• 농업과학연구
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• 제48권3호
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• pp.597-606
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• 2021

Due to the characteristics of the farmland in Korea, forward and reverse shift is the most used. The fatigue of farmers is caused by forward and reverse shifting with a manual transmission. Therefore, it is necessary to improve the convenience of forward and backward shifting. This study was a basic study on the development of a current control system for forward and reverse shifting of agricultural tractors using proportional control valves and a controller. A test bench was fabricated to evaluate the current control accuracy of the control system, and the stability of the controller was evaluated through CPU (central processing unit) load measurements. A controller was selected to evaluate the stability of the proportional valve controller. The stability evaluation was performed by comparing and analyzing the command current of the controller and the actual current measured. The command current was measured using a CAN (controller area network) communication device and DAQ (data acquisition). The actual current was measured with a current probe and an oscilloscope. The control system and stability evaluation was performed by measuring the CPU load on the controller during control operations. The average load factor was 12.27%, and when 5 tasks were applied, it was shown to be 70.65%. This figure was lower than the CPU limit of 74.34%, when 5 tasks were applied and was judged to be a stable system.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2012년도 제43회 하계 정기 학술대회 초록집
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• pp.80-81
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• 2012

Recently, one of the critical issues in the etching processes of the nanoscale devices is to achieve ultra-high aspect ratio contact (UHARC) profile without anomalous behaviors such as sidewall bowing, and twisting profile. To achieve this goal, the fluorocarbon plasmas with major advantage of the sidewall passivation have been used commonly with numerous additives to obtain the ideal etch profiles. However, they still suffer from formidable challenges such as tight limits of sidewall bowing and controlling the randomly distorted features in nanoscale etching profile. Furthermore, the absence of the available plasma simulation tools has made it difficult to develop revolutionary technologies to overcome these process limitations, including novel plasma chemistries, and plasma sources. As an effort to address these issues, we performed a fluorocarbon surface kinetic modeling based on the experimental plasma diagnostic data for silicon dioxide etching process under inductively coupled C4F6/Ar/O2 plasmas. For this work, the SiO2 etch rates were investigated with bulk plasma diagnostics tools such as Langmuir probe, cutoff probe and Quadruple Mass Spectrometer (QMS). The surface chemistries of the etched samples were measured by X-ray Photoelectron Spectrometer. To measure plasma parameters, the self-cleaned RF Langmuir probe was used for polymer deposition environment on the probe tip and double-checked by the cutoff probe which was known to be a precise plasma diagnostic tool for the electron density measurement. In addition, neutral and ion fluxes from bulk plasma were monitored with appearance methods using QMS signal. Based on these experimental data, we proposed a phenomenological, and realistic two-layer surface reaction model of SiO2 etch process under the overlying polymer passivation layer, considering material balance of deposition and etching through steady-state fluorocarbon layer. The predicted surface reaction modeling results showed good agreement with the experimental data. With the above studies of plasma surface reaction, we have developed a 3D topography simulator using the multi-layer level set algorithm and new memory saving technique, which is suitable in 3D UHARC etch simulation. Ballistic transports of neutral and ion species inside feature profile was considered by deterministic and Monte Carlo methods, respectively. In case of ultra-high aspect ratio contact hole etching, it is already well-known that the huge computational burden is required for realistic consideration of these ballistic transports. To address this issue, the related computational codes were efficiently parallelized for GPU (Graphic Processing Unit) computing, so that the total computation time could be improved more than few hundred times compared to the serial version. Finally, the 3D topography simulator was integrated with ballistic transport module and etch reaction model. Realistic etch-profile simulations with consideration of the sidewall polymer passivation layer were demonstrated.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2005년도 춘계학술대회 논문집
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• pp.641-644
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• 2005

The study on the interaction forces of some biological materials is important to understanding biological phenomena and their application to practical purpose. This paper introduces a measuring technique for biological adhesive forces using the AFM(Atomic Force Microscope). Since no standardized thesis on adhesive forces exist, the adhesive forces is defined as adhesive forces against a hardened surface of biological materials. To grant the results are meaningful, which is based on the understanding the surface characteristics of biological materials using the AFM, a nominal value of average adhesive force per unit area should be measured. Therefore the modified AFM probe with small micro glass bead was proposed so that it can guarantee the required contact area for measuring the average adhesive forces. A pyrex glass substrate with circular patterns, which was fabricated by micromachining technique, is introduced in order to controll the contact area. The two types of mussel adhesive proteins, Celltak and recombinant-MGFP5, were tested by the proposed measuring method. The test results show that the adhesive force of the mussel adhesive proteins can be reliably measured by use of this method.

• 대한의생명과학회지
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• 제22권4호
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• pp.115-126
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• 2016

Audiometric calibration is a prerequisite for securing the reliability of audiometric test results by checking the internal consistency of the relevant instrument. The purpose of this review is to help instrument operators understand the calibration procedure of aural acoustic immittance instrument which is frequently used for objective assessment. By referring to the latest international standards and the national standards relevant to the aural acoustic immittance instrument, the following parameters will be reviewed: 1) introduction of performance characteristics, 2) detailed procedure of the calibration method. According to the newest international and national standards [IEC 60645-5 (2004), ANSI S3.39-1987 (R2012)], the aural acoustic immittance instrument basically includes six components: 1) calibration cavity, 2) acoustic immittance analysis system, 3) probe assembly/unit and signal, 4) pneumatic air-pressure pump system, 5) acoustic reflex activator system and 6) tympanogram and acoustic reflex plotting system, each of these components should meet set standards. The result of behavioral hearing tests is influenced by various complex factors including the examinee's cooperation, background noise of the examination room, measurement method, skill level of the audiologist and calibration status, but the objective hearing tests is more influenced by the calibration status of the instrument than any other factors. The audiologist should take full responsibility for the reliability of the hearing test result, so he/she should carry out the calibration check and adjustments of aural acoustic immittance instrument periodically and maintain the instrument continuously by referring to the newest standards and the manufacturer's instruction manual.

• 한국정밀공학회지
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• 제16권2호통권95호
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• pp.201-210
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• 1999

One of the major limitations of productivity and quality in metal cutting is the machining accuracy of machine tools. The machining accuracy is affected by geometric and thermal errors of the machine tools. Therefore, a key requirement for improving te machining accuracy and product quality is to reduce the geometric and thermal errors of machine tools. This study models geometric error for error analysis and develops on-machine measurement system by which the volumetric erors are measured. The geometric error is modeled using form shaping function(FSF) which is defined as the mathematical relationship between form shaping motion of machine tool and machined surface. The constant terms included in the error model are found from the measurement results of on-machine measurement system. The developed on-machine measurement system consists of the spherical ball artifact (SBA), the touch probe unit with a star type stylus, the thermal data logger and the personal computer. Experiments, performed with the developed measurement system, show that the system provides a high measuring accuracy, with repeatability of ${\pm}2{\mu}m$ in X, Y and Z directions.

• 한국신재생에너지학회:학술대회논문집
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• 한국신재생에너지학회 2009년도 춘계학술대회 논문집
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• pp.357-360
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• 2009

The present study focused on the segmented cell which has the similar performance to unaltered (not segmented) cell in real operating condition. Many literatures have been made the segmented cell to observe the behavior of local current density distribution in the single cell. However, it has been lack of scheme to segment the cell in that the detailed interpretation of segmenting in analytic point of view was insufficient. Hence, the basic idea of segmenting was introduced to determine the component to be segmented in anode side of unit cell. The electrical contact/bulk resistance was measured by using four wire/probe method through each part of cell components including MEA, GDL, Bipolar Plate and Current Collector. Electron transport mechanism was predicted by comparing resistance values which were obtained from the experiment. As a result, this offered a great benefit to segment the cell efficiently. With this method further experiments would be conducted in research areas which require current density distribution at the same operating condition as unaltered cell.

• 대한전기학회논문지:전기물성ㆍ응용부문C
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• 제54권4호
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• pp.139-143
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• 2005

For application of carbon nano-tube (CNT) as a counter electrode materials of dye-sensitized solar cell (DSSC), the electrochemical behavior of CNT electrode was studied, employing cyclic-voltammetry (C-V) and impedance spectroscopy. Fabrication of CNT-paste and formation of CNT-counter electrode for characteristic measurement have been carried out using ball-milling and doctor blade process, respectively. Unit cell for measurements was assembled using Pt electrode, CNT electrode, and iodine-embedded electrolyte. Field emission-scanning electron microscopy (FE-SEM) was used for structural investigation of CNT powder and electrode. Sheet resistance of electrode was measured with 4-point probe method. Electrochemical properties of electrode, C-V and impedance spectrum, were studied, employing potentiogalvanostat (EG&G 273A) and lock in amplifier (EG&G 5210). As a results, the sheet resistance of CNT electrode is almost similar to that of F-doped SnO2 (FTO) coated glass substrate as approximately 10 ohm/sq. From C-V and impedance spectroscopy measurements, it was found that CNT electrode has high reaction rate and low interface reaction resistance between CNT surface and electrolyte. These results provides that CNT electrode were superior to that of conventional Pt electrode. Particularly, the reaction rate in the CNT electrode is about thrice high than Pt electrode. Therefore. CNT electrode is to be good candidate material for counter electrode in DSSC.

• Journal of Microbiology and Biotechnology
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• 제5권4호
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• pp.194-199
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• 1995

A portion (7.4 kb) of ribosomal DNA tandem repeat unit from a genome of the mushroom T. matsutake has been cloned. A 1.75 kb EcoRI fragment was cloned first using S. cerevisiae 255 rRNA gene as a probe, and this was then used for further cloning. A chromosomal walking experiment was carried out and the upstream region of the 1.75 kb fragment was cloned using SmaI/BamHI enzyme, the size was estimated to be 5.2 kb in length. Part of the downstream region of the 1.75 kb fragment was also cloned using XbaI/BamHI enzymes. Restriction enzyme maps of three cloned DNA fragments were constructed. Northern hybridization, using total RNA of T. matsutake, and the restriction fragments of three cloned DNAs as probes, revealed that all four ribosomal RNA genes (large subunit[LSU], small subunit [SSU], 5.85 and 5S rRNA genes) are present in the cloned region. The gene organization of the rDNA are regarded as an intergenic spacer [IGS]2 (partial) - SSU rRNA - internal transcribed spacer [ITS]1 - 5.8S rRNA - ITS2 - LSU rRNA - IGS1 -5S rRNA - IG52 (partial).

• 한국압력기기공학회 논문집
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• 제11권2호
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• pp.13-19
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• 2015

Steam generator is one of the most important component of nuclear power plant, and it's integrity and reliability are to be assured to high level by pre-service inspection and in-service inspection. To improve the reliability of steam generator heat exchanger tubes and to secure the management of nuclear power plant safely, KHNP CRI recently has developed eddy current testing system for steam generator. KHNP CRI have performed a series of experimental verification and field application to confirm the performance of the developed ECT system in accordance with ASME Code requirements. The ECT system consists of a remote data acquisition unit, an ECT signal acquisition and analysis software, a water chamber robot controller and a probe push-puller. In this paper, we will details of the developed ECT system and the software and their experimental performance. And also we will report the field applying performance and the issues for further steps.

• 한국생산제조학회지
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• 제23권6호
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• pp.636-641
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• 2014

This paper discusses the fabrication process for a Nipkow disk using micro-lens and pinhole disks. The confocal measuring system that uses the Nipkow disk has the advantage in measuring speed, because the Nipkow disk can simultaneously provide confocal images of all pixels in a CCD camera without requiring a lateral scanning unit. A micro-lens configuration, which focuses illumination on a pinhole, overcomes the low optical efficiency of the Nipkow disk system and allows its use in practical applications. This paper describes how to design the Nipkow disk in terms of numerical aperture, particularly for measuring the height of solder bumps in packaging application and for hybrid processes combining mechanical and semiconductor processes.