• 제목/요약/키워드: Pulse welding

검색결과 197건 처리시간 0.022초

초정밀 레이저용접을 이용한 티타늄 안경테 제조 (Manufacturing Ti-Alloy Frames of Classes with High-Precision Laser Beam Welding)

  • 황용화;김수성;이형권;민덕기;고진현
    • 한국산학기술학회논문지
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    • 제1권2호
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    • pp.1-8
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    • 2000
  • 본 연구에서는 상용 순수 티타늄 소재를 사용하여 안경테를 레이저 빔 용접으로 제조하기 위하여 광섬유로 전송되는 가변 펄스곡 80 ㎲-10 ms. 최대 평균출력 200 W, 첨두출력 12 kW와 최대 펄스에너지 50J성능의 초정밀 Nd:YAG 레이저 용접장치를 설계 제작하고 이 장치를 사용하여 안경테 제조를 위한 최적 용접조건을 선정하기 위한 실험을 수행하였다. 안경테를 위한 T이음 및 맞대기 이음형상을 용접할 때 평균출력, 광섬유 형태, 초점위치 등에서 용입상태와 용접결함을 조사하여 최적 용접조건을 선정하였고 안경테 부품 장석(temple hinge)과 다리, 톱바를 레이저 용접으로 시제품을 제작하였다.

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$CO_2$ 용접에서 스패터 발생에 미치는 지연시간 제어의 영향 (Effect of Delay Time Control on the Spatter Generation in $CO_2$ Welding)

  • 이창한;김희진;강봉용
    • Journal of Welding and Joining
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    • 제17권5호
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    • pp.61-68
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    • 1999
  • For the last two decades, waveform control techniques have been successively developed and applied for the inverter welding machines resulting in the substantial reduction of spatter generated in CO₂ welding. One of the constituents commonly involved in those techniques is to delay the instant of current increase to some extent after the initiation of short-circuiting. Although this technique has been known to be quite effective in reducing the spatter generation through the suppression of is instantaneous short circuiting, the delay time necessary for minimum spatter has not been clearly understood. In this study, the control system for varying the delay time was constructed so that the spatter generation rates could be measured over a wide range of delay time, 0.29-2.0 msec. As a result of this study, it was demonstrated that spatter generation rate(SGR) sharply decreased at delay time of 0.6 msec and longer accompanied with the change in characteristics of short circuit mode from the instantaneous short-circuiting(ISC) dominant to normal short-circuiting(NSC) dominant. Another feature that have been found in current waveform of over 0.6msec was the creation of current pulse right after the arc reignition stage. Because of this current pulses weld pool oscillated in wave-like fashion and it looks like to play an important role in developing short circuiting between electrode and weld pool.

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유도가열기용 직.병렬 공진 고주파 인버터의 설계 (Design of High Frequency Inverter with Series-parallel Load-Resonant for Induction Heating application)

  • 홍순일;손의식
    • 조명전기설비학회논문지
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    • 제14권6호
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    • pp.12-17
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    • 2000
  • IN induction heating system the high frequency operation allows a rapid response to current fluctuation in the inverter and result in improved welding quality. To work induction heating of nonferrous metals, a welding power supply is need high working frequency and high power. This paper is shown design technique for increasing working frequency in induction heating for welding coppers. A series-parallel resonate inverter consists of H-type bridges, each of whose arms is composed of a combination of two parallel IGBTs. Inverter operating with the fixed frequency is controlled by pulse width modulation (PWM). As switching adapted the Zero-Voltage Switching technique to reduce switching losses the system is high efficiency. The propose inverter has feature which is high efficiency for very wide load variations with a narrow range of duty cycle ratio control and load short circuit capability. Detailed experimental results obtained from a 48[V] output, 500[W] experimental inverter are presented to verify the concept.

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리튬이온전지의 전해액 주입구 볼에 대한 Nd:YAG 레이저 용접성 (The Weldability of Aluminum Ball in Electrolyte Injection Hole by Nd:YAG Laser)

  • 김종도;유승조;김장수
    • Journal of Advanced Marine Engineering and Technology
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    • 제30권6호
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    • pp.740-745
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    • 2006
  • This study suggested the occurrence source of weld-defects and its solution methods in a welding of Electrolyte injection hole by pulsed Nd:YAG laser. In experiment, the ramp down was used in order that solidification crack was removed. Furthermore. shrinkage stress and heat input were reduced by changing of weld trajectory and defocused distance. As a results of a experiment, a sound weld bead shape and crack-free weld bead can be obtained. In conclusion this show that the welding stability is greatly affected by modulation of laser pulse shape for the same laser energy and welding parameters.

힘-변위 모델을 이용한 펄스 GMAW의 해석 (Analysis of Pulsed GMAW Using Force-Displacement Model)

  • ;이재학;유중돈
    • Journal of Welding and Joining
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    • 제27권1호
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    • pp.59-64
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    • 2009
  • In order to determine the One-Drop One-Pulse(ODOP) condition of the pulsed gas metal arc(GMA) welding, the drop detaching phenomenon during the peak time is investigated using the force-displacement model. The drop detaching criterion is established based on the displacement of the pendant drop, and the forces exerted on the drop are calculated using the Modified Force Balance Model(MFBM). The effects of wire melting on the drop size and force are included in the force-displacement model. While the peak current has most significant effects on the drop detaching time, the initial drop mass prior to the peak time also influences drop transfer. The calculated results show good agreements with the experimental data, which implies that the ODOP condition can be predicted using the force-displacement method.

레이저 용접조건에 따른 증발된 합금원소의 조성과 구조의 변화 (Chemical Compositio and Structure of Evaporated Alloying Element by Laser Welding Condition)

  • 조상명
    • Journal of Advanced Marine Engineering and Technology
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    • 제23권4호
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    • pp.523-532
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    • 1999
  • This study is aimed to obtain fundamental knowledge of pulse laser welding phenomena the authors investigated the structure and composition of evaporated particles of Al alloys in air and in the Ar atmosphere during pulsed laser welding. The ultra-fine particles of 5 to 100nm diameter in a globular or irregular shape were formed in laser-induced plasma and the main structure was $MgAl_2O_4$ The composition of particles was ifferent depending on the power density of a laser beam; namely under the low power density conditions magnesium was predominant in the parti-cles while aluminium content increased with an increase in the power density. These results were attributed to evaporation phenomena of metals with different boiling points and latent heats of vaporization. On the other hand the number density of laser-induced plasma species was obtained by Saha's equation. it was confirmed that the number density depends upon the plasma tempera-ture and total pressures.

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TIG용접에서 가스력을 이용한 비드형상제어를 위한 실드가스 노즐의 최적 형상에 관한 연구 (II) - 벤투리 노즐의 위보기 자세 용융금속제어 효과 - (A Study on Optimum Shape of Shield Gas Nozzle for Bead Shape Control in TIG Welding using Gas Force (II) - Effect of Molten Metal Control by Venturi Nozzle in Overhead Position -)

  • 함효식;서지석;최윤환;이연원;조상명
    • Journal of Welding and Joining
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    • 제29권3호
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    • pp.58-63
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    • 2011
  • Bead shape control with gas force process has been developed to overcome the concave back bead in pipe orbital welding. However, It is impossible to make a convex back bead using the existing gas nozzle, because it has high gas-consuming and low gas force. The purpose of this paper, to develop optimum shape of nozzle which to reduce the consumption of gas, maximizing the shield gas force with low cost and high productivity coincide the Green welding. In this paper venturi-type nozzle was compared with existing CP-type nozzle by TIG pulse welding in overhead position. As a result, CP-type occurs the wormholes in the overhead position, but the Venturi-type without the pore and formed a good bead appearance.

Cu 전해도금을 이용한 TSV 충전 기술 (TSV Filling Technology using Cu Electrodeposition)

  • 기세호;신지오;정일호;김원중;정재필
    • Journal of Welding and Joining
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    • 제32권3호
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    • pp.11-18
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    • 2014
  • TSV(through silicon via) filling technology is making a hole in Si wafer and electrically connecting technique between front and back of Si die by filling with conductive metal. This technology allows that a three-dimensionally connected Si die can make without a large number of wire-bonding. These TSV technologies require various engineering skills such as forming a via hole, forming a functional thin film, filling a conductive metal, polishing a wafer, chip stacking and TSV reliability analysis. This paper addresses the TSV filling using Cu electrodeposition. The impact of plating conditions with additives and current density on electrodeposition will be considered. There are additives such as accelerator, inhibitor, leveler, etc. suitably controlling the amount of the additive is important. Also, in order to fill conductive material in whole TSV hole, current wave forms such as PR(pulse reverse), PPR(periodic pulse reverse) are used. This study about semiconductor packaging will be able to contribute to the commercialization of 3D TSV technology.