• Journal of the Korean institute of surface engineering
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• v.28 no.4
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• pp.243-254
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• 1995

The fabrication process of Cu-base anode for replacing Ni-base anode of molten carbonate fuel cell was investigated. Electrochemical performance and thermal stability of Cu-base anode were also investigated. Green sheet was prepared by mixing Cu and Ni powder with 1.5wt% methylcellulose and 100wt% water. The pore-size distribution of the Cu-base anode sintered at $800^{\circ}C$ for 30min showed almost uniform pore-size ranging from 4 to 20$\mu\textrm{m}$ and it was considered suitable for MCFC anode. Cu-Ni anode containing between 35 to 50wt% Ni exhibited current density of 111mA/$\textrm{cm}^2$ at 100mV overpotential and it was almost the some value for pure Ni anode. The sintering resistance of Cu-Ni increased with an increase of Ni addition. It was considered that the increase of sintering resistance was due to the decrease of diffusion rate of Cu and Ni with increasing the addition of Ni in Cu-Ni alloy.

• Proceedings of the KIEE Conference
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• 2001.07c
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• pp.1399-1401
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• 2001

We studied on structure and resistivity, temperature coefficient of resistance (TCR) of NiCr and NiCr-N thin resistor films prepared by do reactive magnetron sputtering of NiCr target. It is found that while pure NiCr films are polycrystalline, an addition of nitrogen (N2/(Ar+N2) ratios are between 10% and 70%) into the film is changed into amorphous structure and sheet resistance of films is increased. Measurement temperatures of TCR are ratios of $5^{\circ}C$ per 15min from $25^{\circ}C$ to $130^{\circ}C$. TCR for an as-deposited NiCr-N thin film is varied from positive to negative.

• 연구논문집
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• s.33
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• pp.183-190
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• 2003

Today, We have used many electronic equipment such as computer, TV, cellular phone and so on. These equipment radiate a large amount of EMI(Electromagnetic interference) which is occurred trouble of airplane, medical equipment, communicate equipment, and especially, human health. So, Ni mesh fabrication for EMI shielding by continuous electroforming process was investigated. Continuous electroforming apparatus was made by means of rotating cathode drum. And We investigated the characteristics of two types of Ni electroforming solution. One was made by laboratory and the other was produced by M cooperation. The grain size increased with increasing current density and bath temperature, and decreasing rotating speed of cathode drum. EDX results indicate that the Ni mesh electroformed by the KIMM solution is composed of pure Ni. But the Ni mesh electroformed by the M cooperation solution has Ni and S element. The incorporation of S element in the Ni mesh has a profoundly effect on mechanical properties such as hardness, internal stress and so on.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2001.11a
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• pp.10-10
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• 2001

In this paper, initial depositing process of electroless Ni-Cu-P alloy was investigated by means of SEM, TEM and AES. The results show that the initial deposition is inhomogeneous and there exist different transition layers between different coatings and substrates, which are decided by the structures and compositions of the bath. For Ni-P binary alloy, its deposition takes place superiorly at grain boundary and on some grains with beneficial texture, the thickness of transition layer composed of Ni-Fe-P reaches 2000 angstrom. But during initiation of Ni-Cu-P trinary alloy, only at grain boundary is prIor to be deposited electrolessly, transited layer contains Ni-Fe-Cu-P and is decreased to about 500 angstrom. The structures of the films of Ni-P and Ni-Cu-P are crystalline at the initial depositing stage. The mechanisms of the process are put forward in this paper.

• Analytical Science and Technology
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• v.11 no.3
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• pp.202-205
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• 1998

X-ray absorption fine structure spectroscopic studies at the Ni K-edge have been performed for the Ni-Zn alloy coating layer on steel. The Ni-Zn interatomic distances and Debye-Waller factors were determined by fitting the experimental data with the theoretical spectra in the temperature range of 80 to 300K. The average Ni-Zn interatomic distance was found to be $2.557{\AA}$ and the variation of the Ni-Zn interatomic distance with temperature in this range was insignificant. From the comparison of the Ni-Zn interatomic distance with the nearest neighbor distance of pure Zn lattice it has been suggested that there is an apparent contraction around Ni atom.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1999.05a
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• pp.708-711
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• 1999

The Cu/Ni/Au lamellar structure is extensively used as an under bump metallization on silicon file, and on printed circuit board(PCB) pads. Ni is plated Cu by either electroless Ni plating, or electrolytic Ni plating. Unlike the electrolytic Ni plating, the electroless Ni plating does not deposit pure Ni, but a mixture of Ni and phosphorous, because hypophosphite Is used in the chemical reaction for reducing Ni ions. The fracture crack extended at the interface between solder balls of plastic ball grid (PBGA) package and conducting pads of PCB. The fracture is duets to segregation at the interface between Ni$_3$Sn$_4$intermetallic and Ni-P layer. The XPS diffraction results of Cu/Ni/Au results of CU/Ni/AU finishs showed that the Ni was amorphous with supersaturated P. The XPS and EDXA results of the fracture surface indicated that both of the fracture occurred on the transition lesion where Sn, P and Ni concentrations changed.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2006.09b
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• pp.883-884
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• 2006

A new extra-fine grade Ni powder (XF Ni) has demonstrated increased sintering activity in Co-Fe-Ni binders for diamond tool applications. XF Ni has the advantage of significantly lower cost than XF Co. Up to 30% of XF Co was substituted with XF Ni while maintaining comparable apparent hardness and transverse rupture strength to pure Co binders. Ni substantially increased the diffusion of Fe. Diamond tool producers can take advantage of the improved sintering properties of XF Ni powder to substantially lower material costs.

• Journal of Electrochemical Science and Technology
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• v.4 no.1
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• pp.19-26
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• 2013

Graphene/Ni-Al layered double hydroxide (LDH) hybrid materials were synthesized by a hydrothermal reaction. Hexagonal Ni-Al LDH particles nucleated and grew on graphene sheets, thus preventing restacking of the graphene sheets and aggregation of the Ni-Al LDH nanoparticles upon drying. Electrode made from the graphene/Ni-Al LDH hybrid materials showed a substantial improvement in electrochemical capacitance relative to those made with pure Ni-Al LDH nanoparticles. In addition, the graphene/Ni-Al LDH hybrid composite materials showed remarkable stability after 4000 cycles with over 100% capacitance retention. These materials are thus very promising for use in electrochemical capacitor electrodes.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.23 no.9
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• pp.736-740
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• 2010

Nickel wires of 0.8 mm in diameter and 80 mm in length were electrically exploded in liquid media such as water, ethyl alcohol. The distribution of particle sizes was broad from a few micrometers to tens of nanometer. It was identified that the particles could be classified according to its sizes by using centrifugal separator. The powder prepared in distilled water showed mainly pure metallic Ni phase although a little oxide phase was observed. The powders prepared in ethyl alcohol showed complicated unknown phases, which is attributed to the compound of carbon in the organic liquid. This unknown phase was turned to pure metallic Ni phase after heat treatment.

• Journal of the Korean institute of surface engineering
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• v.49 no.6
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• pp.507-512
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• 2016

Expensive silver powder is used to form electrodes in most IT equipment, and recently, many attempts have been made to lower manufacturing costs by developing powders with Ag-Ni or Ag-Cu core-shell structures. This study examined the sintering behavior of Ag-Ni electrode powder with a core-shell structure for silicon solar cell with high energy efficiency. The electrode powder was found to have a surface similar to pure Ag powder, and cross-sectional analysis revealed that Ag was uniformly coated on Ni powder. Each electrode was formed by sintering in the range of $500^{\circ}C$ to $800^{\circ}C$, and the specimen sintered at $600^{\circ}C$ had the lowest sheet resistance of $5.5m{\Omega}/{\Box}$, which is about two times greater than that of pure Ag. The microstructures of electrodes formed at varying sintering temperatures were examined to determine why sheet resistance showed a minimum value at $600^{\circ}C$. The electrode formed at $600^{\circ}C$ had the best Ag connectivity, and thus provided a better path for the flow of electrons.