• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2018.06a
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• pp.102-102
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• 2018

Electronic industry had required the finer size and the higher performance of the device. Therefore, 3-D die stacking technology such as TSV (through silicon via) and micro-bump had been used. Moreover, by the development of the 3-D die stacking technology, 3-D structure such as chip to chip (c2c) and chip to wafer (c2w) had become practicable. These technologies led to the appearance of HBM (high bandwidth memory). HBM was type of the memory, which is composed of several stacked layers of the memory chips. Each memory chips were connected by TSV and micro-bump. Thus, HBM had lower RC delay and higher performance of data processing than the conventional memory. Moreover, due to the development of the IT industry such as, AI (artificial intelligence), IOT (internet of things), and VR (virtual reality), the lower pitch size and the higher density were required to micro-electronics. Particularly, to obtain the fine pitch, some of the method such as copper pillar, nickel diffusion barrier, and tin-silver or tin-silver-copper based bump had been utillized. TCB (thermal compression bonding) and reflow process (thermal aging) were conventional method to bond between tin-silver or tin-silver-copper caps in the temperature range of 200 to 300 degrees. However, because of tin overflow which caused by higher operating temperature than melting point of Tin ($232^{\circ}C$), there would be the danger of bump bridge failure in fine-pitch bonding. Furthermore, regulating the phase of IMC (intermetallic compound) which was located between nickel diffusion barrier and bump, had a lot of problems. For example, an excess of kirkendall void which provides site of brittle fracture occurs at IMC layer after reflow process. The essential solution to reduce the difficulty of bump bonding process is copper to copper direct bonding below $300^{\circ}C$. In this study, in order to improve the problem of bump bonding process, copper to copper direct bonding was performed below $300^{\circ}C$. The driving force of bonding was the self-annealing properties of electrodeposited Cu with high defect density. The self-annealing property originated in high defect density and non-equilibrium grain boundaries at the triple junction. The electrodeposited Cu at high current density and low bath temperature was fabricated by electroplating on copper deposited silicon wafer. The copper-copper bonding experiments was conducted using thermal pressing machine. The condition of investigation such as thermal parameter and pressure parameter were varied to acquire proper bonded specimens. The bonded interface was characterized by SEM (scanning electron microscope) and OM (optical microscope). The density of grain boundary and defects were examined by TEM (transmission electron microscopy).

• Journal of Korea Multimedia Society
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• v.6 no.2
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• pp.208-215
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• 2003

For playing a multimedia presentation in a Internet, the case that the presentation QoS(Quality of Services) at a destination nay be different from the QoS of multimedia data at the source occurs frequently. In this case, the process of trancoding the multimedia data at the source Into the multimedia data satisfying the QoS at the destination should be requited. In addition, even the presentation description having the homogeneous QoS at both sides may have different transcoding paths due to the limitation of display terminals or network bandwidth. That is, for a multimedia description, it is required to regenerate a proper transcoding path whenever the displaying terminals or the network environment gets decided. And the delay time required to go through the transcoding path may affect the playability of the give presentation. Therefore it should be checked whether the presentation requiring a transcoding process is able to be played in a real time. In this paper, the algorithm for generating all the possible transcoding paths for a given multimedia description under a fixed set of transcoders and the network environment is proposed. The algorithm adopts the concept of QoS transition diagram to Prevent from a trancoding Path being cycled by the repetition of a cyclic Path which generates the same QoS of multimedia data as its input QoS. By eliminating all the cyclic Paths, the algorithm can guarantee the termination of the process. And for the playability check, a method of computing the transcoding time and the delay lime between logical data units are proposed.Finally all the proposed methods were implemented in the stream engine, called TransCore and the presentation-authoring tool, called VIP, we had developed. And the test results with sample scenarios were presented at the last.