• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.17 no.2
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• pp.228-235
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• 2004

In this thesis, it is designed efficient electrode formation on the organic luminescent device. ITO electrode is treated with $O_2$plasma. In order to inject hole efficiently, there is proposed the shape of anode that inserted plasma polymerized films as buffer layer between anode and organic layer using thiophene monomer. It is realized efficiently electron injection to aluminum due to introduce the quantum well in cathode. In the case of device inserted the buffer layer by using the plasma poiymerization after $O_2$plasma processing for ITO transparent electrode, since it forms the stable interface and reduce the moving speed of hole, the recombination of hole and electronic ate made in the omitting layer. Compared with the devices without buffer layer, the turn-on voltage was lowered by 1.0(V) doc to the introduction of buffer layer Since the quantum well structure is formed in front of cathode to optimize the tunneling effect, there is improved the power efficiency more than two times.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.02a
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• pp.198-198
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• 2011

단분산 결정질 실리콘 나노입자 (<10 nm)는 양자점 효과로 인한 선택적 파장 흡수가 가능하므로 태양전지 분야에 응용 가능성이 크다. 특히 입경의 크기가 작아지면 부피대비 표면적이 넓어지기 때문에 태양빛 흡수 면적이 증가한다. 따라서 입자의 크기는 태양전지에서 효율을 결정하는 중요한 요소 중 하나이다. 이러한 이유에서 plasma arc synthesis, laser ablation, pyrolysis 그리고 PECVD (Plasma Enhanced Chemical Vapor Deposition) 등이 실리콘 나노입자를 합성하는데 연구되어 왔으며, 특히 PECVD는 입자 생성과 동시에 균일한 증착이 이루어질 수 있기 때문에 태양전지 제작 시 공정 효율을 높일 수 있다. PECVD를 이용한 나노입자 합성에서 입경을 제어하는데 중요한 전구물질은 Ar과 SiH4가스이다. Ar 가스는 ICP (Inductively Coupled Plasma) 챔버 내부에 가해준 전력을 통해 가속됨으로써 분해되어 Ar plasma가 생성된다. 이는 공급되는 SiH4가스를 분해시켜 핵생성을 유도하고, 그 주위로 성장시킴으로써 실리콘 나노입자가 합성된다. 이때 중요한 변수 중 하나는 핵생성과 입자성장시간의 조절을 통한 입경제어 이다. 또한 공급되는 가스의 유량은 입자가 생성될 때 필요한 화학적 구성비를 결정하므로 입경에 중요한 요소가 된다. 마지막으로 공정압력은 챔버내부의 plasma 구성 요소들의 평균 자유 행로를 결정하여 SiH4가 분해되어 입자가 생성되는 속도와 양을 제어한다. PECVD를 이용한 실리콘 나노입자 형성의 주요 변수는 RF pulse, 가스(Ar, SiH4, H2)의 유량, Plasma power, 공정압력 등이 있다. 본 연구에서는 RF (Radio Frequency) PECVD방법을 이용하여 실리콘 나노입자를 만드는데 필요한 여러 변수들을 제어함으로써 이에 따른 입경분포 차이를 연구하였다. 또한 SEM (Scanning Electron Microscopy)과 SMPS (Scanning Mobility Particle Sizer)를 이용하여 각 변수에 따라 생성된 나노입자의 입경과 농도를 분석하였다. 이 중 plasma power에 따른 입경분포 측정 결과 600W에서 합성된 실리콘 나노입자가 상당히 단분산 된 형태로 나타남을 확인할 수 있었고 향후 다른 변수의 제어, 특히 DC bias 전압과 열을 가함으로써 나노입자의 결정성을 확인하는 추가 연구를 통해 태양전지 제작에 응용 할 수 있을 것으로 예상된다.

• Electrical & Electronic Materials
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• v.9 no.9
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• pp.918-924
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• 1996

A downstream oxygen plasma is generated by capacitively coupled RF power and applied to photoresist stripping. Stripping rate (ashing rate) is measured in terms of RF power, chamber pressure, oxygen flow rate and temperature. Ashing reaction is thermally activated and depends on oxygen radical density. The ashing process is optimized to have the high ashing rate, good uniformity and minimal plasma damage using a statistical method.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.05a
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• pp.130-132
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• 2006

In this paper, the author describes a-C films grown in pure methane plasma without any diluent gas by using RF plasma-enhanced CVD, and the variations in their structural features and surface morphologies are examined as a function of substrate temperature. Raman spectroscopy and scanning electron microscopy were performed to characterize the properties of the film.

• Journal of the Semiconductor & Display Technology
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• v.2 no.4
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• pp.13-17
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• 2003

An adaptor is designed for chamber impedance measurement of plasma process. Copper rod, fixed board and compensation circuit are the major components of the adaptor. An adaptor can be to measure chamber impedance on time unless stopping a process and Data to measure can do the database. We can use it to a criteria data for a failure diagnosis. So developed adaptor could be used for diagnosis the plasma process chamber in semiconductor industry.

• Proceedings of the KIEE Conference
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• 2000.07c
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• pp.1503-1505
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• 2000

To grow the diamond films by using RF-MW mix-process, at first, diamond seeds were deposited on silicon substrate by RF plasma CVD, and then a diamond layer grown by MW plasma CVD on the seeds. The grain-size of diamond films deposited by using HF-MW mix-process was smaller and denser than those of the MW plasma CVD process. The deposited diamond films were analyzed by scanning electron microscophy, X-ray diffractometer and Raman spectroscopy.

• Bulletin of the Korean Chemical Society
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• v.19 no.11
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• pp.1172-1174
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• 1998

Spatial(radial and height) distributions of excited argon species are measured for an inductively coupled plasma under five operating conditions: 1) no carrier gas, 2) carrier gas without aerosol, 3) carrier gas with desolvated aerosol, 4) carrier gas with aerosol, 5) carrier gas with aerosol and excess lithium. A complete RF power mapping of argon excited states is obtained. The excited states of argon for a typical analytical torch rapidly diffuse towards the center in the higher region of the plasma. The presence of excess lithium makes no significant change in the excited states of argon. The increase in the RF power increases the intensity of argon excited states uniformly across the radial coordinate.

• Journal of the Microelectronics and Packaging Society
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• v.10 no.2
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• pp.39-47
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• 2003

Cr thin films were deposited on photosensitive polyimide substrates by RF bias sputtering and DC sputtering and the interfaces between Cr thin film and polyimide were observed using TEM. When the polyimide surface was in-situ RF plasma cleaned at the RF power density of 0.13-2.12 $W/cm^2$, increasing of RF power density changed the morphology of polyimide surfaces from round dig to sharp shape, and surface roughness increased by anisotropic etching. The intermixed layer-like interfaces between Cr and polyimide were observed in the RF bias sputtered specimens. This interface seems to be formed due to the RF cleaning effect; the polyimide surface was RF plasma cleaned while RF power was increased to the setting point before Cr deposition.

• Journal of Surface Science and Engineering
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• v.36 no.1
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• pp.14-21
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• 2003

Thin films of ZrO$_2$ and TiO$_2$ were deposited on Si(100) substrates using RF magnetron sputtering technique. To study an influence of the sputtering parameters, systematic experiments were carried out in this work. XRD data show that the $ZrO_2$ films were mainly grown in the [111] orientation at the annealing temperature between 800 and $1000^{\circ}C$ while the crystal growth direction was changed to be [012] at above $1000^{\circ}C$. FT-IR spectra show that the oxygen stretching peaks become strong due to $SiO_2$ layer formation between film layers and silicon surface after annealing, and proved that a diffusion caused by either oxygen atoms of $ZrO_2$ layers or air into the interface during annealing. Different crystal growth directions were observed with the various deposition parameters such as annealing temperature, RF power magnitude, and added $O_2$ amounts. The growth rate of $TiO_2$ thin films was increased with RF power magnitude up to 150 watt, and was then decreased due to a sputtering effect. The maximum growth rate observed at 150 watt was 1500 nm/hr. Highly oriented, crack-free, stoichiometric polycrystalline $TiO_2$<110> thin film with Rutile phase was obtained after annealing at $1000^{\circ}C$ for 1 hour.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.27 no.8
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• pp.516-521
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• 2014

An excellent hydrophobic surface has a high contact angle over 147 degree and the contact angle hysteresis below $5^0$ was produced by using roughness combined with hydrophobic PTFE coatings, which were also confirmed to exhibit an extreme adhesion to glass substrate. To form the rough surface, the glass was etched by Ar-plasma. A very thin PTFE film was coated on the plasma etched glass surface. Roughness factors before or after PTFE coating on the plasma etched glass surface, based on Wensel's model were calculated, which agrees well with the dependence of the contact angle on the roughness factor is predicted by Wensel's model. The PTFE films deposited on glass by using a conventional rf-magnetron sputtering. The glass substrates were etched Ar-plasma prior to the deposition of PTFE. Their hydrophobicities are investigated for application as a anti-fouling coating layer on the screen of displays. It is found that the hydrophobicity of PTFE films mainly depends on the sputtering conditions, such as rf-power, Ar gas content introduced during deposition. These conditions are closely related to the deposition rate or thickness of PTFE film. Thus, it is also found that the deposition rate or the film thickness affects sensitively the geometrical morphology formed on surface of the rf-sputtered PTFE films. In particular, 1,950-nm-thick PTFE films deposited for 30 minute by rf-power 50 watt under Ar gas content of 20 sccm shows a very excellent optical transmittance and a good anti-fouling property and a good durability.