• Journal of Electrical Engineering and Technology
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• 제9권5호
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• pp.1471-1481
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• 2014

This paper presents the new power dissipation model of individual switching device in a high-level modular multilevel converter (MMC), which can be mostly used in voltage sourced converter (VSC) based high-voltage direct current (HVDC) system and flexible AC transmission system (FACTS). Also, the voltage balancing method based on sorting algorithm is newly proposed to advance the MMC functionalities by effectively adjusting switching variations of the sub-module (SM). The proposed power dissipation model does not fully calculate the average power dissipation for numerous switching devices in an arm module. Instead, it estimates the power dissipation of every switching element based on the inherent operational principle of SM in MMC. In other words, the power dissipation is computed in every single switching event by using the polynomial curve fitting model with minimum computational efforts and high accuracy, which are required to manage the large number of SMs. After estimating the value of power dissipation, the thermal condition of every switching element is considered in the case of external disturbance. Then, the arm modeling for high-level MMC and its control scheme is implemented with the electromagnetic transient simulation program. Finally, the case study for applying to the MMC based HVDC system is carried out to select the appropriate insulated-gate bipolar transistor (IGBT) module in a steady-state, as well as to estimate the proper thermal condition of every switching element in a transient state.

• 전기학회논문지
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• 제63권9호
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• pp.1219-1226
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• 2014

This paper introduces a hardware simulator for the LVRT operation analysis of the grid-tied PMSG wind power system with a power dissipation circuit. The power dissipation circuit, which is composed of chopper and resistor, suppresses the sudden increase of DC-link voltage in the back-to-back converter of the grid-tied PMSG wind power system. The LVRT operation was first analyzed using computer simulations with PSCAD/EMTDC. A wind power simulator including the power dissipation circuit and the fault simulator composed of variac and IGBT were built to analyze the LVRT operation. Various experiments were conducted to verify the effectiveness of the power dissipation circuit for the LVRT operation. The developed hardware simulator can be extensively utilized for the analysis of various LVRT operations of the grid-tied wind power system.

• ETRI Journal
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• 제33권1호
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• pp.140-143
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• 2011

Recent test data compression techniques raise concerns regarding power dissipation and compression efficiency. This letter proposes a new test data compression scheme, twin symbol encoding, that supports block division skills that can reduce hardware overhead. Our experimental results show that the proposed technique achieves both a high compression ratio and low-power dissipation. Therefore, the proposed scheme is an attractive solution for efficient test data compression.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 1998년도 추계종합학술대회 논문집
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• pp.1081-1084
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• 1998

In this paper, we propose the bus coding technique for low power consumption. For CMOS circuit most power is dissipated as dynamic power for charging and discharging node capacitances.Though the I/O and bus are likely to have the very large capacitances associated with them and dissipate much of the power dissipated by an IC, they have little beenthe special target for power reduction. The conventional Bus-Invert coding method can't decrease the peak power dissipation by 50% because the additional invert signal line can invoke a transition at the time when Bus-Invert coding isn't used to code original bus data. The proposed technique always constraints the Hamming distance between data transferred sequentially to be below the half of the bus width, and thus decrease the I/O peak power dissipation and the I/O average power dissipation.

• Journal of Electrical Engineering and Technology
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• 제3권1호
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• pp.130-134
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• 2008

The increasing size of very large scale integration (VLSI) circuits, high transistor density, and popularity of low-power circuit and system design are making the minimization of power dissipation an important issue in VLSI design. Test Power dissipation is exceedingly high in scan based environments wherein scan chain transitions during the shift of test data further reflect into significant levels of circuit switching unnecessarily. Scan chain or cell modification lead to reduced dissipations of power. The ETC algorithm of previous work has weak points. Taking all of this into account, we therefore propose a new algorithm. Its name is RE_ETC. The proposed modifications in the scan chain consist of Exclusive-OR gate insertion and scan cell reordering, leading to significant power reductions with absolutely no area or performance penalty whatsoever. Experimental results confirm the considerable reductions in scan chain transitions. We show that modified scan cell has the improvement of test efficiency and power dissipations.

• 한국인터넷방송통신학회논문지
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• 제16권5호
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• pp.191-196
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• 2016

최근에 이르러, 임베디드 시스템 및 모바일 장치 뿐만이 아니라 고성능 마이크로프로세서 및 멀티코어프로세서의 전력 소비량이 매우 중요하게 대두되고 있다. 특히, 스마트폰과 태블릿 PC의 광범위한 사용으로 인하여 프로세서의 저전력 소비가 무엇보다 요구된다. 본 논문에서는 고성능 마이크로프로세서에 대하여 빠른 속도를 갖는 명령어 자취형 (trace-driven) 모의실험기 기반의 전력 측정기를 개발하였다. 본 전력 측정기는 마이크로프로세서를 구성하는 복합 조합회로, 배열구조, CAM 구조를 기반으로 하였으며, SPEC 2000 벤치마크를 입력으로 모의실험을 수행하여 각 벤치마크의 평균 전력 소비량을 측정하였다.

• 한국안전학회지
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• 제20권1호
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• pp.87-93
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• 2005

In this paper, we analyzed ignition characteristics of combustible material and the waveform of power dissipation, voltage and current by poor contact. And the surface structure of plug by poor contact was analyzed. In the results of experiment, the heat generated by poor contact and ignited the combustible material on power cord sets. The insulation material was molten and carbonized by the heat conduction though plug pit and voids were formed inside of insulation material. The waveform of voltage and power dissipation distorted because of a growth of oxidation by poor contact. In particular, in case that load was big load, the waveform of voltage and power dissipation severely distorted as with the passage of time. The surface of plug pin was changed from erosion mark to welding mark according to big load. The results will be applied to the cause analysis of electrical disaster.

• 한국전기전자재료학회논문지
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• 제33권6호
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• pp.439-444
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• 2020

An increase in the temperature of photovoltaic (PV) modules causes reduced power output and shorter lifetime. Because of these characteristics, demands for the heat dissipation of PV modules are increasing. In this study, we attached a heat dissipation sheet to the back sheet of a shingled PV module and observed the temperature changes. The PV shingled module was tested under Standard Test Conditions (STCs; irradiance: 1,000 W/㎡, temperature: 25℃, air mass: 1.5) using a solar radiation tester, wherein the temperature of the PV module was measured by irradiating light for a certain duration. As a result, the temperature of the PV module with the heat dissipation sheet decreased by 3℃ compared to that without a heat dissipation sheet. This indicated that the power loss was caused by a temperature increase of the PV module. In addition, it was confirmed that the primary parameter contributing to the reduced PV module output power was the open circuit voltage (Voc).

• 대한전기학회:학술대회논문집
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• 대한전기학회 2011년도 제42회 하계학술대회
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• pp.1603-1603
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• 2011

As time goes by these cables make a insulation problems, and ask for a preventive diagnosis method. Cable has very high electrostatic capacity and insulation defects mainly caused by water-tree(WT). Dissipation factor test is very useful for detecting WT but it needs huge power supply. In this paper we presented a cable insulation diagnosis by dissipation factor using low frequency power supply.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2002년도 ITC-CSCC -2
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• pp.782-785
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• 2002

Power amplifier of wireless communication tranceiver can be effectually controlled output power. And small size and low power dissipation are indispensable to portable system. In this paper, to reduce the size of portable tranceiver, inductor is integrated in a single chip. And to reduce power dissipation, a power amplifier that can be digitally controlled output power, is proposed and designed.