• Journal of the Korea Fashion and Costume Design Association
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• v.22 no.2
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• pp.117-136
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• 2020

The purpose of this study is to analyze changes in high-tech fashion along with the types and characteristics of high-tech fashion that have appeared recently providing diverse material for the fashion field. High-tech fashion requires such research to learn how much distance one has in one's life. It is also meaningful to predict what direction high-tech fashion research may be needed. For research methods, previous research and literary studies were considered and photographs in which high-tech techniques were used were collected using the keyword 'high-tech fashion'. High-tech fashion types can be organized into the four types of luminescent types, mutual interaction types, 3D printing fashion, and virtual fashion. The research results were as follows. First, luminescent fashion was an important expression method of high-tech fashion. Materials for luminescent fashion first started with LED electric wire connections and many methods have been attempted with the appearance of electrically conductive clothing material, such as luminescent lasers and beam projectors. Second, interactive high-tech fashion often appears as variable fashion. The work of Hussein Chalayan, which was combined with advanced technology, set up a base for variable type interactive high-tech fashion in the 2000s. As bioengineering technology has developed, fashion that interacts with the environment without an energy source has appeared and the interaction among fashion, people, and the environment can be seen. Third, diverse forms of expressiveness in virtual reality such as 3D CLO shows a great difference with past high-tech fashion. Simple and diverse attempts made through virtual fittings reduce the limitations of time and space, permit interaction, and add a sense of reality through speed and dynamic physical beauty. Fourth, 3D printed fashion expresses complex and detailed clothing material that is different from those before with the development of computer 3D modeling technology. Modeling that can imitate geometric and bio-engineered structures is possible and mysterious feelings are passed on to people through creative expressions.

• Journal of Korea Technical Association of The Pulp and Paper Industry
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• v.32 no.4
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• pp.49-57
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• 2000

This study was carried out to investigate the effect of the type of base papers containing rice straw-BKP on the properties and printabilities of coated papers. Also, it was intended to evaluate the effect of coated paper prepared with anionic and amphoteric latex based coating color. The results obtained from this study were as follows. The fiber length of rice straw-BKP was observed much shorter than those of the wood pulps(Sw-BKP, Hw-BKP). This has effect on physical properties. Therefore, the results of measured physical properties were much lower than those of wood pulps. Also, physical properties tended to increase slightly with the increase of the mixing ratio of Sw-BKP. Opacity of the base paper containing rice straw-BKP, was higher than that of the wood pulps. As the mixing ratio of Sw-BKP increases the opacity tended to decrease. On the other hand, smoothness and roughness to rice straw-BKP were similar with Sw-BKP and its air permeability was lower than those of wood pulps. The optical properties of coated papers containing rice straw-BKP tended to be similar to those of other base papers. The ink receptivity of coated papers containg rice straw-BKP was higher than those of wood pulps and printing gloss was similar to wood pulps. The mixing ratio of Sw-BKP, the ink receptivity and printing gloss of rice straw-BKP were showed no difference irrespective the mixing ratio of Sw-BKP. Meannwhile, amphoteric latex improved the optical properties and printability of coated papers.

• Proceedings of the Materials Research Society of Korea Conference
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• 2012.05a
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• pp.92-92
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• 2012

Chalcopyrite-type Cu(In,Ga)Se2 (CIGS) is one of the most attractive compound semiconductor materials for thin film solar cells. Among various approaches to prepare the CIGS thin film, the powder process offers an extremely simple and materials-efficient method. Here, we present the mechano-chemical synthesis of CIGS compound powders and their use as an ink material for screen-printing. During the synthesis process, milling time and speed were varied in the range of 10~600 min and 100~300 rpm, respectively. Both phase evolution and powder characteristics were carefully monitored by X-ray diffraction (XRD) method, scanning electron microscope (SEM) observation, and particle size analysis by scanning mobility particle spectrometer (SMPS) and aerodynamic particle sizer (APS). We found the optimal milling condition as 200 rpm for 120 min but also found that a monolithic phase of CIGS powders without severe particle aggregation was difficult to be obtained by the mechano-chemical milling alone. Therefore, the optimized milling condition was combined with an adequate heat-treatment (300oC for 60 min) to provide the monolithic CIGS powder of a single phase with affordable particle characteristics for the preparation of CIGS thin film. The powder was used to prepare an ink for screen printing with which dense CIGS thin films were fabricated under the controlled selenization. The morphology and electrical properties of the thin films were analyzed by SEM images and hall measurement, respectively.

• Archives of design research
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• v.15 no.1
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• pp.359-368
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• 2002

Fabric art is most distinguished field among the Modern art. Among them, tapestry which begins human history is investigated more and more deeply and till now it displays with various type and exhibition. But, because of the huge scale of the working process, it requires much time and hard endeavor. After sampling, it begins main process in the present situation. But we cannot know exactly whether it goes well or not until it ends. So after fulfilled whole process, we often try new work again. Because of this reason, we devise computer simulation. With computer simulation we can preview whole working and lengthen the planning time, shorten the needless time. Simulation is made up of Scan, Drawing, Line clean up, Rendering, Parity, and Printing. Scan and Drawing can male new idea. And during the Line clean up we can make vector image and modify the image. And then rendering the image and inquiring the length and weight of yarn. Last process is printing an then making a package soft ware by means of prototype. Through these process, many producers and student can easily access to tapestry and reduce the needless time and endeavor.

• Journal of the Korean Society for Library and Information Science
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• v.28
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• pp.71-81
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• 1995

There are no exact copies or carvings of India's original Buddhist Scripts published in Korea that had been flowed into Japan except those of WanSanJungUiMongSanPuPo(환산정의몽산법어). YaWoonJaKyung (야운자경). KyeChoShimHakInMoon(계초심학인문) PalSimSooHangChang(발심수행장) and MongsanWhaSangPupoRackLock published by a mid-Chosun Dynasty Buddhist monk, YaWoon TaesunSa. Others are the translations by Chinese people. All printings were of woodblock except ChonjimyungYangsoo- RhockChapMoon(천지명양수육잡문) of Inkyng wood printing type. This shows perhaps that the Buddhists were so devout that they spared no effort in their prayers to head for the Paradise. Even the woodblock carver himself took his hard work for granted in his belief and engraved the blocks with all his heart taking his work as God-given task. Or. perhaps they to use wood-block printing as the demand for the Scripts soared. By the way. as the Koryo Dynasty took Buddhism as the state religion, it was natural that the Buddhist Scripts were published at TaeJangToKam (the publishing office) and were much encouraged. It is noteworthy. however, that not a few Buddhist Scripts had been published during the Chosun Dynasty despite its crack-down on Buddhism as the Confucianism was declared as the state principle. The Scripts were even published by such temples as MoonJooSa(문수사), MyoHeeAm(묘희암). SsangbongSa(쌍봉사). PyoHoonSa(표훈사), YooJupSa(유점사), YongJangSa(용장사). and AnShimSa(안심사). The fact that the Scripts were even published by KanKyungToKam(간경부감) leads us to reconsider the traditional way of thinking of the Chosun Dynasty as anti-Buddhist or flunkeyist. The historical fact that a record number of Buddhist publications had been transmitted to Japan - is it accidental? - This issue could well be another subject matter for further research. However, it should be noted that very few of above­mentioned Buddhist Scripts are found in present-day Korea.

• Clean Technology
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• v.14 no.1
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• pp.21-28
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• 2008

The properties of the dispersion of the red, green, and blue pigments were investigated for the manufacture of the millbase of LCD color filters. Their physical properties and viscosity were controlled to apply to the screen printing in order to substitute the existing photolithography method. The best dispersion properties were obtained with dispersant BYK-2000 and monomer EB-140. The millbase was pre-mixed at 500 rpm for 30 min, and dispersed at 4000 rpm for 5 - 6 hour by Torus Mill. The resulting particle sizes were $100{\sim}110\;nm$ for red, $50{\sim}70\;nm$ for green, and $60{\sim}80\;nm$ for blue. When the millbase viscosity was 200-300 cps in the low viscosity formulation, an efficient impact of the beads on pigments was achieved. The dispersion properties were confirmed from the rheological behavior and color characteristics.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.25 no.10
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• pp.849-856
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• 2012

Chip on board type white light emitting diode on metal core printed circuit board with high thixotropy silicone is fabricated by vacuum printing encapsulation system. Encapsulant is chosen by taking into account experimental results from differential scanning calorimeter, shearing strength, and optical transmittance. We have observed that radiant flux and package efficacy are increased from 336 mW to 450 mW and from 11.9 lm/W to 36.2 lm/W as single dome diameter is varied from 2.2 mm to 2.8 mm, respectively. Double encapsulation structure with 2.8 mm of dome diameter shows further significant enhancement of radiant flux and package efficacy to 667 mW and 52.4 lm/W, which are 417 mW and 34.8 lm/W at single encapsulation structure, respectively.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.23 no.7
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• pp.571-574
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• 2010

Surface recombination loss should be reduced for high efficiency of solar cells. To reduce this loss, the BSF (back surface field) is used. The BSF on the back of the p-type wafer forms a p+layer, which prevents the activity of electrons of the p-area for the rear recombination. As a result, the leakage current is reduced and the rear-contact has a good Ohmic contact. Therefore, the open-circuit-voltage (Voc) and fill factor (FF) of solar cells are increased. This paper investigates the formation of the rear contact process by comparing aluminum-paste (Al-paste) with pure aluminum-metal(99.9%). Under the vacuum evaporation process, pure aluminum-metal(99.9%) provides high conductivity and low contact resistance of $4.2\;m{\Omega}cm$, but It is difficult to apply the standard industrial process to it because high vacuum is needed, and it's more expensive than the commercial equipment. On the other hand, using the Al-paste process by screen printing is simple for the formation of metal contact, and it is possible to produce the standard industrial process. However, Al-paste used in screen printing is lower than the conductivity of pure aluminum-metal(99.9) because of its mass glass frit. In this study, contact resistances were measured by a 4-point probe. The contact resistance of pure aluminum-metal was $4.2\;m{\Omega}cm$ and that of Al-paste was $35.69\;m{\Omega}cm$. Then the rear contact was analyzed by scanning electron microscope (SEM).

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.27 no.10
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• pp.623-629
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• 2014

For the semiconductor device safety from over current in the digital electronic circuit system must be surely designed that it's surface mount type micro fuse device. In this paper, We has analysed to the fusing character of micro fuse as a function changed thickness of thermosetting ink epoxy. To the change of thermosetting ink epoxy thickness with in production lot, in the electrically character (fusing test in the 2 multiple over current and 10 multiple over current, surface temperature test in the 1.25 multiple over current) of micro fuse has been tested. According to the electrically character result, changed thickness of thermosetting ink epoxy in designed micro fuse withheld direct effect in both end resistance changes. Also, because high thermal energy in the micro fuse test of over current was occurred to effect such as thermal runaway and explosion. Therefore, screen printing process in the design of micro fuse using thermosetting ink epoxy is very important for production quality improvement.

• Journal of the Korean Society of Clothing and Textiles
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• v.45 no.1
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• pp.106-122
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• 2021

This study confirmed the mechanical properties of an auxetic re-entrant pattern prepared using 3D printing technology and its composite fabric with neoprene for the production of functional auxetic patterns/textiles for safety shoes. Samples were prepared by the tilt angle of a re-entrant pattern of 0°, 30°, 45°, 60° and 90°, and then analyzed using Poisson's ratio, bending, compression, and tensile properties. A 3D printed auxetic re-entrant pattern (3DP-RE) and its composite fabric (3DP-RE/NP) showed a negative Poisson's ratio in all tilting angles that indicated auxetic properties. The results of the bending property shown that strength of 3DP-RE/NP was 1.5 times lower than NP, but the strain improved 2.0 times. It was confirmed that the deformation of 3DP-RE/NP is possible with a low load. Each sample type of compression behavior indicated similar regardless of the tilting angles; in addition, the compression toughness of 3DP-RE/NP increased 1.2 times compared with NP. In the case of tensile properties, 3DP-RE and 3DP-RE/NP were affected by the tilting angle, samples with 90° (the opposite of load direction) showed best tensile property and toughness. 3DP-RE/NP indicated improved bending, compression, and tensile properties.