Abstract
The injection molding process has several advantages enabling it to produce large quantities of molded plastic products using a repetitive process. In recent years, it has been necessary to develop an injection molding process with micro/nano-sized patterns for application to the semiconductor industry and to the bio/nano manufacturing industry. In this study, we apply gas pressure to the inside of a mold and consider the gas dissolution phenomenon for a resin filling into a micro pattern with a line structure. Using numerical analysis, we calculate the filling ratio with respect to time for various internal gas pressures and various aspect ratios of the micro-patterns.