rapid thermal annealing를 사용하였다. 최대의 정공 농도를 갖는 p-lnP 층은 $550^{\circ}C$에서 5분 동안 확산과 활성화를 한 시료에서 얻었고, Zn의 농도는 $1\times10^{19}\textrm{cm}^{-3}$이었다. $550^{\circ}C$에서 5-20 분 동안 확산을 수행한 결과 정공농도의 확산 깊이는 1.51 $\mu\textrm{m}$에서 3.23 $\mu\textrm{m}$로 이동하였고, Zn의 확산계수는 $5.4\times10^{-11}\textrm{cm}^2$/sec이었다. 활성화 시간의 증가로, Zn가 더 깊게 확산하지만, 정공농도는 거의 변화가 없었다. 이는 도핑된 영역의 과잉의 침입형 Zn가 도핑되지 않은 영역으로 빠르게 확산하고 치환형 Zn로 변한다는 것을 의미한다. 정공농도는 $SiO_2$ 박막의 두께가 1,000$\AA$ 이상이어야 안정적으로 분포된다.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1998년도 추계학술대회 논문집 학회본부 C
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• pp.740-742
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• 1998

In this paper, we described the effect of rapid thermal annealing on the electrical properties of interfacial layer between various top electrodes and $(Ba_{0.5}Sr_{0.5})TiO_3$ thin films. BST thin films were fabricated on Pt/TiN/$SiO_2$/Si substrate by RF magnetron sputtering technique. AI, Ag, and Cu films for the formation of top electrode were deposited on BST thin films by thermal evaporator. Top electrodes/BST/Pt capacitor annealed with rapid thermal annealing at various temperature. In $(Ba_{0.5}Sr_{0.5})TiO_3$ thin films with Cu top electrode annealed at $500^{\circ}C$, the dielectric constant was measured to the value of 366 at 1.2 [kHz] and the leakage current was obtained to the value of $5.85{\times}10^{-7}\;[A/cm^2}$ at the forward bias of 2 [V].

• 전자공학회논문지A
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• 제32A권1호
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• pp.179-184
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• 1995

Phosphorous was deped in silicon thin films by Ion Mass Doping and Changes in the electrical resistance with respect tko heat treatments were investigated. SOI(Silicon On Insulator) thin films which contain few grain boundaries prepared by ZMR(Zone Melting Recrystallization) of polysilicon films, polysilicon films which have about 1500 $A^{\rarw}$ of grain size prepared by LPCVD at 625.deg. C, and amorphous silicon thin films prepared by LPCVD at low temperature were used as substrates and thermal behavior of phosphorous after RTA(Rapid Thermal Annealing) and furnace annealing was carefully studied. Amorphous thin films showed about 10$^{6}$ .OMEGA./ㅁbefore any heat treatment, while polycrystalline and SOI films about 10$^{3}$.OMEGA./¤. All these films, however, showed about 10.OMEGA./ㅁafter furnace annealing at 700.deg. C for 3hrs and RTA showed about the same trend. Films with grain boundaries showed a certain range of heat treatment which rendered increase of the electrical resistance upon annealing, which could not be observed in amorphous films and segregation of doped phosphorous by diffusion with annealing was thought to be responsible for this abnormal behavior.

• 대한전기학회논문지:전기물성ㆍ응용부문C
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• 제49권4호
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• pp.232-238
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• 2000

PZT thin films(3500 ) have been prepared onto $Pt/Ti/SiO_2/Si$ substrates with a RF magnetron sputtering system using PB1.05(Zr0.52,Ti0.48)O3 ceramic target. We used two-step annealing techniques. As the RTA times and temperatures were increased, crystallization of PZT thin films were enhanced. The ferroelectric characteristics of PZT capacitors fabricated at $700^{\circ}C$ for 60 seconds were like these remanent polarization were $12.1 \muC/cm^2$, coercive field were 110 kV/cm, leakage current density were $4.1\times10-7 A/cm^2,\; \varepsilonr=442,$ and remanent polarization were decreased by 22% after 1010 cycles, respectively.