• Journal of the Institute of Electronics Engineers of Korea SD
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• v.40 no.8
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• pp.555-559
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• 2003

In this paper, a new CMOS RF model for RF IC design including the capacitance effect, the skin effect, and the proximity effect between metal lines on the Si surface is proposed for tile first time for accurately predicting the RF behavior of CMOS devices. The capacitances between metal lines on the Si surface are modeled with the layout. And the skin effect is modeled with a parallel branch added in equivalent circuit of metal line. The proximity effect is modeled by adding the mutual inductance between cross-coupled inductances in the ladder circuit representation. Compared to the BSIM 3v3. the proposed RF model shows good agreements with the measured data and shows well the frequency dependent behavior of devices in GHz ranges.

• Proceedings of the Korean Operations and Management Science Society Conference
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• 2005.05a
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• pp.914-921
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• 2005

신제품으로 개발 중인 초소형 CMOS RF 전압 제어발진기(VCO) IC 에 대한 공인된 시험 규격은 현재 개발되어 있지 않다. 또한 제조업체들은 고유의 시험방법을 보유하고 있을 것이나 공개하지 않고 있는 실정이다. 한편 일부 해외 제조업체에서 국제 규격인 IEC 또는 JEDEC 을 기준으로 시험방법을 제시하고 있지만, 이러한 시험규격들은 개별 부품을 솔더링하는 하이브리드 공정을 이용하여 제작된 VCO 를 대상으로 한 것이다. 그러므로 CMOS 반도체 공정을 이용한 IC 형으로 개발 중인 VCO 를 평가하기에는 적합하지 않다. 이에 본 연구에서는 신개발 부품인 CMOS RF VCO IC 에 대한 신뢰성 시험 및 평가 기준을 수립하고, 신뢰성 확보를 위한 신제품 개발 단계에서의 신뢰성 평가 프로세스를 개발하고자 한다.

• Journal of the Korean Institute of Telematics and Electronics S
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• v.35S no.9
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• pp.19-27
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• 1998

The Transmitter part of single RF transceiver chip for an extended GSM handset application was circuit-designed, fabricated adn evaluated. The RF-IC Chip was processed by 0.8${\mu}m$ Si BiCMOS, 80 pin TQFP of $10 {\times} 10mm$ size, 3.3V operated RF-IC reveals, in general, quite reasonable integrity and RF performances. This paper describes development resuts of RF transmitter section, which includes IF/RF up-conversion mixer, IF/RF polyphase and pre-amplifier. The test results show that RF transmitter section is well operated within frequency range of 880~915MHz, which is defined on the extended GSM(E-GSM) specification. The transmitter section also reveals moderate power consumption of 71mA and total output power of 8.2dBm.

• Journal of IKEEE
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• v.7 no.2 s.13
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• pp.172-180
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• 2003

Based on simulation results and accompanying analysis, we suggest a thyristor-type ESD protection device structure suitable for implementation in standard CMOS processes to reduce the parasitic capacitances added to the input nodes, which is very important in CMOS RF ICs. We compare DC breakdown characteristics of the suggested device to those of a conventional NMOS protection device to show the benefits of using the suggested device for ESD protection. The characteristic improvements are demonstrated and the corresponding mechanisms are explained based on simulations. Structure dependencies are also examined to define the optimal structure. AC simulation results are introduced to estimate the magnitude of reduction in the added parasitic capacitance when using the suggested device for ESD protection. The analysis shows a possibility of reducing the added parasitic capacitance down to about 1/40 of that resulting with a conventional NMOS protection transistor, while maintaining robustness against ESD.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.35 no.5A
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• pp.496-503
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• 2010

The implementation of a RF transceiver for WRAN(Wireless Regional Area Network) system based on IEEE 802.22 standard using Cognitive Radio technology is presented in this paper. A CMOS RF transceiver IC for WRAN system operates in VHF/UHF(54~862MHz) broadband, and employs dual-path direct-conversion configuration and the in-band harmonic distortions are effectively suppressed by exploiting the dual-path direct conversion architecture. For 64QAM(3/4 coding rate) OFDM signal, an EVM of <-31.4dB(2.7%) has been achieved at 10dBm off-chip PA output power and the total chip area with pads is 12.95 mm2. The experimental results show that the proposed CMOS RF transceiver IC has perfect performance for WRAN system based on TDD(Time Division Duplex) mode.

• Proceedings of the IEEK Conference
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• 1999.06a
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• pp.251-256
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• 1999

RF CMOS 집적회로 기술은 CMOS 기술의 급격한 발전과 더불어 최근 크게 주목 받고 있다. 이는 CMOS가 제공 할 수 대량생산 능력으로 인해 기존 RF IC의 저가격화뿐 아니라 미래의 복합.다기능 무선 멀티미디어 단말기 구현을 위란 single chip solution을 제공 할 수 있는 가능성이 가장 높기 때문이다. 본 논문은 먼저 개인 휴대 통신 단말기 시장을 전망해보고, 향후 전개될 다양한 무선서비스에 대응하기 위한 RF CMOS 집적회로의 소자 및 설계 기술개발 현황과 향후의 발전 전망을 기술한다.

• Proceedings of the IEEK Conference
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• 2000.11b
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• pp.104-107
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• 2000

We designed and implemented the RFIC(RF front-end IC) for DTV(Digital TV) tuner. The DTV tuner RF front-end consists of low noise IF amplifier fur the amplification of 900 MHz RF signal and down conversion mixer for the RF signal to 44MHz IF conversion. The RFIC is implemented on ETRI 0.8u high resistive (2㎘ -cm) and evaluated by on wafer, packaged chip test. The gain and IIP3 of IF amplifier are 15㏈ and -6.6㏈m respectively. For the down conversion mixer gain and IIP3 are 13㏈ and -6.5㏈m. Operating voltage of the IF amplifier and the down mixer is 5V, current consumption are 13㎃ and 26㎃ respectively.

• Proceedings of the IEEK Conference
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• 2000.09a
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• pp.911-914
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• 2000

본 논문에서는 배터리가 없는 ASK 전송방식의 RFID(Radio Frequency IDentification) Transponder 칩 설계에 관한 내용을 다룬다. Transponder IC는 power-generation 회로, clock-generation 회로, digital block, modulator, overoltge protection 회로로 구성된다. 설계된 칩은 저전력 회로를 적용하여 원거리 transponder칩을 구현할 수 있도록 하였다. 설계된 회로는 0.25㎛ 표준 CMOS 공정으로 레이아웃하여 제작하였다.

• Journal of Korea Society of Industrial Information Systems
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• v.6 no.3
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• pp.123-127
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• 2001

The prediction method of the parameter C/sub gs/ of CMOS transistor is proposed by calculating the mobil charge in inversion layer of COMS transistor. This parameter C/sub gs/ decided on the cutoff frequency in MOS transistor in RF range and coupled input and output. This parameter C/sub gs/ in RF range is very important parameter in small signal circuit model. This proposed method is contributed to developing software of extracting parameter value in equivalent circuit model. The method provide the important information to construct a RF nonlinear model for multifinger gate MOSFET. This method will be very valuable to develop a large signal MOSFET model for nonlinear RF IC design.

• Proceedings of the IEEK Conference
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• 1999.06a
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• pp.393-396
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• 1999

A circuit model of silicon substrate coupling for CMOS RF-IC design is developed. Its characteristics are analyzed by using a simple RC mesh model in order to investigate substrate coupling. The coupling effects due to the substrate were characterized with substrate resistivity, oxide thickness, substrate thickness. and physical distance. Thereby the silicon substrate effects are analytically investigated and verified with simulation. The analysis and simulation of the model have excellent agreements with MEDICI(2D device simulator) simulation results.