• Proceedings of the Korean Vacuum Society Conference
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• 2014.02a
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• pp.354.2-354.2
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• 2014

최근 반도체 산업의 발전에 따라 반도체 소자 내 배선재료로 사용되던 Aluminium (Al)의 대체물로 Copper (Cu)가 사용되고 있다. Cu는 Al보다 우수한 전도성과 비용이 저렴하다는 장점이 있으나 반도체 기판과의 확산으로 이를 해결해야만 하는 문제점이 있다. 이는 Si와 Cu사이에 확산방지막을 사용하여 해결할 수 있는데 Hafnium Nitride (HfN) 박막은 다른 물질과 비교해 고온에서의 안정성과 낮은 비저항을 가지고 있어 주목을 받고 있다. 본 연구에서는 rf magnetron sputter 방법으로 박막 증착 시에 인가하는 rf power가 박막의 표면 특성에 어떠한 영향을 미치는지 nano-indenter를 사용해 surface hardness와 elastic modulus의 변화를 중심으로 알아보았다. 시료는 rf magnetron sputter로 증착 시 인가하는 plasma power를 60W와 80W로 달리하여 증착하였다. 증착가스는 Ar과 $N_2$를 조절하여 사용하였고 총 유량을 40 sccm 으로 고정하였으며, 이 때 압력은 3mTorr로 유지하였다. 실험결과 plasma power를 80W로 인가하여 증착한 시료의 surface hardness (18.48 GPa)가 60W로 증착한 시료의 surface hardness (12.03 GPa)보다 큰 값을 나타내었다. 이와 마찬가지로 80W로 증착한 시료의 elastic modulus(187.16 GPa)도 60W로 증착한 시료의 탄성계수 (141.15 GPa)보다 큰 값을 나타내었다. 이는 증착 시 인가하는 plasma power의 크기가 증가하면 박막표면에 compressive stress가 생성되어 박막의 surface hardness와 elastic modulus가 상대적으로 높게 측정되는 것으로 생각된다.

• 한국신재생에너지학회:학술대회논문집
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• 2007.06a
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• pp.309-312
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• 2007

Sputter deposition followed by surface treatment was studied using reactive RF plasma as a method for preparing titanium oxide($TiO_{2}$) films on indium tin oxide(ITO) coated glass substrate for dye-sensitized solar cells(DSSCs). Anatase structure $TiO_{2}$ films deposited by reactive RF magnetron sputtering under the conditions of $Ar/O_{2}$(5%) mixtures, RF power of 600W and substrate temperature of $400^{\circ}C$ were surface-treated by inductive coupled plasma(ICP) with $Ar/O_{2}$ mixtures at substrate temperature of $400^{\circ}C$, and thus the films were applied to the DSSCs, The $TiO_{2}$ Films made on these exhibited the BET specific surface area of 95, the pore volume of $0.3cm^{2}$ and the TEM particle size of ${\sim}25$ nm. The DSSCs made of this $TiO_{2}$ material exhibited an energy conversion efficiency of about 2.25% at $100mW/cm^{2}$ light intensity.

• The Proceeding of the Korean Institute of Electromagnetic Engineering and Science
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• v.14 no.3
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• pp.15-19
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• 2003

In This paper, we developed 1.96 GHz air gap type FBAR BPF using ZnO as piezoelectric sputtered by RF magnetron at room temperature. FBAR BPF was fabricated by sputtering bottom electrode (Al), ZnO as piezoelectric and top electrode (Mo) on Si wafer one by one with RF magnetron sputter, then Si was dry etched to make an air hole. XRD test result of fabricated FBAR BPF showed that ZnO crystal was well pre-oriented as (002) and sigma value of XRC was 1.018. IL(Insertion loss) showed excellent result as 1 dB.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.02a
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• pp.201-201
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• 2010

본 연구에서는 RF magnetron co-sputtering을 이용하여 Zn-O-Ga 구성비에 따른 광투과도 및 전기적 특성을 연구하였다. 타겟으로 ZnO 및 $Ga_2O_3$ 소결체를 이용하였으며, 두 개의 RF magnetron sputter의 RF power를 동시에 조절하여 타겟의 구성비를 조절하였으며, 기판과 타겟의 거리를 25 mm~75 mm 범위 내에 조절하여 거리에 따른 Zn-O-Ga 박막의 광투과 특성 및 전기적 특성을 관찰하였다. $Ga_2O_3$ 소결체의 magnetron sputter의 RF power를 30 watt에서 100 watt로 증가함에 따라 박막내의 Ga 성분은 0.5%에서 7.4%로 증가하였으며 Zn 성분은 46.3%에서 40.9%로 O성분은 53.2%에서 51.6%로 각각 줄어들었다. 이에 따라 ZnO의 우선방위 (002) 결정각($2{\theta}$)은 34.24에서 33.87로 줄어들었으며, 이동도 $5.5\;cm^2/Vs$ 에서 $1.99\;cm^2/Vs$ 정도로 감소하는 경향을 보였다. 광투과도는 가시광선 영역에서 85% 이상 보였으며, carrier 밀도는 $0.5\;{\sim}\;4.0^*10^{20}/cm^3$로 증가함에 따라 이동도는 $1.5{\sim}5.5\;cm^2/Vs$로 투명전도막의 특성을 보였다.

• Proceedings of the KIEE Conference
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• 2007.07a
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• pp.1572-1573
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• 2007

RF magnetron 스퍼터에서 스퍼터링시 타겟 온도와 기판 온도가 증가함에 따라 chamber내부의 압력이 달라져 동일한 순도의 박막을 얻기가 힘들다. 본 연구에서는 gas량을 조절하는 MFC의 출력 전압을 PID 제어 시스템을 설계하여 기준전압(원하는 진공도에 해당하는 전압 값)과 진공게이지에서 출력되는 전압을 비교하여 MFC의 출력 전압을 증가 또는 감소시킴으로써 gas량을 일정하게 하여 chamber 내부의 압력이 일정하게 유지되도록 하였다.

• Proceedings of the KIEE Conference
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• 1993.07b
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• pp.612-614
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• 1993

Sputtering requires a way to bombard the target with sufficient momentum. Positive ions are the most convenient source since their energy and momentum can be controlled by applying a potential to the target. Although many types of discharges have been used for sputtering, magnetrons are now the most widely used because of the high ion current densities. Namely, plasma near the target electrode is confined by magnetic field using permanent magnet, so that the collision probability is increased. It is important to develop RF magnetron sputtering system which has many excellent merits compared with conventional methods. Our study aims to develop 1 kW RF source(13.56 MHz, TR type) and to accumulate the design and construction technology of RF magnetron sputter-deposition system. We developed 1 kW RF sputtering system to deposit thin film. These films are deposited by this RF source matched by auto-matching system using primarily argon gas. Target of Au, Ni, Al, and $SiO_2$ was well deposited on the argon pressure of 5-10 mTorr.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.11a
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• pp.169-170
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• 2007

In this paper we report upon an investigation into the effect of sputter pressure and RF power on the electrical properties of Gallium doped zinc oxide (GZO) film. GZO films were deposited on glass substrate without substrate temperature by RF magnetron sputtering from a ZnO target mixed with 5 wt% $Ga_2O_3$. Argon gas pressure and RF power were in the range of 1~11 mTorr, and 50~100 W, respectively. However, the resistivity of the film was strongly influenced by the sputter pressure and RF power. We were able to achieve as low as $1.5{\times}10^{-3}\;{\Omega}cm$, without substrate temperature.

• Proceedings of the Materials Research Society of Korea Conference
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• 2006.05a
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• pp.23.1-23.1
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• 2006

• 한국정보디스플레이학회:학술대회논문집
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• 2007.08b
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• pp.1547-1550
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• 2007

$YVO_4:Eu^{3+}$ thin film phosphor samples have been deposited by using RF magnetron sputter deposition technique with various deposition temperatures. The Effect of deposition temperature (room temperature to $450\;^{\circ}C$) on morphological, crystal structure, and luminescence properties of $YVO_4:Eu^{3+}$ thin film phosphor has also been investigated. As the deposition temperature increases, the size of crystal grain and surface roughness of thin film increases principally and its crystallinity also increases. It is found that the asdeposited $YVO_4:Eu^{3+}$ thin film excited either photon or electron shows typical luminescence spectra successfully. CIE color coordinates of $YVO_4:Eu^{3+}$ thin film phosphor with increasing deposition temperature moved towards more reddish region.

• Korean Journal of Materials Research
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• v.15 no.7
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• pp.465-472
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• 2005

Preparation of copper film on PET substrate was carried out by cyclic operation of RF-magnetron­sputtering under continuous operation of ECR-CVD. The purpose of this study is aimed to an increase in deposition rate with keeping excellent adhesion between copper film and PET. In order to optimize the sputtering time under continuous ECR-CVD, cyclic operation concept is employed. By changing parameters of cyclic operation such as split of e and cycle time of A, the characteristics and thickness of the deposited copper film are controlled. As $\theta$ value increase, film thickness could confirm to increase and its surface resistivity value decreases. The highest adhesive strength appears at $\theta=0.33$ and cycle time of 30 min. The uniformity of copper film shows $5\%$ in our experimental range.