• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1999년도 춘계학술대회 논문집
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• pp.665-668
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• 1999

Thin films of Pb(Zr,Ti)O$_3$ were fabricated by means of the sol-gel spin-coating method and the multi-coating of eight coating numbers. The thin films were dried on the temperature range of 250 ~ 400($^{\circ}C$), whenever the specimens were dried after each coating Processing. The fabricated ferroelectric thin films of lead zirconate titanate(PZT) were treated with the rapid thermal annealing(RTA) at 650($^{\circ}C$),or 3(min), and direct insertion thermal annealing(DITA) at 650($^{\circ}C$), for 30(min). The measured properties of dielectric thin films were following: The good results of dielectric properties were shown by the RTA specimen. The saturation polarization(Ps), remanent polarization(Pr), coercive field (Ec), dielectric constant and dielectric loss factor of the RTA specimen were estimated to be about 27.1[ $\mu$ C/$\textrm{cm}^2$], 13.7[ $\mu$ C/$\textrm{cm}^2$], 55.6(kV/cm), 786 and 6.4(%) respectively.

• 한국진공학회지
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• 제9권2호
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• pp.150-154
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• 2000

Impurity-free vacancy diffusion 방법을 이용하여 압축 응력을 가진 InGaAs/InGaAsP 다중 양자 우물 구조에서 열처리 온도에 따른 무질서 정도를 조사하였다. InGaAs/SiO$_2$ cap 구조가 InP/$SiO_2$ cap 구조보다 급속열처리 (rapid thermal annealing : RTA) 과정에서 더 많은 청색 천이를 나타내었다. 열처리 온도 $700^{\circ}C$에서, InGaAs/$SiO_2$ cap 구조의 경우 다중양자우물의 밴드갭 파장은 1.55 $\mu\textrm{m}$대역에서 1.3 $\mu\textrm{m}$ 대역으로 이동하였으며, InGaAs/$SiO_2$ cap 구조와 InP/$SiO_2$ cap 구조의 밴드갭 파장차이는 195 nm (123 meV)로 높은 선택성을 나타내었다. 또한, DCXRD 스펙트럼으로부터 다중양자우물 구조에서 균일한 합금형태로 완전히 무질서화되는 것을 볼 수 있었다.

• 한국진공학회지
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• 제17권2호
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• pp.156-159
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• 2008

Pseudo-MOSFET 방법을 이용하여 Ge농도에 따른 SiGe-on-Insulator(SGOI) 기판의 특성을 평가하였다. SGOI 기판은 compressive-SiGe / Relaxed-Si / Buried oxide / Si-substrate 구조로 SOI 기판 위에 에피택셜 성장법으로 SiGe층을 형성하였으며 compressive SiGe층의 Ge 농도는 각각 16.2％, 29.7％, 34.3％, 56.5％ 이다. 실험결과 Ge 농도가 증가함에 따라 누설전류가 증가하는 특성을 보였으며 threshold voltage는 nMOSFET의 경우 3V에서 7V로 이동하였으며 pMOSFET의 경우도 -7 V에서 -6 V로 이동하는 특성을 보였다. 급속 열처리 공정 (rapid thermal anneal) 후에 매몰 산화층과 기판 계면간의 스트레스에 의한 포획준위가 발생하여 소자특성이 열화되었지만, $H_2/N_2$ 분위기에서 후속 열처리 공정 (post RTA anneal) 을 통하여 계면 간의 포획준위를 감소시켜 SGOI Pseudo-MOSFET의 전기적 특성이 개선되었다.

• 한국재료학회지
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• 제1권1호
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• pp.17-22
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• 1991

불순물이 주입된 실리콘 기판에 500 두께의 탄탈륨 박막을 증착한 후 실리사이드를 형성시키기 위해 아르곤 분위기에서 급속열처리(RTA)률 하였다. 형성된 $TaSi_2$와 불순물의 거동은 XRD, SEM, 4-point probe, HP4145와 SIMS로 조사하였다. 불순물의 종류에 관계없이 $TaSi_2$는 RTA 온도가 $800^{\circ}C$일때 형성되기 시작하였으며 $1000^{\circ}C$이상에서 증착된 Ta가 전부 $TaSi_2$로 상 전이가 일어났다. 또한 $TaSi_2/P^+$영역에 대한 접촉저항간은 contact size가 $0.9{\times}0.9({\mu}{m^2}$)일때 $22{\Omega}$ 낮은값을 가졌으며 이온 주입된 불순물은 RTA처리시 형성된 $TaSi_2$층으로 out-diffusion이 일어났다.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2009년도 제36회 동계학술대회 초록집
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• pp.171.1-171.1
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• 2009

• 한국세라믹학회지
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• 제33권6호
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• pp.665-671
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• 1996

Ferroelectric Pb(Fe1/2Nb1/2)O3 thin films were successfully fabricated on ITO/Glass substrate by sol-gel proces-sing and characterized to determine the dielectric and electric properties. Viscosity of PEN sol measured to investigate rheological properties was 3.25 cP which was proper for coating. The sol also showed Newtonian behavior. RTA(Rapid Thermal Annealing) was used for the annealing of the thin film and 1200~1700$\AA$ thick PEN thin films were fabricated by repeating the intermediate and the final annealing. After the deposition of Pt as top electrode by vacuum evaporation dielectric and electric properties were measured. Dielectric properties of FFN thin film were enhanced by increasing the perovskite phase fraction with increasing the annealing temperature. Measured dielectric constant of 1700$\AA$ PFN thin film annealed at $650^{\circ}C$ was 890 at 1kHz Capacitatnce density and dielectric loss were 47 fF/${\mu}{\textrm}{m}$2 and 0.47 respectively. As a result of measuring Curie temperature PFN thin films had Curie point with a rang of 110~12$0^{\circ}C$ and showed broad dielectric peak at that point. Leakage current of the PFN thin films were increased with increasing the annealing tempera-ture.

• 한국전기전자재료학회논문지
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• 제20권3호
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• pp.263-267
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• 2007

We investigate the influence of the ambient gas during thermal annealing on the photoluminescence (PL) properties of europium-silicate thin films. The films were fabricated on substrates by using a radio-frequency magnetron sputtering method and subsequent rapid thermal annealing (RTA). The mechanism for the formation of the europium silicates during the annealing process was investigated by using X-ray diffraction (XRD) spectroscopy, Auger electron spectroscopy (AES) and transmission electron microscopy (TEM). A series of narrow PL spectra from $Eu^{3+}$ ions was observed from the film annealed in $O_2$ ambient. Broad PL spectra associated with $Eu^{2+}$ ions, with a maximum intensity at 600 nm and a FWHM of 110 nm, were observed from the thin film annealed at $1000^{\circ}C$ in $N_2$ ambient.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2006년도 하계학술대회 논문집 Vol.7
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• pp.418-419
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• 2006

We investigate the influence of the ambient gas during thermal annealing on the photoluminescence (PL) properties of europium-silicate thin films. The films were fabricated on substrates by using a radio-frequency magnetron sputtering method and subsequent rapid thermal annealing (RTA). The mechanism for the formation of the europium silicates during the annealing process was investigated by using X-ray diffraction (XRD) spectroscopy, Auger electron spectroscopy (AES) and transmission electron microscopy (TEM). A series of narrow PL spectra from $Eu^{3+}$ ions was observed from the film annealed in $O_2$ ambient. Broad PL spectra associated with $Eu^{2+}$ ions, with a maximum intensity at 600 nm and a FWHM of 110 nm, were observed from the thin film annealed at $1000^{\circ}C$ in $N_2$ ambient.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2012년도 제42회 동계 정기 학술대회 초록집
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• pp.314-314
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• 2012

The dilute magnetic semiconductors (DMS) have been developed to multi-functional electro-magnetic devices. Specially, the Si based DMS formed by ion implantation have strong advantages to improve magnetic properties because of the controllable effects of carrier concentration on ferromagnetism. In this study, we investigated the deep level states of Fe- and Co-ions implanted Si wafer during rapid thermal annealing (RTA) process. The p-type Si (100) wafers with hole concentration of $1{\times}10^{16}cm^{-3}$ were uniformly implanted by Fe and Co ions at a dose of $1{\times}10^{16}cm^{-2}$ with an energy of 60 keV. After RTA process at temperature ranges of $500{\sim}900^{\circ}C$ for 5 min in nitrogen ambient, the Au electrodes with thickness of 100 nm were deposited to fabricate a Schottky contact by thermal evaporator. The surface morphology, the crystal structure, and the defect state for Fe- and Co- ion implanted p-type Si wafers were investigated by an atomic force microscopy, a x-ray diffraction, and a deep level transient spectroscopy, respectively. Finally, we will discuss the physical relationship between the electrical properties and the variation of defect states for Fe- and Co-ions implanted Si wafer after RTA.

• 한국세라믹학회지
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• 제30권10호
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• pp.803-810
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• 1993

PbxZr0.4Ti0.6O3 thin films were prepared by reactive co-sputtering and annealed by RTA(Rapid Thermal Annealing) process. Effect of Pb content in PbxZr0.4Ti0.6O3 films on the phase transformation was intensively studied. It has been found out that depending on the Pb content as well as RTA temperature, crystal structure of PbxZr0.4Ti0.6O3 films change greatly. It turned out that transformation temperature for perovskite can be lowered and the width of transition temperature region was reduced by increasing Pb content in the film. And the lattice was expanded with increasing Pb content. With increasing RTA temperature, as-deposited phase was transformed into perovskite through three different transformation paths depending on Pb content. It was confirmed that activation energies for nucleation of perovskite structure are much larger than those of its growth.