• 한국멀티미디어학회논문지
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• 제21권6호
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• pp.649-658
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• 2018

In this paper, we propose a mechanical contact inner tap inspection system that can inspect the defect of the inner tap immediately after inner tap is processed within the machining center. The inspection module has the collet chuck structure, so it can mounted on the main spindle of the machining center during inspection. It was developed with a focus on inspection for tap having 20 mm depth which is primarily fabricated in automotive parts and has a double sided PCB-type control system including sensing function based on Zigbee module, micom and IR sensor for wireless transmission of measured data with low power operation, and also a battery for supplying electric power. The current consumption is 46.8mA in the inspection operation mode and 0.0268mA in the power saving mode for 3.7V of the applied power source, so that 30,000 times or more inspection can be performed with assumed 5 seconds inspection time for one tap. Experiments in test jig system and actual machining center confirm that the proposed inner tap inspection system can be applied to the batch process of simultaneous inspection after tapping in the machining center.

• 동력기계공학회지
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• 제6권3호
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• pp.31-35
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• 2002

Brake tube is considered one of the most important parts in automobile. The shape of brake tube end has a great influence on the function of brake, and the quality and productivity of brake tube have relation to die design. The forming process of brake tube end is performed by hydraulic press forming machine. In this paper, the forming processes of tube end for automobile is analyzed and designed to make the optimal form of brake tube end. Also, finite element analysis has been carried out using $DEFORM^{TM}% 3D to predict the optimal shape of brake tube end and the results obtained showed the optimal length between punch and chuck is $1.0{\sim}1.2mm$. The shape of tube end is in good agreement with the finite element simulations and the experimental results.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2002년도 하계학술대회 논문집
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• pp.74-77
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• 2002

The channel of the superconducting Flux Flow Transistor has been fabricated with plasma etching method using ICP. The ICP conditions were 700 W of ICP power, 150 W of rf chuck power, 5 mTorr of the pressure in chamber and 1:1 of Ar : Cl$_2$, respectively. The channel etched by plasma gas showed superconducting characteristics of over 77 K and superior surface morphology. The critical current of SFFT was altered by varying the external applied current. As the external applied current increased from 0 to 12 mA, the critical current decreased from 28 to 22 mA. Then the obtained r$\sub$m/ values were smaller than 0.1Ω at a bias current of 40 mA. The current gain was about 0.5. Output resistance was below 0.2 Ω.

• 한국전기전자재료학회논문지
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• 제16권5호
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• pp.424-428
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• 2003

The channel of a superconducting flux flow transistor has been fabricated with plasma etching method using a inductively coupled plasma etching. The ICP conditions then were ICP Power of 450 W, rf chuck power of 150 W, the pressure in chamber of 5 mTorr, and Ar : Cl$_2$=1:1. Especially, over the 5 mTorr, the superconducting thin films were not etched. The channel etched by plasma gas showed the critical temperature over 85 K. The critical current of the SFFT was altered by varying the external applied current. As the external applied current increased from 0 to 12 mA, the critical current decreased from 28 to 22 mA. Then the obtained trans-resistance value was smaller than 0.1 $\Omega$ at a bias current of 40 mA.

• JSTS:Journal of Semiconductor Technology and Science
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• 제3권1호
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• pp.21-26
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• 2003

4H-SiC Schottky rectifiers were exposed to pure Ar discharges in a planar coil Inductively Coupled Plasma system, as a function of source power, of chuck power and process pressure. The reverse breakdown voltage ($V_B$) decreased as a result of plasma exposure due to the creation of surface defects associated with the ion bombardment. The magnitude of the decrease was a function of both ion flux and ion energy. The forward turn-on voltage ($V_F$), on-state resistance ($R_{ON}$) and diode ideality factor (n) all increased after plasma exposure. The changes in all of the rectifier parameters were minimized at low power, high pressure plasma conditions.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2002년도 춘계학술대회 논문집
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• pp.540-545
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• 2002

The tight integration of the part design and process planning is very effective to high quality product development and cost effective manufacturing. Moreover, the integration in the early design stage, that is, the integration of the conceptual design and the conceptual process planning may take a big impact with the forecasting the alternative of the design and manufacturing. In this paper, the real field parts are studied about the relations among the Feature, Function, and Manufacturing Process taking the style of reverse engineering method, to found the base of the systematic computer system for the integrated product design and manufacturing process planning.

• 셀메드
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• 제3권1호
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• pp.5.1-5.5
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• 2013

In this pilot dual-site study with LifeWave IceWave$^{(R)}$ patches, using subjects as their own controls, data were acquired from a convenience sample of 16 males and 24 females, 50% Caucasian-Americans, 50% Hispanic-Americans, ages 20 - 85 with neuromuscular pain. The hypothesis was: the application of IceWave$^{(R)}$ patches to the skin will reduce one's perception of pain. Subjects were tested at baseline (without any patches), and then at 1 and 3 h on day 1 and at 1 h on days 2 - 5 after patch application. At every time point, the mean change, indicative of one's perception of pain, was highly significantly (p < 0.0001) reduced, with a statistical power of 100% compared to baseline. Based on these findings, the hypothesis was accepted as true.

• 한국기계가공학회지
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• 제16권6호
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• pp.69-74
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• 2017

In the current machining industry, machining precision is necessary and machining is being carried out. In this ultra-precision machining industry, the fixation of the workpiece is very important and the degree of machining depends on the degree of fixation of the workpiece. In ultra-precision machining, various methods, such as using a vise chuck or the like and using bolt nut coupling, are used for fixing a workpiece to an existing machine tool. In particular, when the precision gripping force of the jig is insufficient during machining of the ultra-precision mold parts, the machining material shakes due to the vibration or friction, and the machining precision is lowered. In the ultra-precision machining of power transmission parts, such as gears, the accuracy of the product is then determined. In addition, the amount of heat generated during machining has a significant effect on the machining accuracy. This is because the vibration value changes according to the grasp force of the jig that fixes the workpiece, and the change in the calorific value due to the change in the main shaft rotation speed of the ultra-precision machining. The increase in the spindle rotation speed during machining decreased the heat generation during machining, and the machining accuracy was also good, and it was confirmed that the machining heat changed according to the fixed state of the workpiece and the machining accuracy also changed. In this study, we try to optimize the driving part of the power vise by using structural analysis, rather than the power vise, using the basic mechanical-type power unit.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2002년도 제4회 영호남학술대회 논문집
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• pp.138-141
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• 2002

The channel of the superconducting Flux Flow Transistor has been fabricated with plasma etching method using ICP. The ICP conditions were 700 W of ICP power, 150 W of rf chuck power, 5 mTorr of the pressure in chamber and 1:1 of Ar : $Cl_2$, respectively. The channel etched by plasma gas showed superconducting characteristics of over 77 K and superior surface morphology. The critical current of SFFT was altered by varying the external applied current. As the external applied current increased from 0 to 12 mA, the critical current decreased from 28 to 22 mA. Then the obtained $r_m$ values were smaller than $0.1\Omega$ at a bias current of 40 mA. The current gain was about 0.5. Output resistance was below $0.2\Omega$.

• 한국통신학회논문지
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• 제34권2B호
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• pp.151-161
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• 2009

PULSE 프로토콜은 센서 노드의 슬립을 통해 소모 전력량을 크게 줄인다. 그러나 이 프로토콜은 싱크 노드의 이동을 고려하지 않는 문제가 있다. 모바일 싱크 노드를 가진 센서 네트워크를 위한 라우팅 프로토콜은 빠른 경로 복구와 전력 소모 최소화를 모두 달성해야 한다. 본 논문은 두 목적을 달성하기 위해 모바일 PULSE 프로토콜을 제안한다. 또한, 실험을 통해 제안한 프로토콜의 경로 복구 능력과 전력 소모량을 확인하였다. 이 프로토콜은 기존의 PULSE 프로토콜에 비해 약 40% 정도 경로 복구 시간을 단축하였고, 드롭되는 패킷의 양도 약 1/2 수준으로 줄였다. 전력 소모량 면에서는 최대 0.8%의 증가만이 나타남으로써, 기존의 PULSE 프로토콜의 전력 효율적인 특징을 그대로 유지함을 보였다. 본 논문은 모바일 PULSE 프로토콜의 경로 복구 능력과 전력 소모량을 확인함으로써 모바일 센서 네트워크에 적합한 프로토콜로서의 가능성을 보여준다.