• Title/Summary/Keyword: Process of Moisture Absorption

Search Result 103, Processing Time 0.024 seconds

Response Surface Approach to Design Optimization of Regenerator Using Hot Air Heated by Solar Collector (태양열 온풍 이용을 위한 재생기의 설계 최적화 모델에 관한 연구)

  • Woo, Jong-Soo;Choi, Kwang-Hwan;Yoon, Jeong-In
    • Journal of the Korean Solar Energy Society
    • /
    • v.23 no.3
    • /
    • pp.7-14
    • /
    • 2003
  • Absorption potential of desiccant solution significantly decreases after absorbing moisture from humid air, and a regeneration process requires a great amount of energy to recover absorption potential of desiccant solution. In an effort to develop an energy efficient regenerator, this study examines a regeneration process using hot air heated by solar radiation to recover absorption potential by evaporating moisture in liquid desiccant. More specifically, this study is aimed at finding the optimum operating condition of the regenerator by utilizing a well-established statistical tool, so-called response surface methodology(RSM), which may provide a functional relationship between independent and dependent variables. It is demonstrated that an optimization model to find the optimum operating condition can be obtained using the functional relationship between regeneration rate and affecting factors which is approximated on the basis experimental results.

Bondline Strength Evaluation of Honeycomb Sandwich Panel For Cure Process and Moisture Absorption (경화공정 및 수분흡수에 따른 복합재료 하니콤 샌드위치 판넬의 접합강도특성 연구)

  • Choe, Heung-Seop;Jeon, Heung-Jae;Nam, Jae-Do
    • Transactions of the Korean Society of Mechanical Engineers A
    • /
    • v.25 no.1
    • /
    • pp.115-126
    • /
    • 2001
  • In this paper, through a series of comparative experiments, effects of two different cure processing methods, cocure and precure, on the mechanical properties of honeycomb core materials for aircraft applications are considered. Mass of moisture accumulated into the closed cells of the sandwich panel specimen from the measured mass of moisture diffused to the full saturation state into the elements(skin, adhesive layer, Nomex honeycomb), consisting the honeycomb sandwich specimen has been calculated. Water reservoir of 70$\^{C}$ was used to have specimens absorb moisture to see the influence of moisture absorbed into sandwich panel on its mechanical properties. For the repair condition holding for 2 hours at 177$\^{C}$(350℉) temperature, a pressure due to the vapor expansion in each cell of the sandwich panel, which may result in the local separation of the interface between laminated skin and the surface of the honeycomb, has been estimated by vapor pressure-temperature relation from the thermodynamic steam table and compared to the pressure from the ideal gas state equation. The bonding strengths of the laminated skins on the flat surface of the Nomex honeycomb have been compared by the flatwise tension test and climbing drum peel test performed at room temperature for dry, wet and wet-repair specimens, respectively.

Reliability Evaluation Through Moisture Sorption Characterization of Electronic Packaging Materials (전자 패키징 소재의 수착 특성화를 통한 신뢰성 평가)

  • Park, Heejin
    • Transactions of the Korean Society of Mechanical Engineers A
    • /
    • v.37 no.9
    • /
    • pp.1151-1158
    • /
    • 2013
  • Knowledge of the moisture sorption properties of a material is essential for optimal material development and analysis of the delamination failure caused by vapor pressure at the interlayer during the manufacturing process of integrated packaging devices. In this paper, both temperature dependent absorption and desorption properties according to temperature and humidity model are parameterized and the effects of water activities and temperature are discussed. The activation energy obtained from the parameterized diffusivity determines the acceleration factor for the equivalency of moisture sorption levels, which enables the effect of moisture diffusivity on the equivalent elapsed testing time required for evaluating the reliable life time to be estimated. The acceleration factor evaluated at the reliability testing standard of the flexible packaging module is exampled.

Delamination Prediction of Semiconductor Packages through Finite Element Analysis Reflecting Moisture Absorption and Desorption according to the Temperature and Relative Humidity (유한요소 해석을 통해 온도와 상대습도에 따른 수분 흡습 및 탈습을 반영한 반도체 패키지 구조의 박리 예측)

  • Um, Hui-Jin;Hwang, Yeon-Taek;Kim, Hak-sung
    • Journal of the Microelectronics and Packaging Society
    • /
    • v.29 no.3
    • /
    • pp.37-42
    • /
    • 2022
  • Recently, the semiconductor package structures are becoming thinner and more complex. As the thickness decrease, interfacial delamination due to material mismatch can be further maximized, so the reliability of interface is a critical issue in industry field. Especially, the polymers, which are widely used in semiconductor packaging, are significantly affected by the temperature and moisture. Therefore, in this study, the delamination prediction at the interface of package structure was performed through finite element analysis considering the moisture absorption and desorption under the various temperature conditions. The material properties such as diffusivity and saturated moisture content were obtained from moisture absorption test. The hygro-swelling coefficients of each material were analyzed through TMA and TGA after the moisture absorption. The micro-shear test was conducted to evaluate the adhesion strength of each interface at various temperatures considering the moisture effect. The finite element analysis of interfacial delamination was performed that considers both deformation due to temperature and moisture absorption. Consequently, the interfacial delamination was successfully predicted in consideration of the in-situ moisture desorption and temperature behavior during the reflow process.

SYNERGISTIC SKIN PROPERTY INTERACTIONS BETWEEN ALPHA HYDROXY ACID AND SKIN MOISTURIZER IN A HAND DISHWASHING DETERGENT

  • Brumbaugh, E.H.;Sigler, M.L.;Casterton, P.L.;Dornoff, M.
    • Proceedings of the SCSK Conference
    • /
    • 2003.09a
    • /
    • pp.491-497
    • /
    • 2003
  • The use of both an Alpha Hydroxy Acid, Citric Acid, and a Skin Moisturizer, Glycereth-26, formulated into a hand dishwashing detergent have been shown to be synergistic in their effects on certain skin health parameters. Each ingredient was evaluated alone and together in a hand dishwashing detergent via a 9-week use test. Panelists washed dishes using the sponge method commonly used in Asian markets and a 1:7 dilution of the concentrated dish detergent. Panelist's hands were evaluated initially and at 3-week intervals for nine weeks. After nine weeks panelist's hands showed significant improvements in Moisture Absorption and Transepidermal Water Loss (TEWL). A synergistic effect on TEWL was found between the AHA and the Moisturizer. These effects, showing an improvement in the condition of the panelist's skin are impressive, particularly since they were observed from a dishwashing product that is highly diluted and at near neutral pH during the washing process.

  • PDF

SYNERGISTIC SKIN PROPERTY INTERACTIONS BETWEEN ALPHA HYDROXY ACID AND SKIN MOISTURIZER IN A HAND DISHWASHING DETERGENT

  • Brumbaugh, E.H.;Sigler, M.L.;Casterton, P.L.;Dornoff, J.M.
    • Proceedings of the SCSK Conference
    • /
    • 2003.09b
    • /
    • pp.417-423
    • /
    • 2003
  • The use of both an Alpha Hydroxy Acid, Citric Acid, and a Skin Moisturizer, Glycereth-26, formulated into a hand dishwashing detergent have been shown to be synergistic in their effects on certain skin health parameters. Each ingredient was evaluated alone and together in a hand dishwashing detergent via a 9-week use test. Panelists washed dishes using the sponge method commonly used in Asian markets and a 1:7 dilution of the concentrated dish detergent. Panelist's hands were evaluated initially and at 3-week intervals for nine weeks. After nine weeks panelist's hands showed significant improvements in Moisture Absorption and Transepidermal Water Loss (TEWL). A synergistic effect on TEWL was found between the AHA and the Moisturizer. These effects, showing an improvement in the condition of the panelist's skin are impressive, particularly since they were observed from a dishwashing product that is highly diluted and at near neutral pH during the washing process.

  • PDF

Moisture Absorption Characteristics of Pt/Nafion Membrane for PEMFC Prepared by a Drying Process (건식법에 의해 제조한 PEMFC용 Pt/나피온 막의 흡습 특성)

  • Lee, Jae-Young;Lee, Hong-Ki
    • Transactions of the Korean hydrogen and new energy society
    • /
    • v.23 no.4
    • /
    • pp.310-315
    • /
    • 2012
  • A simple drying process was developed for the preparation of a Pt/Nafion self-humidifying membrane to be used for a proton-exchange membrane fuel cell (PEMFC). Platinum (II) bis (acetylacetonate), $Pt(acac)_2$ was sublimed, penetrated into the surface of a Nafion film and then reduced to Pt nanoparticles simultaneously without any support of a reducing agent in a glass reactor at $180^{\circ}C$ for 15 min. The process was carried out in $N_2$ atmosphere to prevent the oxidation of Pt nanoparticles at high temperature. The morphology and distribution of the Pt nanoparticles were observed by transmission electron microscopy (TEM) and energy dispersive spectroscopy (EDS), and we found that the average Pt particle size was ca. 3.7 nm, the penetration depth was ca. $17{\mu}m$. Almost all Pt nanoparticles were formed just beneath the surface and the number density decreased rapidly as the penetration depth increased. To estimate water absorption characteristics of the Nafion membranes, water uptake at an isothermal condition was measured by dynamic vapor sorption (DVS), and it was found that water uptake of the Pt/Nafion membrane was higher than that of the neat Nafion membrane.

Failure Mechanism of Bendable Embedded Electronic Module Under Various Environment Conditions (Bendable 임베디드 전자모듈의 손상 메커니즘)

  • Jo, Yun-Seong;Kim, A Young;Hong, Won Sik
    • Journal of Welding and Joining
    • /
    • v.31 no.5
    • /
    • pp.59-63
    • /
    • 2013
  • A bendable electronic module has been developed for a mobile application by using a low-cost roll-to-roll manufacturing process. In flexible embedded electronic module, a thin silicon chip was embedded in a polymer-based encapsulating adhesive between flexible copper clad polyimide layers. To confirm reliability and durability of prototype bendable module, the following tests were conducted: Moisture sensitivity level, thermal shock test, high temperature & high humidity storage test, and pressure cooker tester. Those experiments to induce failure of the module due to temperature variations and moisture are the experiment to verify the reliability. Failure criterion was 20% increase in bump resistance from the initial value. The mechanism of the increase of the bump resistance was analyzed by using non-destructive X-ray analysis and scanning acoustic microscopy. During the pressure cooker test (PCT), delamination occurred at the various interfaces of the bendable embedded modules. To investigate the failure mechanism, moisture diffusion analysis was conducted to the pressure cooker's test. The hygroscopic characteristics of the encapsulating polymeric materials were experimentally determined. Analysis results have shown moisture saturation process of flexible module under high temperature/high humidity and high atmosphere conditions. Based on these results, stress factor and failure mechanism/mode of bendable embedded electronic module were obtained.

Change of Mechanical Properties of Injection-Molded Glass-Fiber-Reinforced Plastic (GFRP) According to Temperature and Water Absorption for Vehicle Weight Reduction (차량 경량화를 위한 사출성형 유리섬유강화플라스틱의 온도 및 수분 흡수에 따른 기계적 물성 변화)

  • Chun, Doo-Man;Ahn, Sung-Hoon
    • Transactions of the Korean Society of Mechanical Engineers A
    • /
    • v.37 no.2
    • /
    • pp.199-204
    • /
    • 2013
  • Owing to the global energy crisis, studies have strongly focused on realizing energy savings through vehicle weight reduction using light metal alloys or polymer composites. Polymer composites afford many advantages including enabling the fabrication of complex shapes by injection molding, and glass and carbon fibers offer improved mechanical properties. However, the high temperature in an engine room and the high humidity during the rainy season can degrade the mechanical properties of the polymer. In this study, the mechanical properties of injection-molded glass-fiber-reinforced polymer were assessed at a temperature of $85^{\circ}C$ and the maximum moisture absorption conditions. The result showed a 23% reduction in the maximum tensile strength under high temperature, 30% reduction under maximum moisture absorption, and 70% reduction under both heat and moisture conditions. For material selection during the design process, the effects of high temperature and high humidity should be considered.

Comparison of Mechanical Properties on Helical/Hoop Hybrid Wound HNT Reinforced CFRP Pipe with Water Absorption Behavior (CFRP 파이프의 와인딩 적층 패턴 설계 및 HNT 나노입자 보강에 따른 수 환경에서의 기계적 물성 평가)

  • Choi, Ji-Su;Park, Soo-Jeong;Kim, Yun-Hae
    • Composites Research
    • /
    • v.34 no.3
    • /
    • pp.174-179
    • /
    • 2021
  • Currently, fluid transfer steel pipes take a lot of time and expense to maintain all facilities due to new construction and painting or corrosion and aging. Therefore, this study was conducted for designing a CFRP pipe structure with high corrosion resistance and chemical resistance as a substitute for steel pipes. The helical/hoop pattern was cross-laminated to improve durability, and HNT was added to suppress the moisture absorption phenomenon of the epoxy. The HNT/CFRP pipe was manufactured by a filament winding process, and performed a mechanical property test, and a moisture absorption test in distilled water at 70℃. As a result, the highest bending strength was obtained when the hoop pattern was laminated with a thickness equivalent to 0.6% of the pipe. The 0.5 wt% HNT specimen had the highest moisture absorption resistance. Also, the delamination phenomenon at the interlayer interface was delayed, resulting in the lowest strength reduction rate.