• 한국지반공학회:학술대회논문집
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• 한국지반공학회 1998년도 가을 학술발표회 논문집
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• pp.217-224
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• 1998

• 한국공작기계학회논문집
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• 제16권5호
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• pp.166-171
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• 2007

In this paper Research development about a micro metal forming manufacturing system has been developed. A micro forming system has been achieved in Japan and it's developed micro press is limited to single forming process. To coincide with the purpose to be more practical, research and development is necessary about the press which the multi forming process is possible. We set the development of the equipment including micro deep drawing, micro punching and micro restriking process to the goal. To achieve this goal, we set the application product to a micro thin foil valve which is used in the micro pump module. The compound die set has been designed and manufactured to make two step process. The material of thin foil valve is SUS-304 and its thickness is 50$\mu$m. We can get a good forming results from micro punching experiments in this paper.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2002년도 금형가공 심포지엄
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• pp.285-291
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• 2002

The shearing process for the sheet metal is normally used in the precision elements such as a frame of TFT-LCD or lead frame of If chips. In these precision elements, the burr formation prevents the system assembly and needs the additional burr removing process. In this paper, we developed the small size NC punching system which has an aligning kinematics between the rectangular shaped punch and die. The punch is driven by an ai cylinder and the sheet metal is moving on the X-Y table system which is driven by two stewing motors. The microprocessor control the whole system and communicate with the monitoring PC by RS232C serial communication protocol. The graphic user interface program in PC monitors nil control the punching system. The cross shaped joint hinge supports the punching die and positioned by two differential screws, whose are installed in perpendicular directions. The aligning between the punch and die is performed using the sheets of half thickness(0.1mm Brass) of the real process for the frame of the TFT-LCD. Using half thickness Brass, the burr formation is magnified and we can decide the aligning direction more easily then using the real thickness(0.2mm) Aluminum. In this paper, the aligning results are measured manually using the SEM photographs and we hope to make the automated aligning procedures using some kinds of image processing techniques.

• 한국정밀공학회지
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• 제22권2호
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• pp.126-132
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• 2005

In this paper, an auto-design system is introduced for a stamping tool based on commercial computer aided design system with its drafting language. The auto-design system consists of tool oriented product design subsystem which modifies and configures the product drawing, tool concept design subsystem which make a design of the punches and their punching progression and parts design subsystem that makes automatic dimension. The system is applied to the mechanical design of the stamping tool. The main logic of the system is based on half-edge theory, a kernel for the 3 dimensional CAD system, which is applied to 2 dimensional drafting auto-design system. The auto-design system enables to conspicuously reducing the designing time of the tool. In addition, there is little drafting error that had been about 3% without auto design program. It is effective to reduce the development time for new products because of rapid designing time of the tools, standardization of the stamping tool and the drafting rule for the auto-design system. The auto-design system yields high efficiency of the tool manufacturing system.

• 한국정밀공학회지
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• 제17권12호
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• pp.145-150
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• 2000

Micro punching is one of general methods to fabricate simple holes such as permanent ink-jet printer nozzles. A thin punch, that is need for micro punching, usually has been obtained by mechanical machining. There are some method to obtain a thin punch from a cylindrical rod, e.g., microgrinding and WEDG (Wire Electro-Discharge Grinding). Inefficiently, only one punch can be obtained from these machining methods. In contrast with these methods, many punches can be fabricated simultaneously by electrochemical process. Electrochemical process has usually aimed to obtain very sharp probe for atomic force microscopy (AFM) or scanning tunneling microscopy (STM), and it has not been considered the whole shape of a probe in spite of good merits. In this paper, an ultrathin punch with a tapered shape and a cylindrical tip is newly fabricated by electrochemical process.

• 한국강구조학회 논문집
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• 제24권4호
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• pp.423-433
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• 2012

본 논문은 전단머리를 갖는 CFT기둥-RC 무량판 접합부에 대한 실물대 실험연구를 요약한 것이다. CFT구조는 여러 가지 구조 및 시공 상의 장점으로 인하여 국내 건설현장에서 상대적으로 짧은 시간에 폭넓게 수용되고 있다. 한편 RC 무량판 구조는 층고절감 및 공기 단축 측면의 장점으로 국내의 지하주차장이나 주거용 건물에 필수적 구조시스템으로 널리 사용되고 있다. 이 두 구조시스템을 조합함으로써 공사기간의 획기적 단축 등 여러 시공 및 구조상의 이점을 극대화할 수 있을 것으로 예상된다. 그러나 CFT기둥-RC 무량판 접합부의 효율적인 디테일은 국내 외적으로 아직 충분히 연구된 바가 없어서 이 분야의 연구가 매우 필요한 실정이다. CFT기둥-RC 무량판 접합부의 구조성능에 영향을 미칠 수 있는 여러 가지 변수를 고려하여 접합상세를 제안하고 실험을 통하여 검증하였다. 실험결과 본 연구에서 제시된 CFT기둥-RC 무량판 접합상세의 펀칭강도는 ACI에서 규정한 RC 무량판 펀칭강도와 동등하거나 상회하는 것을 확인할 수 있었다. 실험결과를 토대로 CFT기둥-RC 무량판의 펀칭전단강도 예측식을 제안하였다.

• 한국구조물진단유지관리공학회 논문집
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• 제25권5호
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• pp.182-189
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• 2021

VPS는 중공재의 형상을 최적화 하고 중공재의 부상 및 작업하에 의한 이탈을 방지하는 기능을 가진 기존 중공슬래브공법이다. 본 연구에서는 기존연구에서 제안한 거푸집 패널이 부착된 중공슬래브(VPS)를 활용하여 플랫 플레이트의 뚫림전단 안전성을 검토하였다. 실험 결과, 가력점으로 부터 기둥 폭의 2.0배를 넘어 중공재를 배치한 VSPS 실험체는 기준 실험체에 대비 내력이 9.4%감소하였다. KBC2016에서 제시한 설계 값의 약 1.57배 이상의 강도 값을 나타내었다. 중공재를 배치한 VSPS 실험체가 전단파괴가 발생하기 전까지 기준 실험체 대비 강성의 변화는 없는 것으로 나타났다. 이는 휨 철근을 충분하게 배근하여 본 실험이 전단에 의해 파괴되고 있음을 알 수 있다.

• 한국정보통신학회:학술대회논문집
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• 한국정보통신학회 2016년도 추계학술대회
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• pp.576-578
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• 2016

사물 인터넷이 발달하면서 다양한 스마트 홈 IoT 디바이스와 서비스가 제공되고 있다. 스마트 홈 IoT 서비스의 핵심은 사용자가 인터넷 통신을 통해 디바이스를 제어하는 것이다. IoT 디바이스들의 통신은 대부분 사설 네트워크 내에서 IP를 가지기 때문에 외부의 네트워크에서 접근하여 제어하는 원격제어에 어려움이 있다. 원격 제어를 위한 방법 중 하나로 서로의 IP를 파악해 통신을 하는 UDP 홀 펀칭이 있다. UDP 홀 펀칭은 100%에 가까운 데이터 통신 성공률을 보장하기 위해 경우에 따라 3단계 과정을 거쳐야한다. 본 논문은 UDP 홀 펀칭을 이용한 IoT 디바이스 원격제어에서 불필요한 단계를 생략시키기 위해 CEP 기반으로 원격 제어 정책을 관리하는 시스템을 제안한다.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2003년도 추계학술대회논문집
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• pp.107-110
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• 2003

The sheet metal shearing process is normally used in the precision elements such as semi-conductor components. In precision elements, burrs usually reduce the quality of machined parts and cause interference, jamming and misalignment during assembly procedures and because of their sharpness, they can be safety hazard to personnel. Furthermore, not only burrs are hard to predict and avoid, but also deburring, the process of removing burrs, is time-consuming and costly. In order to get the burr-free parts, therefore, we developed the precise burr measuring system using the laser. Using the X-Y precious table, we used vertical measuring method. Through the laser measurement system, we gain the minute analog signal, so this signal was amplified by the electric circuit. Finally, we gained the realtime burr data using A/D converter, PC. By introducing the novel laser measuring method which employing vertical measurement mechanism, we could get fast and precious burr data. Through the experiments, the accuracy of the developed system is proved. The burr height measured during the punching process can be used for automatic deburring and in-situ aligning.

• 한국정밀공학회지
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• 제20권7호
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• pp.114-119
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• 2003

The aligning between the punch and die governs no only the burr formation characteristics but also the life time of the punch and die in the sheet metal blanking process. There are many ways to adjust the two elements in the general punching systems but in the case of micro punch system, the punch size is reduced to a few tenth of micrometer range and the general aligning methods are almost impossible to apply. The image processing is the most widely used method in micro punch aligning, but in order to apply the method, it needs quite a large space for visionary system to approach the punch-die aligning zone. In this paper, the new punch-die aligning method with using the total capacitance between the punch and die hole is proposed. In this method, the tip surface of the punch tool locates at the same plane of the die surface and the capacitance variation between the two elements are measured. When the center of the two elements are coincided, the capacitance is minimized, but when the align is changed to any direction, the capacitance between the two elements increase. In order to verify the feasibility of this method, the aligning and punching tests was performed.