• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2006.10a
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• pp.179-212
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• 2006

1. $Welco^{(R)}$ Ultra fine solder powders are suitable for wafer bumping applications; mass production of ultra fine powders with high quality and high yield. - UFP based pastes for wafer bumping by stencil printing ($60-80{\mu}m$ pitch) are now available - Residue free solder flux was developed; meets voids specification of 20%. - F645 type 5 paste is suitable for components 01005

• Journal of Sericultural and Entomological Science
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• v.32 no.2
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• pp.110-112
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• 1990

The influence of the concetration of the discharging agent on some properties of silk fabric dyed with reactive dyes studied. The tensile strength, yellow index and whiteness were investigated as parameters to determine the effect of the dischanging agent. The results were summarized as follows ; 1. The tensile strength and the yellow index decreased with the increase of the concentration of the discharging agents. 2. The whiteness depended on both of the type and the concentration of the discharging agent.

• Journal of Korea Technical Association of The Pulp and Paper Industry
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• v.30 no.1
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• pp.95-103
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• 1998

Many new technologies and developments designed to increase paper machine speeds and improve paper printability have emerged in recent years. These improvements have changed the structure of paper and given winder manufacturers new challenges, especially as the requirements of printing presses have also changed. Ever-increasing roll widths and diameters are needed. Along with faster press speeds and shorter acceleration times, the unwinding of roils in the press room has become a true test of paper strength and roll structure, In the following we will review the special winding features of coated papers and discuss a selection of the winder type to meet a mill's specific needs.

• Proceedings of the Korean Institute of IIIuminating and Electrical Installation Engineers Conference
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• 2000.11a
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• pp.60-63
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• 2000

In this paper, 7-segment was implemented using AC powder EL. ZnS:Cu and BaTiO3 was used as a phosphor and dielectric respectively. The preparation of phosphor and dielectric layer was performed with screen printing. The implemented system of 7-segment was divided as following; EL display, driving circuit, software for driving. The properties of fabricated devices was measured with EL spectrum and brightness.

• Journal of the Semiconductor & Display Technology
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• v.3 no.1
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• pp.27-30
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• 2004

In this work, the variation of the sidewall profile of a thick photoresist on the wavelength and proximity gap was investigated. PMER P-LA900PM, DNQ (DiazoNaphthoQuinone) novolac type photoresist, is used for experiments. The calculated results agreed well with the experimental results.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.14 no.5
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• pp.15-21
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• 2015

The glass used for Mobile Camera Window is required to have high strength. Cell type manufacturing by means of CNC is widely used for camera window. Individual loading and unloading is needed for each process, such as painting and PVD, in cell type manufacturing. The purpose of this study is to search the enhanced manufacturing process with sheet type throughout bulk unit production in painting and PVD. This study includes sheet type manufacturing processes such as laser cutting, wet etching, 2nd tempering, printing, and AF/AR coating.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.17 no.3
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• pp.57-65
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• 2016

Academia-industrial cooperation policy is essential to enhance national competitiveness in Korea. Although government and academia have invested in policies and supported industries, academia-industrial cooperation is not operated actively. This is one of the reasons why industrial demand for cooperation has continuously decreased. There are thoughts that universities' outcomes are larger than colleges' outcomes in academia-industrial cooperation, which could be a barrier to academia-industrial cooperation for colleges. It is important to understand industry demands in order to activate this type of cooperation. We propose a way to achieve this based on survey data for 3D printing and college graduates. Interactive cooperation among industries, colleges, and universities is suggested in the process of technical commercialization, such as TRL (Technology Readiness Level).

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.15 no.6
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• pp.83-88
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• 2016

Over the last five years, 568 people have died while hiking according to 2015 statistics from the public safety ministry. Among those deaths, approximately 33% were due to loss of footing or falling. In this respect, the highly advanced functions of hiking boots should be considered to prevent these unfortunate accidents. For example, by utilizing the Internet of Things (IoT) and Information and Communications Technology (ICT), hiking boots equipped with a Global Positioning System (GPS) or vital signs monitoring systems should be considered. In addition, many challenges remain for the production of 3D printed hiking boots, because the functions of hiking boots are variable, which is important when handling changing terrains and situations. The design of customized hiking boots was introduced in this paper, and 3D printing applications for midsoles using a Porous Polymer Printing (PPP) method was also suggested to verify the possibility of manufacturing hiking boots.

• Journal of Biomedical Engineering Research
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• v.39 no.1
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• pp.22-29
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• 2018

Intervertebral disc(IVD) mainly consists of Annulus fibrosus(AF) and Nucleus pulposus(NP), playing a role of distributing a mechanical load on vertebral body. IVD tissue engineering has been developed the methods to achieve anatomic morphology and restoration of biological function. The goal of present study is to identify the possibilities for creating a substitute of IVD the morphology and biological functions are the same as undamaged complete IVD. To fabricate the AF and NP combine biphasic IVD tissue, AF tissue scaffolds have been printed by 3D bio-printing system with natural biomaterials and NP tissues have been prepared by scaffold-free culture system. We evaluated whether the combined structure of 3D printed AF scaffold and scaffold-free NP tissue construct could support the architecture and cell functions as IVD tissue. 3D printed AF scaffolds were printed with 60 degree angle stripe patterned lamella structure(the inner-diameter is 5mm, outer-diameter is 10 mm and height is 3 mm). In the cytotoxicity test, the 3D printed AF scaffold showed good cell compatibility. The results of histological and immunohistochemical staining also showed the newly synthesized collagens and glycosaminoglycans, which are specific makers of AF tissue. And scaffold-free NP tissue actively synthesized glycosaminoglycans and type 2 collagen, which are the major components of NP tissue. When we combined two engineered tissues to realize the IVD, combined biphasic tissues showed a good integration between the two tissues. In conclusion, this study describes the fabrication of Engineered biphasic IVD tissue by using enable techniques of tissue engineering. This fabricated biphasic tissue would be used as a model system for the study of the native IVD tissue. In the future, it may have the potential to replace the damaged IVD in the future.

• 한국태양에너지학회:학술대회논문집
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• 2011.11a
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• pp.34-39
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• 2011

Screen printing method is a common way to fabricate the crystalline silicon solar cell with low-cost and high-efficiency. The screen printing metallization use silver paste and aluminum paste for front and rear contact, respectively. Especially the rear contact between aluminum and silicon is important to form the back surface filed (Al-BSF) after firing process. BSF plays an important role to reduces the surface recombination due to $p^+$ doping of back surface. However, Al electrode on back surface leads to bow occurring by differences in coefficient of thermal expansion of the aluminum and silicon. In this paper, we studied the properties of mono crystalline silicon solar cell for rear electrode with aluminum and aluminum-boron in order to characterize bow and BSF of each paste. The 156*156 $m^2$ p-type silicon wafers with $200{\mu}m$ thickness and 0.5-3 ${\Omega}\;cm$ resistivity were used after texturing, diffusion, and antireflection coating. The characteristics of solar cells was obtained by measuring vernier callipers, scanning electron microscope and light current-voltage. Solar cells with aluminum paste on the back surface were achieved with $V_{OC}$ = 0.618V, JSC = 35.49$mA/cm^2$, FF(Fill factor) = 78%, Efficiency = 17.13%.