• 한국정밀공학회지
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• 제18권2호
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• pp.140-145
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• 2001

The tape carrier package(TCD) is one of the most important components in a liquid crystal display(LCD) module. It has a role to transmit electrical signals from a printed circular board(PCB) to a display panel. If TCP is damaged under mechanical shock, the signals can not be transmitted to the panel and as a result, some dead lines are generated on the panel. This kind of phenomenon is commonly called as 'line defects'. In this paper, new structural design concepts of TCP are proposed to guarantee its reliability by using Taguchi's approach and dynamic FE-analysis. The line defects problem of TCP module is solved by replacing the original TCP with the newly designed one.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2000년도 제1회 학술대회 논문집
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• pp.53-54
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• 2000

Measurements of the direct current resistivity, on multiwalled carbon nanotubes(MWNT) for field electron emitter source that had been screen printed in a thick film form were made as a function of temperature T in the range of 1.7K-390K. In this measuring temperature range, the electrical resistivity for the MWNT show that the main contribution to the conductivity comes form carries that hop directly between localized states executing variable range hopping processes. This thick-film form system for large area display showed a high bright light emission as well as very low turn-on field as like an individual MWNT system at room temperature. Furthermore, the electron emission characteristics followed well typical Fowler-Nordheim conduction under the vacuum.

• 반도체디스플레이기술학회지
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• 제4권4호
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• pp.27-31
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• 2005

This article contains the development of FPC bonder that used for repair or trial product. Nowadays, in FPO module process (including PDP) accept the thermo-compress bonding method when attach FPC(Flexible Printed Circuit Board), TCP(Tape Carrier Package) and COF(Chip on the FPC) by ACF(Anisotropic Conductive Film). This system consists of ACF attachment part, pre-bonding part, main bonding part, loading / unloading part. This composition is a stand-alone system, not an in-line system. Hereafter, this composition should be developing into in-line system in all area of FPD industry.

• 반도체디스플레이기술학회지
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• 제14권3호
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• pp.57-60
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• 2015

Electric power in large devices is controlled by digital circuits, such as switching mode power supply. This kind of power circuits require accurate current sensor for power distribution. We studied characteristics of shunt resistor, which has many advantages for commercial application compared to Hall-effect current sensor. We applied ceramic package to the shunt resistor. Ceramic package has good thermal conductivity compared to plastic package, and this point is important for space requirement in Printed Circuit Board (PCB). Another advantage of the ceramic package is that surface mount technology (SMT) can be used for production. Our experimental results showed that the ceramic packaged resistor showed about 50% lower temperature than the plastic packaged one. Burning point and frequency characteristics are also discussed.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2003년도 추계학술대회 논문집 Vol.16
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• pp.76-79
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• 2003

The characteristic of single wall carbon nanotube (SW-CNT) and herringbone nano fiber (HB-CNF) emitters was described. SW-CNT synthesized by arc discharge and HB-CNF prepared by thermal CVD were mixed with binders and conductive materials, and then were formed by screen-printing process. In order to obtain efficient field emissions, the surface treatment of rubbing & peel-off was applied to the printed CNT and CNF emitters. The basic structure of FED was of a diode type through fully vacuum packaging. Also, we proposed a new triode type of field emitter using a mesh gate plate having tapered holes and could achieve the ideal triode properties with no gate leakage currents.

• 반도체디스플레이기술학회지
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• 제8권2호
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• pp.15-21
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• 2009

Atmospheric pressure plasma equipment was successfully applied to the flip chip BGA manufacturing process to improve the uniformity of flux printing process. The problem was characterized as shrinkage of the printed flux layer due to insufficient surface energy of the flip chip BGA substrate. To improve the hydrophilic characteristics of the flip chip BGA substrate, remote DBD type atmospheric pressure plasma equipment was developed and adapted to the flux print process. The equipment enhanced the surface energy of the substrate to reasonable level and made the flux be distributed over the entire flip chip BGA substrate uniformly. This research was the first adaptation of the atmospheric pressure plasma equipment to the flip chip BGA manufacturing process and a lot of possible applications are supposed to be extended to other PCB manufacturing processes such as organic cleaning, etc.

• 반도체디스플레이기술학회지
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• 제18권2호
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• pp.92-97
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• 2019

In this paper, we investigated the problems and solutions in the production of scaffolds using commercially available FDM 3D printers. We used ADRIGE TRIZ algorithm to systematically analyze the problems and suggest solutions. We printed scaffolds using suggested solutions. We measured the pore size and printing time of the scaffolds. We have confirmed that the printing precision is greater than 99% and the printing time is decreased by half. The suggested solutions proved its validity through experiments and showed satisfactory results.

• 반도체디스플레이기술학회지
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• 제17권4호
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• pp.101-104
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• 2018

Augmented Reality (AR) is an emerging technology and the applications of technology are still not fully unveiled. This paper explores a new application of augmented reality for new direction in art exhibitions, which aims to bring interactive learning experience to life. The project takes printed images on book or exhibiting arts to the next level by applying AR technology to provide a unique fascinating experience to its readers on mobile devices. AR technology composing with animation brings new digital entertainment experience to the user of art exhibitions. The key feature of this paper uses the technology presents auxiliary information in the field of view of an object on art exhibitions automatically without human intervention.

• 반도체디스플레이기술학회지
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• 제16권3호
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• pp.36-40
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• 2017

In this paper, a new method of laser trimming of thick film heater is studied. Various laser waves (IR, Green, UV) are used to ablation the heater and the process parameters are also presented. For given initial printed resisters, the cutting length should be prepared to obtain the target resister value in advance. Therefore, the cutting model is very important. The well-known model was tested and proven that it is valid only within a certain range of cutting length. A new model is proposed for a wide range of resister laser trimming. The cutting lengths and resister variation was obtained and formulated. To verify the presented method, the cutting lengths of each resister are calculated for various target resister value and laser trimming using UV is conducted.

• 반도체디스플레이기술학회지
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• 제19권4호
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• pp.59-64
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• 2020

In this paper, we found the solution using data based machine learning regression method to check the pore shape, to solve the problem of the experiment quantity occurring when producing scaffold with the 3d printer. Through experiments, we learned secured each print condition and pore shape. We have produced the scaffold from scaffold pore shape defect prediction model using multiple linear regression method. We predicted scaffold pore shapes of unsecured print condition using the manufactured scaffold pore shape defect prediction model. We randomly selected 20 print conditions from various predicted print conditions. We print scaffold five times under same print condition. We measured the pore shape of scaffold. We compared printed average pore shape with predicted pore shape. We have confirmed the prediction model precision is 99 %.