• Title/Summary/Keyword: Process Pattern

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Manual Design for Pattern Developing and Virtual Modelling through Product Analysis -Focused on Disposable Protective Coverall- (제품 분석을 통한 패턴 제작 및 가상 모델링 제작 매뉴얼 설계 -부직포 전신 보호복을 중심으로-)

  • Jeon, Eunkyung;Moon, Jeehyun
    • Journal of the Korean Society of Clothing and Textiles
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    • v.39 no.3
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    • pp.457-467
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    • 2015
  • The demand for coverall-type protective clothing are increasing in many industrial fields; however, it is impossible to evaluate the wearers' apparel fit because there is no commercialized pattern in the market. This study produces a manual for the process of acquiring patterns by separating PPE products into pieces to provide information on acquiring patterns. The analysis was on coverall-type non woven protective clothing in the domestic market, and 4 panels examined the validity, reliability, and efficiency of various possible methods on each step of process. Five steps were conducted to acquire patterns removing wrinkles, marking seams lines, separating seams, and pattern completing. The process of converting these into pattern files was designed through three procedures of digitizing, editing, and exporting and detailed stages. Fitting tests were undertaken, real patterns by actual modeling and pattern files by virtual modeling; all showed similar forms with outfits wearing ready-made protective coveralls. This study sought the most efficient and objective method of virtual modeling and proposed it as a manual. It is expected for the pattern reverse-designing manual through products analysis presented in this study that would be a helpful addition of information to the pattern tracing of pattern-less clothing products.

Accuracy Improvement of Screen Printed Ag Paste Patterns on Anodized Al for Electroless Ni Plating (무전해 Ni 도금을 위한 양극 산화막위에 스크린 인쇄된 Ag 페이스트 패턴의 정밀도 개선)

  • Lee, Youn-Seoung;Rha, Sa-Kyun
    • Korean Journal of Materials Research
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    • v.27 no.8
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    • pp.397-402
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    • 2017
  • We used an etching process to control the line-width of screen printed Ag paste patterns. Ag paste was printed on anodized Al substrate to produce a high power LED. In general, Ag paste spreads or diffuses on anodized Al substrate in the process of screen printing; therefore, the line-width of the printed Ag paste pattern increases in contrast with the ideal line-width of the pattern. Smudges of Ag paste on anodized Al substrate were removed by neutral etching process without surface damage of the anodized Al substrate. Accordingly, the line-width of the printed Ag paste pattern was controlled as close as possible to the ideal line-width. When the etched Ag paste pattern was used as a seed layer for electroless Ni plating, the line width of the plated Ni film was similar to the line-width of the etched Ag paste pattern. Finally, in pattern formation by Ag paste screen printing, we found that the accuracy of the line-width of the pattern can be effectively improved by using an etching process before electroless Ni plating.

A Variable Business Component Development and Case Study Using a Rule Based Analysis Pattern and UML Components (규칙기반 분석 패턴과 UML Components을 사용한 가변적인 비즈니스 컴포넌트 개발과 적용 사례)

  • Lee, Yong-Hwan;Min, Dug-Ki
    • The KIPS Transactions:PartD
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    • v.13D no.7 s.110
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    • pp.947-958
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    • 2006
  • In order to increase extensibility and reusability of business components, the variable things need to be analyzed from the analysis phase and identified as components. In this paper, we propose a rule-based analysis pattern, which can effectively extract object-based main concepts from a variable business process in the analysis phase and identify a variable business component by applying the pattern to the UML Components development process. It can make analysis artifacts consistent and readable for analysts with different level of knowledge and experience to apply the pattern to analysis of rule-based variable business processes. And also, variable business components can be easily identified by applying the pattern to the UML Components development process. In order to prove the feasibility of the pattern, we have applied the pattern the deposit and import/export subsystem of the banking domain. According to our experience, we can make the same business conceptual models between the deposit and import/export subsystem due to the main concepts suggested by the pattern and effectively identify a variable business components in the UML Components development process.

Development of a Dedicated CAM System for Styrofoam-pattern Machining (자동차 프레스 금형의 스티로폼-패턴 가공을 위한 전용 CAM 시스템 개발)

  • 박정환
    • Korean Journal of Computational Design and Engineering
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    • v.3 no.4
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    • pp.223-235
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    • 1998
  • A dedicated CAM(Computer-Aided Manufacturing) system has been developed, which generated tool-path to machine Styrofoam stamping die-patterns in Chrysler Corporation. A previous process to build die-patterns was to "stick build" the pattern, in which stock is cut & glued together, and then the NC machining of part-surface shape completes building a Styrofoam die-pattern. The current process utilizes the developed CAM system, and almost removes the manual work, consequently reduces the overall lead time. The paper presents the overall system structures, tool-path generation, and some features of Styrofoam pattern machining.

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A study on the effect of binder properties on feedstock and micro powder injection molding process (마이크로 분말사출성형에서 바인더 물성이 피드스탁 및 성형공정에 미치는 영향에 관한 연구)

  • Lee, Won-sik;Kim, Yong-dae
    • Design & Manufacturing
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    • v.11 no.3
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    • pp.1-7
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    • 2017
  • The fabrication process of micro pattern structure with high precision and high aspect ratio using powder injection molding (PIM) is developed. In the PIM process, the metal powder is mixed with the binder systems and the mixture is injected into the metal mold. The injection molded green parts are debinded and sintered to reach final shape and properties. In this method, the optimization of physical properties such as fluidity and strength of the binder system is essential for perfect filling the high aspect ratio micro-pattern. For this purpose, the correlation between the properties of the binder system and feedstock and ${\mu}-PIM$ process was investigated, and a binder system with low viscosity at low temperature(about $110^{\circ}C$) and high strength after cooling was investigated and applied. Employing this process, high precision parts with line type micro pattern structure which has pattern size $160{\mu}m$ and aspect ratio more than 2 can be manufactured.

Effect of pattern spacing and slurry types on the surface characteristics in 571-CMP process (STI-CMP공정에서 표면특성에 미치는 패턴구조 및 슬러리 종류의 효과)

  • Lee, Hoon;Lim, Dae-Soon;Lee, Sang-Ick
    • Proceedings of the Korean Society of Tribologists and Lubrication Engineers Conference
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    • 2002.05a
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    • pp.272-278
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    • 2002
  • Recently, STI(Shallow Trench Isolation) process has attracted attention for high density of semiconductor device as a essential isolation technology. In this paper, the effect of pattern density, trench width and selectivity of slurry on dishing in STI CMP process was investigated by using specially designed isolation pattern. As trench width increased, the dishing tends to increase. At $20{\mu}m$ pattern size, the dishing was decreased with increasing pattern density Low selectivity slurry shows less dishing at over $160{\mu}m$ trench width, whereas high selectivity slurry shows less dishing at below $160{\mu}m$ trench width.

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An Effective Pattern Selection Process for Developing of Pattern Based Software (패턴 기반 소프트웨어 개발을 위한 효과적인 패턴 선정 프로세스)

  • Choi Jin Myung;Rhew Sung Yul
    • Journal of KIISE:Software and Applications
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    • v.32 no.5
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    • pp.346-356
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    • 2005
  • Over the past decade, several types of design pattern have been defined in the software engineering area. But these patterns have not been used so often compared with data structure and algorithm. Likewise, methods to select and apply design patterns during analysis, design, and development are not mentioned in CBD methodologies such as CBD96, RUP, and MaRMI III. This paper suggests the process of effectively selecting design patterns which can be applied to analysis, design, and development for development of application software with based on those offered by GoF and J2EE pattern catalogs. It also demonstrates how to effectively pattern-based software and shows differences and relative advantages from RUP by applying the suggested process to the development of aviation job application.

A study on EPD of STI CMP Process with Reverse Moat Pattern (Reverse Moat Pattern을 가진 STI CMP 공정에서 EPD 고찰)

  • Lee, Kyung-Tae;Kim, Sang-Yong;Seo, Yong-Jin;Kim, Chang-Il;Chang, Eui-Goo
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2000.04b
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    • pp.14-17
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    • 2000
  • The rise throughput and the stability in fabrication of device can be obtained by applying of CMP process to STI structure in 0.18um semiconductor device. To employ in STI CMP, the reverse moat process has been added thus the process became complex and the defects were seriously increased. Removal rates of each thin films in STi CMP was not equal hence the devices must to be effected, that is, the damage was occured in the device dimension in the case of excessive CMP process and the nitride film was remained on the device dimension in the case of insufficient CMP process than these defects affect the device characteristics. We studied the current sensing method in STI-CMP with the reverse moat pattern.

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Numerical Analysis of Micro-pattern Filling with Gas Dissolution by Injection Molding Process (가스 용해를 고려한 금형내압제어 사출성형공정의 마이크로패턴 충전 해석)

  • Park, Sung Ho;Yoo, Hyeong Min;Lee, Woo Il
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.13 no.4
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    • pp.21-27
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    • 2014
  • The injection molding process has several advantages enabling it to produce large quantities of molded plastic products using a repetitive process. In recent years, it has been necessary to develop an injection molding process with micro/nano-sized patterns for application to the semiconductor industry and to the bio/nano manufacturing industry. In this study, we apply gas pressure to the inside of a mold and consider the gas dissolution phenomenon for a resin filling into a micro pattern with a line structure. Using numerical analysis, we calculate the filling ratio with respect to time for various internal gas pressures and various aspect ratios of the micro-patterns.

Laser Processing for Manufacturing Styrofoam Pattern (주물용 스티로폼 목형 제작을 위한 레이저 가공 공정 개발)

  • 강경호;김재도
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2001.04a
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    • pp.1085-1088
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    • 2001
  • The process of styrofoam pattern that has been used for material of press die pattern depends chiefly on handwork. Laser manufacturing system developed to increase precision and efficiency of process that is also able to convert the design easily. Applying the RP(rapid prototyping) concept reversely, the unnecessary part of section is vapored away by heat source of laser beam after converting 3-D CAD model into cross-sectional shape information. Laser beam is line-scanned in plane specimens to measure the depth and width of cut, surface roughness, cross-sectional shape as converting laser power, scanning speed, cutting gas pressure. With these basic data, plane surface, inclined surface, hole, outer contour trimming process is experimented and optimum condition are obtained. In plane and inclined surface experiments, 15W laser power and 50mm/s scanning speed make superior processing property and 30W, 10mm/s make processing efficiency increase in trimming process. With these results, simple patterns were manufactured and the possibility of applying laser manufacturing system to styrofoam pattern was convinced.

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