• 한국재료학회지
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• 제19권2호
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• pp.55-60
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• 2009

In this study, Ti powder was fabricated from Ti scrap by a hydrogenation-dehydrogenation (HDH) method. The Ti powders were compacted by Spark plasma sintering (SPS) and the microstructure and mechanical properties of the powders were investigated. A hydrogenation reaction of Ti scrap occurred at temperatures near $450^{\circ}C$ with a sudden increase in the reaction temperature and a decrease in the pressure of the hydrogen gas as measured in a furnace during the hydrogenation process. In addition, a dehydrogenation process was carried out at $750^{\circ}C$ for 2hrs in a vacuum of $10^{-4}torr$. The Ti powder sizes obtained by hydrogenation-dehydrogenation and mechanical milling processes were in the range of $1{\sim}90{\mu}m$ and $1{\sim}100{\mu}m$, respectively. To fabricate Ti compacts, Ti powders were sintered under an applied uniaxial punch pressure of 40 MPa at in a range of $900{\sim}1200^{\circ}C$ for 5 min. The relative density of a SPSed compact was 99.6% at $1100^{\circ}C$, and the tensile strength decreased with an increase in the sintering temperature. However, the hardness increased as the sintering temperature increased.

• 한국분말재료학회지
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• 제4권4호
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• pp.283-290
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• 1997

$Ti_5Si_3$ intermetallics containing 0-6 wt% of Cu were made by reactive sintering (RS) under vacuum using elemental powder mixtures (Process 1), electro-pressure sintering (EPS) using RS'ed materials (Process2), and EPS using elemental powder mixtures (Process 3). Relatively low dense titanium silicides were gained by process 1, in which porosity decreased with increasing Cu content. For example, porosity changed from 42 to 19.4% with the increase in Cu content from 0 to 6 wt%, indicating that Cu is a useful sintering aid. The titanium silicides fabricated by Process 2 had a higher density than those by Process 1 at given composition, and porosity decreased with increasing Cu content. For example, porosity decreased from 38 to 6.8% with the change in Cu content from 0 to 6 wt%. A high dense titanium silicides were obtained by Process 3. In this Process, porosity decreased a little by Cu addition, and was almost insensitive to Cu content. Namely, about 9 or 7% of porosity was shown in 0 or 1-6 wt% Cu containing silicides, respectively. The hardeness increased by Cu addition, and was not changed markedly with Cu content for the silicides fabricated by Process 3. This tendency was considered to be resulted from porosity, hardening of grain interior by Cu addition, and softening of grain boundary by Cu-base segregates. All these results suggested that EPS using elemental powder mixtures (Process 3) is an effective processing method to achieve satisfactorily dense titanium silicides.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2000년도 하계학술대회 논문집
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• pp.365-368
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• 2000

We have studies on the Microstructures and densities as a function of forming pressures and the magnetic properties of the specimens with additive Bi$_2$O$_3$ that sintered at 95$0^{\circ}C$ for 4.5 hours for synthesizing optimal Ni-Cu-Zn ferrite. Green density rose generally as Forming pressure increased from 1.7 ton/cm$^2$to 2.5 ton/cm$^2$and Cold Isostatic Pressure(CIP) method was more effective than Die Pressure(DP) method to high green density. Forming pressure had no influence on apparent density but on the other hand Bi$_2$O$_3$contents were strongly dominant to appaernt density than forming pressure. Bi$_2$O$_3$liquid phases created during sintering process promoted sintering and grain growth so that apparent density, grain size and permeability increased compared to that of the specimens which were sintered with non-additive Bi$_2$O$_3$.

• 한국분말야금학회:학술대회논문집
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• 한국분말야금학회 2006년도 Extended Abstracts of 2006 POWDER METALLURGY World Congress Part 1
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• pp.87-88
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• 2006

Ceramic-Metal Functionally Graded Materials (FGM) are of great interest for application as Thermal Barrier Coating (TBC) or Wear Resistant Coating (WRC). Spark Plasma Sintering (SPS) is a promising techniques for time-saving consolidation of laminated/graduated powder systems: SPS is a pressure-assisted electrical sintering method which directly applies a pulsed DC current as heat source. In the present work, production of $Al_2O_3-Ni$ FGMs by means of Spark Plasma Sintering is considered; effect of sintering condition on density, hardness and fracture toughness is studied. Problems correlated to this new processing technology are discussed.

• 한국분말야금학회:학술대회논문집
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• 한국분말야금학회 2003년도 international symposium on advanced powder metallurgy
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• pp.39-40
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• 2003

1) Using a developed high-frequency induction heated sintering method, the rapid densification of WC-Co hard materials was accomplished using ultra fine powders with 260 nm size within 1 minute. 2) The relative density of the composite was 99.5% for the applide pressure of 60MPa and the induced current for 90% output of total capacity. 3) The grain size of WC-Co hard materials is about 260nm and the average thickness of the binder phase determined is about 11nm. The fracture toughness and the hardness of this work 12 $MPa{\cdot}nm^2$, respectively. 4) Using pressureless sintering, we produced dense WC-Co hard materials with a relative density of 97% without applying pressure.

• 한국윤활학회:학술대회논문집
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• 한국윤활학회 2000년도 제32회 추계학술대회 정기총회
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• pp.304-309
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• 2000

Si$_3$N$_4$-6wt%Y$_2$O$_3$-lwt%Al$_2$O$_3$was prepared by hot pressed and gas pressure sintering to investigate the effect of microstructure on erosion behaviors. Hardness and fracture toughness were measured with prepared specimens to study the high temperature erosion properties. A gas blast type erosion tester was used In examine erosion behavior of the specimens up to 700$^{\circ}C$. In case of GPS silicon nitride, the erosion rate increases up to 500$^{\circ}C$ and decreases over 500$^{\circ}C$. Maximum erosion rate was observed at 300$^{\circ}C$ for HP silicon nitride. The principal factors affecting the high temperature erosive wear of brittle materials are largely dependent on high temperature properties of grain boundaries.

• 한국분말재료학회지
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• 제21권6호
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• pp.447-453
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• 2014

Effect of oxygen content in the ultrafine tungsten powder fabricated by electrical explosion of wire method on the behvior of spark plasma sintering was investigated. The initial oxygen content of 6.5 wt% of as-fabricated tungsten powder was reduced to 2.3 and 0.7 wt% for the powders which were reduction-treated at $400^{\circ}C$ for 2 hour and at $500^{\circ}C$ for 1h in hydrogen atmosphere, respectively. The reduction-treated tungsten powders were spark-plasma sintered at $1200-1600^{\circ}C$ for 100-3600 sec. with applied pressure of 50 MPa under vacuum of 0.133 Pa. Maximun sindered density of 97% relative density was obtained under the condition of $1600^{\circ}C$ for 1h from the tungsten powder with 0.7 wt% oxygen. Sintering activation energy of $95.85kJ/mol^{-1}$ was obtained, which is remarkably smaller than the reported ones of $380{\sim}460kJ/mol^{-1}$ for pressureless sintering of micron-scale tungsten powders.

• 소성∙가공
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• 제16권3호
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• pp.210-214
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• 2007

Manufacturing bulk nanostructured materials with least grain growth from initial powders is challenging because of the bottle neck of bottom-up methods using the conventional powder metallurgy via compaction and sintering. In the study, densification behavior of nano Cu powders during pressureless sintering was investigated using an in-situ optical dilatometer technique. The initial heating and steady temperature stages during the sintering of nano Cu powder compacts were observed. At the initial heating stage, the powder compact has many porosities and full densification needs high temperature and/or high pressure sintering. In the experimental analysis, changes in geometry and density were measured and discussed for optimal consolidation and densification by the in-situ optical dilatometer.

• 한국재료학회지
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• 제30권2호
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• pp.93-98
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• 2020

Effective control of the heat generated from electronics and semiconductor devices requires a high thermal conductivity and a low thermal expansion coefficient appropriate for devices or modules. A method of reducing the thermal expansion coefficient of Cu has been suggested wherein a ceramic filler having a low thermal expansion coefficient is applied to Cu, which has high thermal conductivity. In this study, using pressureless sintering rather than costly pressure sintering, a polymer solution synthesis method was used to make nano-sized Cu powder for application to Cu matrix with an AlN filler. Due to the low sinterability, the sintered Cu prepared from commercial Cu powder included large pores inside the sintered bodies. A sintered Cu body with Zn, as a liquid phase sintering agent, was prepared by the polymer solution synthesis method for exclusion of pores, which affect thermal conductivity and thermal expansion. The pressureless sintered Cu bodies including Zn showed higher thermal conductivity (180 W/m·K) and lower thermal expansion coefficient (15.8×10^-6/℃) than did the monolithic synthesized Cu sintered body.

• 한국세라믹학회지
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• 제36권1호
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• pp.61-68
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• 1999

층상구조를 이루는 재료의 소결시 형성되는 다양한 결함 및 잔류응력을 고찰하기 위해 TZP-SUS계 및 ZT/SUS계다층재료와 porcelain/alumina 및 porcelain/Y-TZP 이층재료를 소결법으로 제조하였다. 상압소결로 제조한 다층재료에서는 층간의 소결수축율 차이에 의해 warping, splitting, 균열 등의 소결결함이 관찰되었으며, 중간층수 및 두께의 조절과 출발물질의 제어를 통해 이러한 소결결함이 완화됨을 알 수 있었다. Tape casting법으로 제조한 다층재료에서는 소결시 가한 압력에 의해 소결결함, 특히 warping이 제어됨을 확인할 수 있었다. 이층재료에서 형성되는 잔류응력은 vickers 압입법으로 관찰하였다. Porcelain/alumina에서는 porcelain 측의 계면에 작은 인장응력이, porcelain/Y-TZP에서는 압축응력이 형성됨을 확인할 수 있었으며, 이러한 잔류응력은 이층재료의 강도에도 영향을 미침을 알수 있었다. 결국 다층재료의 소결결함 및 잔류응력은 재료설계와 출발물질 상수에 영향을 받는다는 것을 알 수 있었다.