• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2012년도 춘계학술대회 논문집
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• pp.611-612
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• 2012

• 대한기계학회:학술대회논문집
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• 대한기계학회 2005년도 창립60주년 기념 추계 학술대회
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• pp.122.1-122.1
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• 2005

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2010년도 추계학술대회 논문집
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• pp.783-784
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• 2010

• 한국정밀공학회지
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• 제20권8호
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• pp.21-29
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• 2003

This paper describes a research work on the development of computer-aided design system for deep drawing & ironing of a high pressure vessel. An approach to the system is based on the knowledge-based rules. Knowledge for the system is formulated from plasticity theories, handbook, experimental results and empirical knowledge of field experts. An attempt is made to link programs incorporating a number of expert design rules with the process variables obtained by commercial FEM software, DEFORM and ANSYS, to form a useful package. It is composed of five main modules, which are calculation of product thickness, input, production feasibility check, process planning, and autofrettage process modules and two submodules, which are folding check and process variable verification submodules. Programs for the system have been written in AutoLISP on the AutoCAD 2000 using personal computer. The developed system makes it possible to design and manufacture large high pressure vessel requiring D.D.I. process more efficiently.

• 센서학회지
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• 제31권6호
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• pp.361-365
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• 2022

Advanced packaging demands are driven by the need for dense integration systems. Consequently, stacked packaging technology has been proposed instead of reducing the ultra-fine patterns to secure economic feasibility. This study proposed an effective packaging process technology for semiconductor devices using a 9-inch dicing die attach film (DDAF), wherein the die attach and dicing films were combined. The process involved three steps: tape lamination, dicing, and bonding. Following the grinding of a silicon wafer, the tape lamination process was conducted, and the DDAF was arranged. Subsequently, a silicon wafer attached to the DDAF was separated into dies employing a blade dicing process with a two-step cut. Thereafter, one separated die was bonded with the other die as a substrate at 130 ℃ for 2 s under a pressure of 2 kgf and the chip was hardened at 120 ℃ for 30 min under a pressure of 10 kPa to remove air bubbles within the DAF. Finally, a curing process was conducted at 175 ℃ for 2 h at atmospheric pressure. Upon completing the manufacturing processes, external inspections, cross-sectional analyses, and thermal stability evaluations were conducted to confirm the optimality of the proposed technology for application of the DDAF. In particular, the shear strength test was evaluated to obtain an average of 9,905 Pa from 17 samples. Consequently, a 3D integration packaging process using DDAF is expected to be utilized as an advanced packaging technology with high reliability.

• 청정기술
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• 제20권4호
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• pp.359-366
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• 2014

연소전 $CO_2$ 흡수제인 PKM1-SU와 원유의 접촉분해 촉매인 FCC (fluid catalytic cracking)입자의 고온, 고압 조건 마모 실험을 수행하였다. 지름 15.1 cm, 높이 120 cm에 스파저 튜브(sparger tube, 1 mm 오리피스)를 장착한 원통형 기포유동층반응기를 이용하여, 다양한 온도조건($0{\sim}400^{\circ}C$), 압력조건(0~20 bar)에서 입자마모 실험을 수행하였다. BET, 광학현미경, 입도분석기 등을 이용하여 실험 전, 후 입자를 분석 하였다. 또한 기존의 마모도 측정 방법인 ASTM D5757-95방법을 이용하여 층물질의 높이(4.4~10.2 cm) 및 수분 주입이 입자 마모에 미치는 영향에 대하여 확인하였다.

• Design & Manufacturing
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• 제17권1호
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• pp.56-63
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• 2023

In this study, the vibration signal of the mold was measured and analyzed to monitor the process information and characteristics during the press molding process. A necklace-type picture frame mold was used for press molding, and the vibration signal was measured by GY-61 acceleration sensor module attached to the surface of the upper (movable) mold base. The change of the vibration signal of the mold according to press speed was analyzed. As a result, the vibration signal had a large change at five sections: "Holder contact", "Punch contact and start of pressing", "End of pressing", "Mold open", and "Demolding". The time difference between "Punch contact and start of pressing" and "End of pressing" means the pressing time which is the actual time the material is molded under pressing pressure. The time intervals for each section, represented by the time interval between "Holder contact" and "Punch contact and start of pressing", can be used to compare and evaluate the press speed applied to the process. By comparing the vibration signals at 60 rpm and 90 rpm, the amplitude at the section of "Punch contact and start of pressing" increased as the press speed increased. This result means that as the press speed increases, more force and pressure is applied to the material. Also, the peak values of the other sections were found to increase as the press speed increased. It was found that the pressing time, the time interval between "Punch contact and start of pressing" and "End of pressing", decreases as the pressing speed increases. Similarly, press speed factor, the time interval between "Holder contact", and "Punch contact and start of pressing", is found to be shorter. Therefore, based on the result of this study, the pressing time, press speed, pressing(punching) pressure of each cycle can be monitored by measuring the vibration signal of the mold. Also, it was confirmed that the level and trend of process information and characterization can be evaluated as the change of the mold vibration during press molding.

• 멤브레인
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• 제17권4호
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• pp.318-328
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• 2007

본 연구에서는 호소수의 정수처리공정 중 폴리술폰계 중공사막을 이용한 침지형(흡인압)과 외압형을 동시에 적용한 분리막 공정으로 압력 및 공경에 따른 투과플럭스의 변화에 관한 성능을 평가하고자 하였다. 침지형(흡인압) 공정의 압력에 따른 최대 투과 플럭스는 공경이 $0.3{\mu}m$에서 평균 282 LMH, $0.05{\mu}m$에서는 234 LMH를 나타내었으며 외압형(외압) 공정의 압력에 따른 최대 투과 플럭스는 공경이 $0.3{\mu}m$에서 평균 443 LMH, $0.05{\mu}m$에서는 522 LMH를 나타내었다. 또한, 흡인압과 외압을 동시에 적용한 공정의 압력에 따른 최대 투과 플럭스는 공경이 $0.3{\mu}m$에서 평균 674 LMH $0.05{\mu}m$에서는 648 LMH를 나타내었다. 따라서, 호소수를 이용한 정수처리공정에서 분리막으로 흡인압과 외압을 동시에 이용할 경우 단위 면적당 생산수를 최대로 할 수 있을 것으로 사료된다.

• 한국산학기술학회논문지
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• 제11권4호
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• pp.1391-1398
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• 2010

S전자에서 발생되는 유기성 산업폐수의 생물학적 처리인 MBR 공정의 유출수를 LCD 제조공정의 용수로 재사용하기 위하여 $32m^3/d$ 규모의 pilot-scale RO 막분리 공정을 구축하고 RO 막분리 공정의 운전압력과 투과유량에 따른 막간차압 및 CIP 주기 그리고 TOC와 전기전도도의 용질분리에 대한 영향을 분석하였다. MBR 공정의 유출수는 일반적인 처리수 재사용 수질기준을 만족하나 LCD 제조공정의 S전자 자체 재사용 용수 수질기준인 TOC<1mg/L와 전기전도도<$100{\mu}S/cm$를 만족하지 못하므로 후속 처리가 불가피하다. RO 막분리 공정의 회수율을 85%로 일정하게 유지한 상태에서 투과유량을 12.5 LMH에서 22.0 LMH로 증가시키면서 운전한 결과 모든 투과유량에서 RO 투과수는 자체 재활용 용수 수질기준을 만족하였다. 그러나 RO 막오염에 의한 막간차압이 상승되어 CIP 주기는 투과유량이 증가되면 짧아지는 효과가 나타났다. RO 막분리 공정의 최적 운전인자는 회수율 85%에서 투과유량 16.5~18.5 LMH이었으며 운전압력은 $6.7{\sim}12.4kgf/cm^2$, CIP 주기는 투과생산량/운전비에 적절한 20일~25일로 나타났다.

• 한국자동차공학회논문집
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• 제19권1호
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• pp.66-72
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• 2011

Injection pressure is an important factor in filling procedure for injection molded parts. In addition, weldlines should be avoided to successfully produce injection molded parts. In this study, we optimally obtained injection molding process parameters that minimize injection pressure. Then, we determined the thickness of the part to avoid weldlines. To solve the optimization problem proposed, we employed MAPS-3D (Mold Analysis and Plastics Solution-3 Dimension), a commercial CAE tool for injection molding analysis, and PIAnO (Process Integration, Automation, and Optimization) as a commercial PIDO (Process Integration and Design Optimization) tool. We integrated MAPS-3D into PIAnO, automated the analysis and design procedure, and performed optimization by employing PQRSM (Progressive Quadratic Response Surface Method) equipped in PIAnO. We successfully obtained optimization results, which demonstrates the effectiveness of our design method.