• 소성∙가공
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• 제12권6호
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• pp.582-587
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• 2003

This paper is concerned with the mechanical property changes of the milli-size products manufactured by forward extrusion processes with square dies. Experiments are carried out with pure aluminum and pure copper billets. Extrusion ratio and knock-out pad are chosen as the important process parameters affecting the changes of mechanical properties such as shear strength and hardness. Shear strength tests with the extruded milli-size pin have shown the strong relation between victors hardness and shear strength in the neck of a stepped pin. As the extrusion ratio increases, the hardness on both the surface and the center line of a pin also increase. It is also noted that the hardness on the surface is a little higher than that on the center. The existence of knock-out pad in extrusion die causes the hardness in the neck of a extruded pin to increase. Finally, the approximated linear relations between shear strength and hardness of a pin are suggested.

• Bulletin of the Korean Chemical Society
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• 제9권2호
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• pp.98-101
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• 1988

A pure columnar cholesterogen based on the octasubstituted phthalocyanine $(PcH_2)$, S-(+)-2, 3, 9, 10, 16, 17, 23, 24-octakis[5-(dodecyloxy)-2-oxa-pentyl]-phthalocy anine(1a), is described. To evaluate a cholesteric character of 1a, the corresponding achiral $PcH_2$ 1b and the copper complex of chiral $PcH_2$ 1a (CuPc), S-(+)-2,3,9,10,16,17,23,24-octakis[4-(dodecyloxy)- 2-oxapentyl]-phthalocyanine(2a) were also prepared. The chiral 1a exhibited a typical cholesteric texture change in which the transition of platelet (blue phase) to fan-shape texture was observed (K－M－I), whereas the corresponding achiral 1b showed only a focal conic texture (K－ M－I). This is the first instance of a pure columnar cholesterogen observed with discotic liquid crystal systems.

• 한국분무공학회지
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• 제29권3호
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• pp.134-139
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• 2024

An experimental study was conducted on the film boiling of nanofluid droplets at a surface temperature range of 300 to 500℃. The nanofluid was made by mixing pure water with copper oxide powder of diameter of 80 nm. The initial volume of the nanofluid droplet ranged from about 21 to 44 ㎕, and the volume, base diameter, and time were measured during the evaporation process. It was found that nanofluid droplets evaporate faster as the surface temperature increases. Also experimental results showed the droplets evaporate quickly at the beginning of evaporation, but as the volume of the droplets decreases, the evaporation rate gradually slows down, and this trend becomes stronger as the surface temperature increases. In addition, the evaporation rate of nanofluid droplets was slightly faster than that of pure water droplets, this was believed to be because the contact area of nanofluid droplets increased.

• Advances in nano research
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• 제2권2호
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• pp.77-88
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• 2014

Solvothermal treatment of late transition metal acetylacetonates in a novel medium composed either of pure acetophenone or acetophenone mixtures with amino alcohols offers a general approach to uniform hydrophilic metal nanoparticles with high crystallinity and low degree of aggregation. Both pure metal and mixed-metal particles can be accesses by this approach. The produced materials have been characterized by SEM-EDS, TEM, FTIR in the solid state and by Nanoparticle Tracking Analysis in solutions. The chemical mechanisms of the reactions producing nanoparticles has been followed by NMR. Carrying out the process in pure acetophenone produces palladium metal, copper metal with minor impurity of $Cu_2O$, and NiO. The synthesis starting from the mixtures of Pd and Ni acetylacetonates with up to 20 mol% of Pd, renders in minor yield the palladium-based metal alloy along with nickel oxide as the major phase. Even the synthesis starting from a mixed solution of $Cu(acac)_2$ and $Ni(acac)_2$ produces oxides as major products. The situation is improved when aminoalcohols such as 2-aminoethanol or 2-dimethylamino propanol are added to the synthesis medium. The particles in this case contain metallic elements and pairs of individual metals (not metal alloys) when produced from mixed precursor solutions in this case.

• 소성∙가공
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• 제31권4호
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• pp.240-245
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• 2022

In this study, to achieve good electrical conductivity of a charging terminal component in electric vehicles, we investigated the microstructure evolution of pure-Cu subjected to metal injection molding by controlling the sintering variables, such as temperature and time. Thus, three samples were sintered at temperatures ranging from 1000 ℃ to 1050 ℃ near to the melting temperature of 1085 ℃ for 1 and 10 h after thermal evaporation of binder at 730 ℃. Both procedures were made using a unified furnace under Ar+H₂ gas with high purity. The structural observation displayed that the grain size as well as the compactness (a reciprocal of porosity) increased simultaneously as temperature and time increased. This gave rise to high thermal conductivity of 90% IACS together with high density, which was mainly attributed to decrease in fractions of grain boundaries and micro-pores working as effective scattering center for electron movement.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2012년도 제42회 동계 정기 학술대회 초록집
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• pp.377-377
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• 2012

Microprocessor technology now relies on copper for most of its electrical interconnections. Because of the high diffusivity of copper, Atomic layer deposition (ALD) $TaN_x$ is used as a diffusion barrier to prevent copper diffusion into the Si or $SiO_2$. Another problem with copper is that it has weak adhesion to most materials. Strong adhesion to copper is an essential characteristic for the new barrier layer because copper films prepared by electroplating peel off easily in the damascene process. Thus adhesion-enhancing layer of cobalt is placed between the $TaN_x$ and the copper. Because, cobalt has strong adhesion to the copper layer and possible seedless electro-plating of copper. Until now, metal film has generally been deposited by physical vapor deposition. However, one draw-back of this method is poor step coverage in applications of ultralarge-scale integration metallization technology. Metal organic chemical vapor deposition (MOCVD) is a good approach to address this problem. In addition, the MOCVD method has several advantages, such as conformal coverage, uniform deposition over large substrate areas and less substrate damage. For this reasons, cobalt films have been studied using MOCVD and various metal-organic precursors. In this study, we used $C_{12}H_{10}O_6(Co)_2$ (dicobalt hexacarbonyl tert-butylacetylene, CCTBA) as a cobalt precursor because of its high vapor pressure and volatility, a liquid state and its excellent thermal stability under normal conditions. Furthermore, the cobalt film was also deposited at various $H_2/NH_3$ gas ratio(1, 1:1,2,6,8) producing pure cobalt thin films with excellent conformality. Compared to MOCVD cobalt using $H_2$ gas as a reactant, the cobalt thin film deposited by MOCVD using $H_2$ with $NH_3$ showed a low roughness, a low resistivity, and a low carbon impurity. It was found that Co/$TaN_x$ film can achieve a low resistivity of $90{\mu}{\Omega}-cm$, a low root-mean-square roughness of 0.97 nm at a growth temperature of $150^{\circ}C$ and a low carbon impurity of 4~6% carbon concentration.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2006년도 6th International Meeting on Information Display
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• pp.1739-1743
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• 2006

Recent advances in the microstructural modification of metal films using excimer laser projection irradiation and lateral resolidification are discussed. Pure copper films have been directionally resolidified into large sheet-like grains when properly encapsulated for suppression of liquid-phase dewetting. A survey and quantitative assessment of the defects found in these icrostructures, typical for rapidly solidified metals, is presented.

• Bulletin of the Korean Chemical Society
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• 제35권7호
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• pp.1989-1995
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• 2014

The small library of new enantiomerically pure (S,S)-diamino alcohols 1 and their hydroxyldiamide precursors 2 were conveniently synthesized on a gram scale from inexpensive and commercially chiral pool amino acids. The catalytic and induced asymmetric effects of the chiral ligands 1 in the asymmetric allylic oxidation of cycloolefins were investigated.

• 대한기계학회논문집
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• 제15권2호
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• pp.424-435
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• 1991

To develop the photoelastic experiment method for the orthotropic material under pure torsional moment is the main objective of this research. In the development of photoelastic experiment for orthotropic material under pure torsional moment, the important problems and their solutions are the same as following. In the model material for photoelastic experiment, it was found that C.F.E.C.(Copper Fiber Epoxy Composite) can be used as the model material of photoelastic experiment for orthotropic material. In the stress freezing cycle, it was assured that stress freezing cycle for epoxy can be used as the stress freezing cycle of the photoelastic experiment for orthotropic material. In the slicing method, it was found that the negative oblique slicing method can be effectively used as slicing method in 3-dimensional photoelastic experiment. In the measuring method of stress fringe values and physical properties in the high temperature, it was found that stress fringe values can be directly measured by experiment and physical properties can be directly or indirectly by equation between stress fringe values and physical properties developed by author. In the stress analysis method of orthotropic material under pure torsional moment by photoelastic experiment, it will be studied in the second paper.

• 한국복합재료학회:학술대회논문집
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• 한국복합재료학회 2003년도 추계학술발표대회 논문집
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• pp.46-49
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• 2003

Cu have been widely used as signal transmission materials for electrical electronic components owing to its high electrical conductivity. However, it's size have been limited to small ones due to its poor mechanical properties, Until now, strengthening of the copper at toy was obtained either by the solid solution and precipitation hardening by adding alloy elements or the work hardening by deformation process. Adding the at toy elements lead to reduction of electrical conductivity. In this aspect, if carbon nanofiber is used as reinforcement which have outstanding mechanical strength and electric conductivity, it is possible to develope Cu matrix nanocomposite having almost no loss of electric conductivity. It is expected to be innovative in electric conduct ing material market. The unidirectional alignment of carbon nanofiber is the most challenging task developing the copper matrix composites of high strength and electric conductivity In this study, the unidirectional alignment of carbon nanofibers which is used reinforced material are controlled by drawing process in order to manufacture the intermediary materials for the carbon nanofiber reinforced Cu matrix nanocomposite and align mechanism as well as optimized drawing process parameters are verified via experiments and numerical analysis. The materials used in this study were pure copper and the nanofibers of 150nm in diameter and of $10~20\mu\textrm{m}$ In length. The materials have been tested and the tensile strength was 75MPa with the elongation of 44% for the copper it is assumed that carbon nanofiber behave like porous elasto-plastic materials. Compaction test was conducted to obtain constitutive properties of carbon nanofiber. Optimal parameter for drawing process was obtained by experiments and numerical analysis considering the various drawing angles, reduction areas, friction coefficient, etc Lower reduction areas provides the less rupture of cu tube is not iced during the drawing process. Optimal die angle was between 5 degree and 12 degree. Relative density of carbon nanofiber embedded in the copper tube is higher as drawing diameter decrease and compressive residual stress is occurred in the copper tube. Carbon nanofibers are moved to the reverse drawing direct ion via shear force caused by deformation of the copper tube and alined to the drawing direction.