Abstract
Si$_3$N$_4$-6wt%Y$_2$O$_3$-lwt%Al$_2$O$_3$was prepared by hot pressed and gas pressure sintering to investigate the effect of microstructure on erosion behaviors. Hardness and fracture toughness were measured with prepared specimens to study the high temperature erosion properties. A gas blast type erosion tester was used In examine erosion behavior of the specimens up to 700$^{\circ}C$. In case of GPS silicon nitride, the erosion rate increases up to 500$^{\circ}C$ and decreases over 500$^{\circ}C$. Maximum erosion rate was observed at 300$^{\circ}C$ for HP silicon nitride. The principal factors affecting the high temperature erosive wear of brittle materials are largely dependent on high temperature properties of grain boundaries.