• 한국재료학회지
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• 제15권6호
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• pp.375-381
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• 2005

High temperature oxidation behavior of thermal barrier coating (TBC) system (IN738 substrate + NiCoCrAlY or NiAl bond coat with or without Pt + yttria stabilized zirconia) prepared by air plasma spray (APS) process has been studied in order to understand the effect of Pt addition to bond coat on the stability of TBC system. Specimens were oxidized in thermal cycling and isothermal oxidation test at $1100^{\circ}C$. The Pt addition in TBC system with NiCoCrAlY bond coat showed a longer life time compared to that without addition of Pt. Pt addition to TBC system is believed to help the formation of more stable thermally grown oxide, $Al_2O_3$, at the TBC/bond coat interface, leading to a longer lifetime of TBC system.

• 한국자기학회:학술대회 개요집
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• 한국자기학회 2011년도 자성 및 자성재료 국제학술대회
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• pp.14-14
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• 2011

Limited understanding of the surface properties of $Pt_3Ni$ for the oxygen reduction reaction (ORR) in polymer electrolyte membrane fuel cell (PEMFC) has motivated the study of magnetic properties and electronic structures of Pt segregated $Pt_3Ni$ (111) surface during adsorption of oxygen molecule on it. The first principle method based on density functional theory (DFT) is carried out. Nonmagnetic Pt has induced magnetic moment due to strong hybridization between Ni 3d and Pt 5d. It is found that an oxygen molecule prefers bridge site with Pt rich subsurface environment for adsorption on the surface of Pt segregated $Pt_3Ni$ (111). It is seen that there is very small charge transfer from $O_2$ to Pt. The curve of energy versus magnetic moment of the oxygen explains the magnetic moments in transition states. We found the dissociation barrier of 1.07eV significantly higher than dissociation barrier 0.77eV on Pt (111) suggesting that the dissociation is more difficult on Pt segregated $Pt_3Ni$ (111) surface. The spin polarized densities of states are presented in order to understand electronic structures of Pt and $O_2$ during the adsorption in detail.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2009년도 제38회 동계학술대회 초록집
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• pp.403-403
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• 2010

The Pt-Ni alloy is an electro-catalyst of interest in the low temperature direct methanol fuel cells(DMFCs). It has been already reported that the Pt-Ni alloy catalysts may even have enhanced activity compared to pure platinum catalyst, depending on how the surfaces are prepared. The order-disorder transition in bimetallic alloy such as $\beta$-CuZn, Cu3Au, and CuAu have been investigated greatly by x-ray diffraction. After annealing the bimetallic alloy, the crystal structure changes as observed in the order-disorder transition of Cu3Au which changes from the face centered cubic to a simple cubic structure. Pt-Ni bimetallic alloy has been already reported to have the face centered cubic structure. However, in nano-scale Pt-Ni bimetallic alloy crystals the crystal structures changes to a simple cubic structure. In this experiment, we have studied the order-disorder transition in Pt-Ni bimetallic nanocrystals. Pt/Ni thin films were deposited on sapphire(0001) substrates by e-beam evaporator and then Pt-Ni alloy were formed by RTA at 500, 600, and $700^{\circ}C$ in a vacuum environment and Pt-Ni nano particles were formed by RTA at $1059^{\circ}C$ in a vacuum environment. We measured the structure of Pt-Ni bimetallic alloy films using synchrotron x-ray diffraction and SEM.

• 한국신재생에너지학회:학술대회논문집
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• 한국신재생에너지학회 2011년도 추계학술대회 초록집
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• pp.97.2-97.2
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• 2011

Pt-Ru and Pt-Ni bimetallic catalysts were prepared and tested for heavy hydrocarbon reforming. Metals were supported on CGO($Ce_{0.8}Gd_{0.2}O_{2.0-x}$) by incipient wetness method. The prepared catalysts were characterized by Temperature programmed reduction(TPR). Oxidative steam reforming of n-dodecane was conducted to compare the activity of the catalysts. The reforming temperature was varied from $500^{\circ}C$ to $800^{\circ}C$ at fixed $O_2$/C of 0.3, $H_2O$/C of 3.0 and GHSV of 5,000/h.Reduction peaks of metal oxide, surface CGO and bulk CGO were detected. Reduction temperature of metal oxide decreased over the bi-metallic catalysts. It is considered that interaction between metals leads to decrease interaction between metal and oxygen. On the other hands, reduction temperatures of surface CGO were dectected in the order of Pt-Ru > Pt-Ni > Pt. low reduction temperatures of surface CGO indicates the low activation energy for oxygen ion conduction to metal. Oxygen ion conduction is known as de-coking mechanism of ionic conducting supports such as CGO. In activity test, fuel conversion was in the same order of Pt-Ru > Pt-Ni > Pt. Especially, 100% of fuel conversion was obtained over Pt-Ru catalysts at $500^{\circ}C$.

• 공업화학
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• 제22권1호
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• pp.98-103
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• 2011

DSSC의 광전 효율 증대와 Pt 상대전극의 접착성 향상을 위하여 FTO (Fluorine-doped Tin Oxide) 유리면에 Ni underlayer를 전기 도금 후 Pt 층을 전기 도금하였다. Ni underlayer는 $10mA/cm^2$에서 2 min 동안 도금한 경우 Ni 층과 FTO 면사이의 접착성이 가장 우수하게 나타났으며, Ni underlayer를 $10mA/cm^2$에서 2 min, Pt 층을 $5mA/cm^2$에서 1 min 동안 전기 도금한 상대전극의 XRD 분석 결과 Ni 및 Pt의 금속 회절 peak들을 관찰 할 수 있었다. 이렇게 제조한 상대전극을 사용하여 DSSC의 impedance 측정 결과 75 ohm의 가장 낮은 저항을 나타냈으며, 광전 효율은 5.6%로서 가장 높은 값을 나타내었다.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2004년도 하계종합학술대회 논문집(2)
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• pp.391-394
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• 2004

In this study, highly thermal stable Ni Germanosilicide has been utilized using NiPt alloy and novel NiPt/Co/TiN tri-layer. And, the Ni Germanosilicide Properties were characterized according to different Ge ratio (x) in $Si_{l-x}Ge_x$ for the next generation CMOS application. The sheet resistance of Ni Germanosilicide utilizing pure-Ni increased dramatically after the post-silicidation annealing at $600^{\circ}C$ for 30 min. Moreover, more degradation was found as the Ge fraction increases. However, using the proposed NiPt/Co/TiN tri-layer, low temperature silicidation and wide range of RTP process window were achieved as well as the improvement of the thermal stability according to different Ge fractions by the subsequent Co and TiN capping layer above NiPt on the $Si_{l-x}Ge_x$. Therefore, highly thermal immune Ni Germanosilicide up to $600^{\circ}C$ for 30 min is utilized using the NiPt/Co/TiN tri-layer promising for future SiGe based ULSI technology.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2010년도 제39회 하계학술대회 초록집
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• pp.80-80
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• 2010

X선 광전자 분광법을 이용하여 Pt(110) 표면 위에 증착된 Ni 초박막의 합금 형성에 대한 연구를 수행하였다. 각각 3 ML, 6 ML Ni 초박막을 $5{\times}10-9$ Torr 이하의 초고진공에서 증착된 것을 확인하고 후열처리 과정에 따른 Ni층의 변화와 합금형성에 따른 내각준위 스펙트럼을 관찰하였다. 증착된 Ni 초박막은 증착 후 전자구조 변화에 따른 선형변화가 일어나고, 590 K부터 섞이기 시작함을 내각준위 스펙트럼의 변화들로부터 알 수 있었다. 열처리 온도가 증가하면서 계면에 Ni-Pt 합금이 형성되었음은 Pt 4f 봉우리의 FWHM 변화부터로 확인할 수 있었으며 Ni 2p3/2 의 satelite 구조의 상대적 세기가 590 K부터 급격히 증가하여, 전자구조가 변화함을 알 수 있었다. Valence Band 스펙트럼의 변화로 계면의 Pt d전자들의 상태밀도 변화도 확인하였다.

• 열처리공학회지
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• 제19권2호
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• pp.103-108
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• 2006

Microstructural evolution of Pt-aluminide coated Ni-based superalloy has been investigated with ductilization heat treatment. The Pt coat was prepared on the superalloy and then aluminide coating was conducted using a pack cementation process. Samples were heat-treated at $1050^{\circ}C$ for 2 hrs and the microstructure and element analysis were preformed. A various precipitated compounds were observed within the coating layer and the diffusion region in the Pt-aluminide coating and heat treatment, indicating that the bi-phase compounds of $PtAl_2$ and NiAl were performed during the Pt-aluminide coating, whereas $M_{23}C_6$, MC, $Ni_3Al$ and ${\sigma}$ phases were precipitated in the inter-diffusion region. The bi-phase compounds of $PtAl_2$ and NiAl were transformed into the single phase compound of $PtAl_2$ with the heat treatment, increasing the amount of carbide and ${\sigma}$ phase.

• 대한금속재료학회지
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• 제46권12호
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• pp.830-834
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• 2008

NiSi is currently being employed in 45 nm CMOS devices as a contact material. We employed a first principles calculation to understand the movements of atoms when Co, Pd, and Pt were added to tetragonal-NiSi on Si (001). The Ni atoms in the tetragonal-NiSi/Si (001) favored away from the original positions along positive c-direction in a systematic way during the energy minimization. Two different Ni sites were identified at the interface and the bulk, respectively. The Ni site at the interface farther away from the interface was more favorable for Pd and Pt substitution. Co, however, prafered the bulk site to the interface site, unlike Pd and Pt.

• 마이크로전자및패키징학회지
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• 제13권4호
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• pp.27-36
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• 2006

약 10%이하의 Pt 또는 Ir 첨가시켜 니켈모노실리싸이드를 고온에서 안정화 시키는 것이 가능한지 확인하기 위해서 활성화영역을 가정한 단결정 실리콘 웨이퍼와 게이트를 상정한 폴리 실리콘 웨이퍼 전면에 Ni, Pt, Ir을 열증착기로 성막하여 10 nm-Ni/l nm-Pt/(poly)Si, 10 nm-Ni/l nm-Ir/(poly)Si 구조를 만들었다. 준비된 시편을 쾌속 열처리기를 이용하여 40초간 실리사이드화 열처리 온도를 $300^{\circ}C{\sim}1200^{\circ}C$ 범위에서 변화시켜 두께 50nm의 실리사이드를 완성하였다. 완성된 Pt와 Ir이 첨가된 니켈실리사이드의 온도별 전기저항변화, 두께변화, 표면조도변화, 상변화, 성분변화를 각각 사점전기저항측정기와 광발산주사전자현미경, 주사탐침현미경, XRD와 Auger depth profiling으로 각각 확인하였다. Pt를 첨가한 결과 기판 종류에 관계없이 기존의 니켈실리사이드 공정에 의한 NiSi와 비교하여 $700^{\circ}C$ 이상의 NiSi 안정화 구역을 넓히는 효과는 없었고 면저항이 커지는 문제가 있었다. Ir을 삽입한 경우는 단결정 실리콘 기판에서는 $500^{\circ}C$ 이상에서의 NiSi와 동일하게 $1200^{\circ}C$까지 안정한 저저항을 보여서 Ir이 효과적으로 Ni(Ir)Si 형태로 $NiSi_{2}$로의 상변태를 적극적으로 억제하는 특성을 보이고 있었고, 다결정 기판에서는 $850^{\circ}C$까지 효과적으로 NiSi의 고온 안정성을 향상시킬 수 있었다.