• Journal of Korea Technical Association of The Pulp and Paper Industry
• /
• v.44 no.1
• /
• pp.16-23
• /
• 2012

Use of security papers for monetary papers, gift certificates, and lottery tickets increases every year. As the use of security papers increase, there are more possibility of counterfeits. In this study, we used unique fibers from the sea to increase the difficulties against counterfeiting. The red algae fibers give opacity as much as calcium carbonates, and have unique shape in length ($500{\sim}900\;{\mu}m$) and width ($1{\sim}4\;{\mu}m$) to be discerned from other natural fibers such as wood and cotton fibers. We mixed red algae fibers to wood fibers in a series of fixed ratios to make single and multiply papers for making security papers. Paper with dyed red algae fibers were also used. Paper made without fillers gave enough opacity for printing when red algae fibers were used more than 20% of the fiber furnish. Those properties may allow red algae fibers to be a potential candidate for fiber raw materials of security paper.

• Proceedings of the Korean Vacuum Society Conference
• /
• 2010.08a
• /
• pp.287-287
• /
• 2010

We report a new direct patterning method, called liquid bridge-mediated nanotransfer molding (LB-nTM), for the formation of two- or three-dimensional structures with feature sizes between tens of nanometers and tens of micron over large areas. LB-nTM is based on the direct transfer of various materials from a mold to a substrate via a liquid bridge between them. This procedure can be adopted for automated direct printing machines that generate patterns of functional materials with a wide range of feature sizes on diverse substrates. Arrays of TIPS-PEN TFTs were fabricated on 4" polyethersulfone (PES) substrates by LB-nTM using PDMS molds. An inverted staggered structure was employed in the TFT device fabrication. A 150 nm-thick indium-tin oxide (ITO) gate electrode and a 200 nm-thick SiO2dielectric layer were formed on a PES substrate by sputter deposition. An array of TIPS-PEN patterns (thickness: 60 nm) as active channel layers was fabricated on the substrate by LB-nTM. The nominal channel length of the TIPS-PEN TFT was 10 mm, while the channel width was 135 mm. Finally, the source and drain electrodes of 200 nm-thick Ag were defined on the substrate by LB-nTM. The TIPS-PEN TFTs can endure strenuous bending and are also transparent in the visible range, and therefore potentially useful for flexible and invisible electronics.

• Journal of the Korean Society of Manufacturing Technology Engineers
• /
• v.25 no.5
• /
• pp.393-399
• /
• 2016

In this study, an experiment was conducted using a 3D scanner, commonly used in reverse engineering techniques, and the newly introduced CT measuring machine. The hole, width, and angle of specimens having various shapes were designated, the error rates in dimensional modelling generated during scanning with each device were compared, and the models were printed using a 3D printer. A secondary comparative analysis of the two printed specimens was conducted; the causes of dimension errors that occur during the printing process after scanning with each device and the differences associated with variation in shape were also analyzed. Based on the analysis results, the featured shape for each scanning application method and issues to consider in reverse engineering were presented, and the use of the CT measuring machine was recommended as a method to minimize error rates in dimensions and ensure efficient reverse engineering.

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2002.10a
• /
• pp.147-150
• /
• 2002

A light guide panel is an element of the LCD backlight module that is often used for the display of compact electronic devices. In this study, a laser marking system is proposed to fabricate light guide panel, which can be replaced of other manufacturing methods such as silk printing, stamping, and v-cutting methods. The objectives of this research are the establishment of laser marking system, evaluation of laser marking parameters, understanding marking process, application to PMMA, reliability test and quality inspection. A 50W $CO_2$ laser (CW) was used to perform different experiments in which, the influence of some processing parameters (average power, scanning speed) on the geometry and quality of groove pattern was studied. The width of the etched grooves increases with increasing a laser power and decreasing a scan speed. In order to analyze surface characteristics and optical properties (luminance, uniformity), SEM photography and BM7 (luminance measuring system) were used. As a result, the optimal conditions of the process parameters were determined.

• Journal of Welding and Joining
• /
• v.35 no.2
• /
• pp.6-12
• /
• 2017

Ti-alloys have high specific strength and are widely used for the filed of space aeronautics plant. However, it is difficult to process Ti-Alloys due to its high yield strength and it cannot raise the machining speed because it has a possibility of catching fire while processing. In order to reduce the number of processes for the Ti-alloys, the researches related to Additive Manufacturing(AM) have been actively carried out at the moment. As for the initial stage of AM market related to Ti-alloys, it started to use the raw material of powder metal, and it is currently being developed based on welding. In this study, Interpass peening reduced the size of the primary ${\beta}$ grain in the z-axis direction, increased the nucleation site of ${\alpha}-colony$, and decreased the length and width of ${\alpha}$ laths as though interpass rolling. Interpass peening leads to an increase in yield/ultimate tensile strength without decrease elongation, resulting decrease in anisotropy of the material.

• Journal of the Microelectronics and Packaging Society
• /
• v.8 no.3
• /
• pp.69-75
• /
• 2001

Photoimageable thick film technology is a new technology in that the lithography process such as exposure and development is applied to the conventional thick film process. Line resolution of 25 $\mu\textrm{m}$ width and 25 $\mu\textrm{m}$ space could be obtained by laminating green sheet, printing photoimageable Ag paste, exposing the test patterns, developing, and co-firing. In case of using the alumina substrate, 20 $\mu\textrm{m}$ fine line could be also obtained by similar process. Test results showed that exposing power density and developing time were the most important processing parameters for the fine line formation. Microstrip and series gap resonators with well-defined line morphology and good transmission characteristics in high frequency were formed by this new technology, and thereby dielectric constant and loss of test substrate were calculated.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.11 no.4
• /
• pp.281-287
• /
• 1998

$BiNbO_4$ ceramics doped with 0.07wt% $V_2O_5$ and 0.03wt% CuO (BNC3V7) were sucessfully sintered at $900^{\circ}C$ through the firing process with Ag electrode. The BNC3V7 shows typically Dielectric constant of 44.3, Thermal Coefficient of resonance Frequency(TCF) of 2 ppm/$^{\circ} and $Qxf_o$ value of 22,000 GHz. The laminated chip Low Pass Filter (LPF) is very sensitive to chip processing parameters, was confirmed by the computer simulation as a function of Q(Quality factors), filter size, capacitor layer thickness, inductor pattern widths. The multilayer type LPF was fabricated by screen-printing with Ag electrode after tape casting and then compared with the simulated characteristics. The results show that characterization of band pass width was similar to that of designed ones.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.15 no.5
• /
• pp.412-418
• /
• 2002

In this paper, the authors present the simulation results and the experimental considerations on the effects of the effects of the VCO oscillation characteristics caused by varying the length of the MSL and the composition capacitance of LC resonation circuity. Simulation was accomplished by nonlinear RF circuit simulator for designing and analyzing the RF characteristis of VCO. The samples with 3 different MSL lengths of which the length is 140mil, 280mil and 560mil respectively were fabricated by screen printing process. The oscillation frequency of each sample(VCO) was tuned to UHF band (750MHz~900MHz) by varying the capacitance of LC resonator circuit. The experimental results showed that the values of phase noise were -82, -93, -97[dBc/Hz] at 50[kHz] offset frequency, the pushing figures were 114, 94, 318[kHz] at applied voltage of $3\pm0.15$[V] and the harmonics were -21, -16, -13[dBc] for MSL lengths of 140mil 280mil, 560mil respectively. The frequency and output variation width were 779~898[MHz], -36~-33[dBm] for MSL with 140mil length; 818~836[MHz], -27.19~27.06[dBm] for 280mil; 751.54~751.198[MHz], -33.44~-33.31[dBm] for 560mil.

• Journal of Technologic Dentistry
• /
• v.42 no.4
• /
• pp.341-347
• /
• 2020

Purpose: This study aimed to evaluate the effect of post-curing method on the flexural strength of provisional restorative resins produced by a digital light processing printer. Methods: A total of 20 specimens were produced, with a length of 64 mm, width of 10 mm, and thickness of 3.3 mm using a digital light processing printer. Two types of provisional restorative resins made with different post-curing methods were investigated and divided into conventional and vacuum groups. For the flexural strength test, each group was prepared by each method according to ISO 10477, and the flexural strength was measured with a universal testing machine. For statistical analysis, data were analyzed by independent t-test and Mann-Whitney U test. Results: The flexural strengths of the conventional and vacuum groups were 151.89 MPa and 131.94 MPa, respectively, showing a statistically significant difference (p<0.05). Conclusion: Within the limitation of this study, provisional restorative resins produced with vacuum demonstrated lower flexural strength than those produced with conventional postcuring method.

• Journal of the Korean Society for Nondestructive Testing
• /
• v.36 no.1
• /
• pp.18-26
• /
• 2016

The semiconductor industry is one of the key industries of Korea, which has continued growing at a steady annual growth rate. Important technology for the semiconductor industry is high integration of devices. This is to increase the memory capacity for unit area, of which key is photolithography. The photolithography refers to a technique for printing the shadow of light lit on the mask surface on to wafer, which is the most important process in a semiconductor manufacturing process. In this study, the width and step-height of wafers patterned through this process were measured to ensure uniformity. The widths and inter-plate heights of the specimens patterned using photolithography were measured using transmissive digital holography. A transmissive digital holographic interferometer was configured, and nine arbitrary points were set on the specimens as measured points. The measurement of each point was compared with the measurements performed using a commercial device called scanning electron microscope (SEM) and Alpha Step. Transmission digital holography requires a short measurement time, which is an advantage compared to other techniques. Furthermore, it uses magnification lenses, allowing the flexibility of changing between high and low magnifications. The test results confirmed that transmissive digital holography is a useful technique for measuring patterns printed using photolithography.