• Title/Summary/Keyword: Pyrex glass

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The Experimental Study in the Micro Drilling of Excimer Laser on Pyrex Glass (엑시머 레이저를 이용한 파이렉스 유리의 미세 구멍 가공)

  • Lee, Chul-Jae;Kim, Ha-Na;Jeong, Yun-Sang;Jun, Chan-Bong;Park, Young-Chul;Kang, Jung-Ho
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.11 no.5
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    • pp.99-103
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    • 2012
  • Presently, A glass is widely used in telecommunication system, optoelectronic devices and micro electro mechanical systems. Micro drilling of glass using the laser can save processing cost and improve the accuracy. This paper experiments micro drilling using KrF excimer laser on the pyrex glass of $500{\mu}m$ thickness. We have experiment to find out optimum laser machining conditions of micro drilling of glass and ablation depth and influence by processing parameter suc'h pulse repetition rate, energy density and number of pulses. Pulse repetition rate don't influence ablation depth at the micro drilling of pyrex glass. Energy density influence micro drilling of parallelism and maximum thickness that can be drilled. Ablation depth is most influenced by number of pulses.

Fabrication of the Acceleration Sensor Body of Glass by Powder Blasting (미립분사가공을 이용한 유리 소재의 가속도 센서 구조물 성형)

  • Park, Dong-Sam;Kang, Dae-Kyu;Kim, Jeong-Keun
    • Journal of the Korean Society for Precision Engineering
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    • v.23 no.2 s.179
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    • pp.146-153
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    • 2006
  • Acceleration sensors have widely been used in the various fields of industry. In recent years, micromachining accelerometers have been developed and commercialized by the micromachining technique or MEMS technique. Typical structure of such sensors consist of a cantilever beam and a vibrating mass fabricated on Si wafers using etching. This study investigates the feasibility of powder blasting technique for microfabrication of sensor structures made of the pyrex glass alternating the existing Si based acceleration sensor. First, as preliminary experiment, effect of blasting pressure, mass flow rate of abrasive and no. of nozzle scanning on erosion depth of pyrex and soda lime glass is studied. Then the optimal blasting conditions are chosen for pyrex sensor. Structure dimensions of designed glass sensor are 2.9mm and 0.7mm for the cantilever beam length and width and 1.7mm for the side of square mass. Mask material is from aluminium sheet of 0.5mm in thickness. Machining results showed that tolerance errors of basic dimensions of glass sensor ranged from 3um in minimum to 20um in maximum. This results imply the powder blasting can be applied for micromachining of glass acceleration sensors alternating the exiting Si based sensors.

Fabrication of Glass Microlens using Thermal Reflow Methods (열처리에 의한 유리 마이크로 렌즈 제작)

  • Park, Kwang-Bum;Kim, Seon-Ju
    • Proceedings of the KIEE Conference
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    • 2003.07c
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    • pp.1920-1922
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    • 2003
  • We have fabricated the pyrex glass microlens using thermal reflow process. Fabricated microlens is the plano convex refractive type and was fabricated with pyrex glass-Si anodic bonding wafer. The etched circle or cylindrical pyrex glass pattern was melted in a furnace $800^{\circ}C$ to $900^{\circ}C$ for about 15min. The surface roughness of the microlenses was measured by the AFM and average surface roughness of the microlenses was below 15min. The radius of curvature of the microlens was measured with phase shift interferometer.

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Anodic bonding characteristics of MCA to Si-wafer using pyrex #7740 glass intermediatelayer for MEMS applications (파일렉스 #7740 글라스 매개층을 이용한 MEMS용 MCA와 Si기판의 양극접합 특성)

  • Ahn, Jung-Hac;Chung, Gwiy-Sang
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2006.06a
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    • pp.374-375
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    • 2006
  • This paper describes anodic bonding characteristics of MCA to Si-wafer using evaporated Pyrex #7740 glass thin-films for MEMS applications. Pyrex #7740 glass thin-films with the same properties were deposited on MCA under optimum RF sputter conditions (Ar 100 %, input power $1\;W/cm^2$). After annealing at $450^{\circ}C$ for 1 hr, the anodic bonding of MCA to Si-wafer was successfully performed at 600 V, $400^{\circ}C$ in $110^{-6}$ Torr vacuum condition. Then, the MCA/Si bonded interface and fabricated Si diaphragm deflection characteristics were analyzed through the actuation and simulation test. It is possible to control with accurate deflection of Si diaphragm according to its geometries and its maximum non-linearity being 0.05-0.08 %FS. Moreover, any damages or separation of MCNSi bonded interfaces did not occur during actuation test. Therefore, it is expected that anodic bonding technology of MCNSi-wafers could be usefully applied for the fabrication process of high-performance piezoelectric MEMS devices.

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Micromachining of a Pyrex Glass Using EDM Technique (전기방전가공 기술을 이용한 유리의 미세 가공)

  • Jung, O.C.;Yang, E.H.;Yang, S.S.
    • Proceedings of the KIEE Conference
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    • 1995.07c
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    • pp.1422-1424
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    • 1995
  • In this paper, a pyrex glass is machined using Electric Discharge Machining. In order to fabricate the desired shape, the process conditions are optimized appropriatley. This paper shows that the applied voltage and the concentration of electrolytic solution significantly affect the size and shape of the hole in the pyrex glass. As the applied voltage grows, the size of the hole increases but the shape is little affected.

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Observation of Growth Behavior of Induced Hillock for Nano/Micro Patterning on Surface of Borosilicate with Etching Time and Load (보로실리케이트 표면의 나노/마이크로 패터닝을 위한 식각 시간, 하중에 따른 유기 힐록의 성장거동 관찰)

  • Cho S. H.;Youn S. W.;Kang C. G.
    • Proceedings of the Korean Society for Technology of Plasticity Conference
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    • 2005.10a
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    • pp.182-185
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    • 2005
  • Indentation pattern and line pattern were machined on borosilicate(Pyrex 7740 glass) surface using the combination of mechanical machining by $Nanoi-indenter\circledR$ XP and HF wet etching, and a etch-mask effect of the affected layer of the nano-scratched and indented Pyrex 7740 glass surface was investigated. In this study, effects of indentation and scratch process with etching time on the morphologies of the indented and scratched surfaces after isotropic etching were investigated from an angle of deformation energies.

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Maskless Nano-fabrication by using both Nanoscratch and HF Wet Etching Technique (나노스크래치와 HF 에칭기술을 병용한 Pyrex 7740의 마스크리스 나노 가공)

  • 윤성원;이정우;강충길
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2003.06a
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    • pp.628-631
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    • 2003
  • This study describes a new mastless nano-fabrication technique of Pyrex 7740 glass using the combination of nanomachining by nano-indenter XP and HF wet etching. First, the surface of a Pyrex 7740 glass specimen was machined by using the nano-machining system, which utilizes the mechanism of the nano-indenter XP. Next, the specimen was etched by HF solution. After the etching process, the convex structure or deeper hole is made because of masking or promotion effect of the affected layer generated by nano-machining. On the basis of this interesting fact. some sample structures were fabricated.

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Anodic bonding Characteristics of MLCA to Si-wafer Using Evaporated Pyrex #7740 Glass Thin-Films for MEMS Applications (파이렉스 #7740 유리박막을 이용한 MEMS용 MLCA와 Si기판의 양극접합 특성)

  • Chung, Gwiy-Sang;Kim, Jae-Min;Yoon, Suk-Jin
    • Journal of Sensor Science and Technology
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    • v.12 no.6
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    • pp.265-272
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    • 2003
  • This paper describes anodic bonding characteristics of MLCA (Multi Layer Ceramic Actuator) to Si-wafer using evaporated Pyrex #7740 glass thin-films for MEMS applications. Pyrex #7740 glass thin-films with same properties were deposited on MLCA under optimum RF magneto conditions(Ar 100%, input power $1\;W/cm^2$). After annealing in $450^{\circ}C$ for 1 hr, the anodic bonding of MLCA and Si-wafer was successfully performed at 600 V, $400^{\circ}C$ in - 760 mmHg. Then, the MLCA/Si bonded interface and fabricated Si diaphragm deflection characteristics were analyzed through the actuation test. It is possible to control with accurate deflection of Si diaphragm according to its geometries and its maximum non-linearity is 0.05-0.08 %FS. Moreover, any damages or separation of MLCA/Si bonded interfaces do not occur during actuation test. Therefore, it is expected that anodic bonding technology of MLCA/Si wafers could be usefully applied for the fabrication process of high-performance piezoelectric MEMS devices.

Mechanical Characteristics of MLCA Anodic Bonded on Si wafers (실리콘기판위에 양극접합된 MLCA의 기계적 특성)

  • Kim, Jae-Min;Lee, Jong-Choon;Yoon, Suk-Jin;Chung, Gwiy-Sang
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2003.07a
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    • pp.160-163
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    • 2003
  • This paper describes on anodic bonding characteristics of MLCA(Multi Layer Ceramic Actuator) to Si-wafer using evaporated Pyrex #7740 glass thin-films for MEMS applications. Pyrex #7740 glass thin-films with same properties were deposited on MLCA under optimum RF magneto conditions(Ar 100 %, input power $1\;/cm^2$). After annealing in $450^{\circ}C$ for 1 hr, the anodic bonding of MLCA to Si-wafer was successfully performed at 600 V, $400^{\circ}C$ in - 760 mmHg. Then, the MLCA/Si bonded interface and fabricated Si diaphragm deflection characteristics were analyzed through the actuation test. It is possible to control with accurate deflection of Si diaphragm according to its geometries and its maximum non-linearity is 0.05-008 %FS. Moreover, any damages or separation of MICA/Si bonded interfaces do not occur during actuation test. Therefore, it is expected that anodic bonding technology of MICA/Si wafers could be usefully applied for the fabrication process of high-performance piezoelectric MEMS devices.

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