• International Journal of Precision Engineering and Manufacturing
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• 제2권2호
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• pp.38-47
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• 2001

This paper decribes the development of computer-aided design of a very precise progressice die for lead frame of semiconductor chip. The approach to the system is based on knowledgr-based rules. Knowledge of fie이 experts. This system has been written in AutoLISP using AutoCAD ona personal computer and the I-DEAS drafting programming Language on the I-DEAS mater series drafting with on HP9000/715(64) workstation. Data exchange between AutoCAD and I-DEAS master series drafting is accomplished using DXF(drawing exchange format) and IGES(initial graphics exchange specification) files. This system is composed of six main modules, which are input and shape treatment, production feasibility check, strip layout, data conversion, die layout, and post processing modules. Based on Knowledge-based rules, the system considers several factors, such as V-notches, dimple, pad chamfer, spank, cavity punch, camber, coined area, cross bow, material and thickness of product, complexities of blank geometry and punch profiles, specifications of available presses, and the availability of standard parts. As forming processes and the die design system using 2D geometry recognition are integrated with the technology of process planning, die design, and CAE analysis, the standardization of die part for lead frames requiting a high precision process is possible. The die layout drawing generated by the die layout module s displayed in graphic form. The developed system makes it possible to design and manufacture lead frame of a semiconductor more efficiently.

• 한국세라믹학회지
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• 제45권11호
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• pp.725-733
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• 2008

In this study the preparation method of the spherical ADU droplets, intermediate compound of a HTGR nuclear fuel, was detailed-reviewed and then, the characteristics on an ageing and a washing steps among the wet process and the thermal treatment process on the died-ADU${\rightarrow}UO_3$ conversion with the high temperature furnaces were studied. The key parameters for spherical droplets forming are a precise control of feed rate and a suitable viscosity value selection of a broth solution. Also, a harmony of vibrating frequency and amplitude of a vibration dropping system are important factor. In our case, an uranium concentration is $0.5{\sim}0.7mol/l$, viscosity is $50{\sim}80$ centi-Poise, vibration frequency is about 100Hz. In thermal treatment for no crack spherical $UO_3$ particle, the heating rate in the calcination must be operated below $2^{\circ}C$/min, in air atmosphere.

• 대한기계학회논문집A
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• 제36권12호
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• pp.1563-1568
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• 2012

인쇄전자는 RFID 나 유연 디스플레이 등의 전자회로나 소자를 인쇄방식으로 제작하는 공정이다. 특히 롤투롤과 같은 웹 이송방식 프린팅은 얇은 필름형태의 웹(Web)에 그라비아 인쇄나 고속 잉크젯과 같은 방법으로 이송중인 웹 상에 회로를 형성하는 공법이다. 이 공정은 생산단가가 저렴하고 고속생산이 가능하다는 이점이 있다. 다층구조를 가지는 회로나 디바이스를 생산할 때, 층과 층을 얼마나 정확하게 중첩시켜 인쇄하는가 하는 것은 인쇄된 전자회로의 집적도와 성능을 결정짓는 중요한 요소이다. 인쇄전자공법을 상용화하기 위해서 높은 중첩정밀도 구현이 선행되어야 한다. 본 연구에서는 롤투롤 인쇄방식에서 중첩정밀도의 향상을 위한 위치측정 시스템을 제안하고 신뢰성을 확인하였다. 또한 웹이 변형되었을 때의 측정 강인성도 실험적으로 확인하였다.

• 마이크로전자및패키징학회지
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• 제30권4호
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• pp.32-43
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• 2023

저항 변화 메모리 소자(RRAM)는 저항 변화 특성을 기반으로 빠른 동작 속도, 간단한 소자 구조 및 고집적 구조의 구현을 통해 많은 양의 데이터를 효율적으로 처리할 수 있는 차세대 메모리 소자로 주목받고 있다. RRAM의 작동원리 중 하나로 알려진 interface type의 저항 변화 특성은 forming process를 수반하지 않고 소자 크기를 조절하여 낮은 전류에서 구동이 가능하다는 장점을 갖는다. 그 중에서도 전이 금속 산화물 기반 RRAM 소자의 경우, 정확한 물질의 조성 조절 방법과 소자의 신뢰성 및 안정성과 같은 메모리 특성을 향상시키기 위해 다양한 연구가 진행 중에 있다. 본 논문에서는 이종 원소의 도핑, 다층 박막의 형성, 화학적 조성 조절 및 표면 처리 등의 방법을 이용하여 interface type 저항 변화 특성의 저하를 방지하고 소자 특성을 향상시키기 위한 다양한 방법을 소개하고자 한다. 이를 통해 향상된 저항 변화 특성을 기반으로 한 고효율 차세대 비휘발성 메모리 소자의 구현 가능성을 제시한다.

• 한국정밀공학회지
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• 제16권12호
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• pp.230-238
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• 1999

This paper describes a research work of developing computer-aided design of lead frame, semiconductor, with blanking operation which is very precise for progressive working. Approach to the system is based on the knowledge-based rules. Knowledge for the system is formulated from plasticity theories, experimental results and the empirical knowledge of field experts. This system has been written in AutoLISP on the AutoCAD using a personal computer and in I-DEAS Drafting Programming Language on the I-DEAS Master Series Drafting with Workstation, HP9000/715(64) and tool kit on the ESPRIT. Transference of data among AutoCAD, I-DEAS Master Series Drafting, and ESPRIT is accomplished by DXF(drawing exchange format) and IGES(initial graphics exchange specification) methods. This system is composed of six modules, which are input and shape treatment, production feasibility check, strip-layout, die-layout, modelling, and post-processor modules. The system can design process planning and Die design considering several factors and generate NC data automatically according to drawings of die-layout module. As forming process of high precision product and die design system using 2-D geometry recognition are integrated with technology of process planning, die design, and CAE analysis, standardization of die part in die design and process planning of high pression product for semiconductor lead frame is possible to set. Results carried out in each module will provide efficiencies to the designer and the manufacturer of lead frame, semiconductor.

• 한국기계가공학회지
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• 제16권2호
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• pp.28-33
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• 2017

Recently, the operation of precision pocket machining has been studied for the high speed and accuracy in industry to increase production and quality. Moreover, the demand for products with complex 3D free-curved surface shapes has increasing rapidly in the development of computer systems, CNC machining, and CAM software in various manufacturing fields, especially in automotive engineering. The type of aluminum (Al6061) that is widely used in aerospace fields was used in this study, and end-mill down cutting was conducted in fillet cutting at a corner with end-mill tools for various process conditions. The experimental results may demonstrate that the end mill cutter with four blades is more advantageous than that of the two blades on shape forming in the same condition precise machining conditions. It was also found that cutting forces and tool deformation increased as the cutting speed increased. When the tool was located at $45^{\circ}$ (four locations), the corner was found to conduct the maximum cutting force rather than the start point of the workpiece. The experimental research is expected to increase efficiency when the economical precision machining methods are required for various cutting conditions in industry.

• 예술인문사회 융합 멀티미디어 논문지
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• 제7권6호
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• pp.897-906
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• 2017

프로젝션 맵핑(공간증강현실)은 현실세계에서 다양한 가상의 환영(幻影)을 만들어내는 것으로 최근에 많은 분야에 사용되고 있다. 기존의 프로젝션 맵핑에서는 사용자와의 자연스러운 상호작용으로서 접히거나 구부러지는 것 과 같은 유연한 물체의 기하학적인 변형 속성(예: 용지)의 움직임을 고려하지 않았다. 또한, 정적 물체에 대한 프로젝션 맵핑에 대한 많은 연구가 있었지만, 유연한 타깃의 움직임을 추적하고 사용자와의 상호작용 측면에서 모양이 변형된 물체에 맵핑을 정확히 하는 다이내믹 프로젝션 맵핑은 여전히 도전해야할 연구 분야이다. 따라서 본 논문에서는 Unity3D와 ARToolkit을 이용한 실험을 통해 단단하지 않은 물체에 대한 견실한 추적과 정확한 맵핑 방법을 제안한다. 제안하는 방법은 큐빅 베지어 곡면 형성, 움직임 변형 값 렌더링 과정, 멀티플 마커 인식과 트래킹 과정, 실시간 웹캠 지속 촬영의 4가지 실험 단계로 구성된다. 사용자는 물체에 변형을 주기 위해 직접 접고, 휘고, 구부리고 비틀 수 있다. 제안 방법은 세 가지 긍정적인 결과를 도출할 수 있다. 첫째, 물체의 형태가 강하게 변형되어 있어도 감지 가능하다. 둘째, 사용자가 직접 물체에 변형을 주는 과정에서 물체의 일부분을 차단하고 있을 때의 Occlusion오류를 줄일 수 있어 정확한 트래킹을 할 수 있다. 셋째, 제안 방법의 견실하고 정확함은 빠른 속도로 물체의 움직임을 감지하게 하므로 실시간으로 결과 값을 물체에 투영할 수 있다.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2009년도 제38회 동계학술대회 초록집
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• pp.229-229
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• 2010

With the scaling down of ultra large integrated circuits (ULSI) to the sub-50 nm technology node, the need for an ultra-thin, continuous and conformal diffusion barrier and Cu seed layer is increasing. However, diffusion barrier and Cu seed layer formation with a physical vapor deposition (PVD) method has become difficult as the technology node is reduced to 30 nm and beyond. Recent work on self-forming barrier processes using PVD Cu alloys have attracted great attention due to the capability of conformal ultra-thin barrier formation using a simple technique. However, as in the case of the conventional barrier and Cu seed layer, PVD of the Cu alloy seed layer will eventually encounter the difficulty in conformal deposition in narrow line trenches and via holes. Atomic layer deposition (ALD) has been known for its good step coverage and precise thickness control, and is a candidate technique for the formation of a thin conformal barrier layer and Cu seed layer. Conformal Cu-Mn seed layers were deposited by plasma enhanced atomic layer deposition (PEALD) at low temperature ($120^{\circ}C$), and the Mn content in the Cu-Mn alloys were controlled form 0 to approximately 10 atomic percent with various Mn precursor feeding times. Resistivity of the Cu-Mn alloy films decreased by annealing due to out-diffusion of Mn atoms. Out-diffused Mn atoms were segregated to the surface of the film and interface between a Cu-Mn alloy and $SiO_2$, resulting in self-formed $MnO_x$ and $MnSi_xO_y$, respectively. No inter-diffusion was observed between Cu and $SiO_2$ after annealing at $500^{\circ}C$ for 12 h, indicating an excellent diffusion barrier property of the $MnSi_xO_y$. The adhesion between Cu and $SiO_2$ was enhanced by the formation of $MnSi_xO_y$. Continuous and conductive Cu-Mn seed layers were deposited with PEALD into 32 nm $SiO_2$ trench, enabling a low temperature process, and the trench was perfectly filled using electrochemical plating (ECD) under conventional conditions. Thus, it is the resultant self-forming barrier process with PEALD Cu-Mn alloy film as a seed layer for plating Cu that has further potential to meet the requirement of the smaller than 30 nm node.

• 한국콘텐츠학회논문지
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• 제9권10호
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• pp.110-121
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• 2009

본 논문에서는 건조물 문화재의 대용량 3D 데이터를 LOD(Level of Detail) 모델로 가공하고, 이를 기반으로 시스템의 메모리 제약을 완화시켜 사용자에게 3D모델에 대해 정밀한 상세정보를 제공하는 방법을 제안한다. 제안한 방법은 먼저 변형한 AOSP 알고리즘으로 3D 데이터에 대한 계층적 공간구조를 생성하고, 생성된 공간구조에 대한 표면 간략화를 수행하여 LOD 모델을 생성한다. 다음으로 간략화 된 LOD 모델에서 사용자의 관심 영역을 추출하고, 추출된 영역에 대하여 국부 상세화를 수행한 후 최종적으로 관심영역에 원 모델과 동일한 표면의 상세정보를 형성하여 렌더링 한다. 제안한 방법의 성능 평가를 위하여 정밀하게 실측된 건조물 문화재의 3D 스캔 데이터들로 실험을 진행하였다. 제안한 방법은 간략화 된 LOD 모델의 메쉬(mesh) 구조를 기반으로 관심 영역에서만 원 모델과 동일한 메쉬 구조를 형성함으로써, 기존의 모든 데이터를 메모리에 적재하여 렌더링을 하는 방법과 동일한 상세정보를 제공하면서도 메모리의 사용량을 평균적으로 45% 절감하여, 제원이 낮은 보급형 PC 환경에서도 대용량의 건조물 문화재를 정밀하게 관찰할 수 있었다.

• Archives of Plastic Surgery
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• 제42권5호
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• pp.532-543
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• 2015

Capsular contracture is the most common complication following implant based breast surgery and is one of the most common reasons for reoperation. Therefore, it is important to try and understand why this happens, and what can be done to reduce its incidence. A literature search using the MEDLINE database was conducted including search terms 'capsular contracture breast augmentation', 'capsular contracture pathogenesis', 'capsular contracture incidence', and 'capsular contracture management', which yielded 82 results which met inclusion criteria. Capsular contracture is caused by an excessive fibrotic reaction to a foreign body (the implant) and has an overall incidence of 10.6%. Risk factors that were identified included the use of smooth (vs. textured) implants, a subglandular (vs. submuscular) placement, use of a silicone (vs. saline) filled implant and previous radiotherapy to the breast. The standard management of capsular contracture is surgical via a capsulectomy or capsulotomy. Medical treatment using the off-label leukotriene receptor antagonist Zafirlukast has been reported to reduce severity and help prevent capsular contracture from forming, as has the use of acellular dermal matrices, botox and neopocket formation. However, nearly all therapeutic approaches are associated with a significant rate of recurrence. Capsular contracture is a multifactorial fibrotic process the precise cause of which is still unknown. The incidence of contracture developing is lower with the use of textured implants, submuscular placement and the use of polyurethane coated implants. Symptomatic capsular contracture is usually managed surgically, however recent research has focussed on preventing capsular contracture from occurring, or treating it with autologous fat transfer.