• Title/Summary/Keyword: Power Semiconductor

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A study on Improvement of OLEDs luminance property using PEDOT:PSS (PEDOT:PSS를 이용한 OLEOs의 발광 특성 향상에 관한 연구)

  • Kim, Dong-Eun;Kim, Byoung-Sang;Kim, Doo-Seok;Kwon, Oh-Kwan;Lee, Burm-Jong;Kwon, Young-Soo
    • Proceedings of the KIEE Conference
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    • 2006.07c
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    • pp.1293-1294
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    • 2006
  • OLEDs based on organic thin films are similar to semiconductor base light-emitting diodes in that they were also considered to be one of the next generation flat-panel displays. They are attractive because of low-operating voltage, low power consumption, ease of fabrication, and low cost. In this study, we used poly (3,4-ethylenedioxythiophene)/poly (4-styrenesulfonate) (PE DOT : PSS) as a hole injection layer. In this experiment spin coating method was used with various speed rate. The fundamental structure of the OLEDs was ITO/PEDOT:PSS/NPB/$Alq_3$/Al. As a result, we obtained the enhancement performance of OLEDs when the spin coating speed was 4000 rpm. We obtained a maximum luminance of 24334 $cd/m^2$ at a current density of 967 $mA/cm^2$.

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Laser-Induced Direct Copper Patterning Using Focused $Ar^+$ Laser Beam (집속 아르곤 이온 레이저 빔을 이용한 레이저 유도 직접 구리 패터닝)

  • Lee, Hong-Kyu;Lee, Kyoung-Cheol;Ahn, Min-Young;Lee, Cheon
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.13 no.11
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    • pp.969-975
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    • 2000
  • Laser direct writing of micro-patterned copper lines has been achieved by pyrolytic decomposition of copper formate films (Cu(HCOO)$_2$.4$H_2O$), as a metallo-organic precursor, using a focused CW Ar$^{+}$ laser beam (λ=514nm) on PCB boards and glass substrates. The linewidth and thickness of the lines wee investigated as a functin of laser power and scan speed. The profiles of the lines were measured by scanning electron microscope (SEM), surface profiler ($\alpha$-step) and atomic force measured by scanning electron microscope (SEM), surface profiler ($\alpha$-step) and atomic force microscopy (AFM). The electrical resistivities of the patterned lines were also investigated as a function of laser parameters using probe station and semiconductor analyzer. We compared resistivities of the patterned copper lines with these of the Cu bulk. Resistivities decreased due to changes in morphology and porosity of the deposit, which were about 3.8 $\mu$$\Omega$cm and 12$\mu$$\Omega$cm on PCB and glass substrates after annealing at 30$0^{\circ}C$ for 5 minutes.s.

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A Study on Driving System and Constant Output System for a Low Pressure UV Lamp (저압 UV램프 구동시스템 및 출력안정화 시스템에 관한 연구)

  • Yi, Chin-Woo;No, Jae-Yup
    • Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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    • v.19 no.8
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    • pp.19-23
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    • 2005
  • The target of this research is a design of constant and high efficiency driving system for a low pressure UV lamp. An UV lamp system is one of wide range electrical equipments for semiconductor manufacturing and sterilization, etc... It is essential the technique of constant output for high added value device. A design target of driving system for low pressure UV lamp of conversion efficiency is 90[%], UV lamp of output stability within ${\pm}7.5[%]$, and lamp power is over 200[W]. The results meet the target of this study well, and have a benefit of domestic market occupation and enable to export. And if protection circuits were developed, it increases the stability of a electronic ballast for UV lamps.

Comparison on commercial simulators for nano-structure device simulation- For ISE-TCAD and Micro-tec - (나노 구조 소자 시뮬레이션을 위한 상용 시뮬레이터의 비교 분석 - ISE-TCAD와 Micro-tec을 중심으로 -)

  • 심성택;임규성;정학기
    • Journal of the Korea Institute of Information and Communication Engineering
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    • v.6 no.1
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    • pp.103-108
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    • 2002
  • The metal-oxide-semiconductor field-effect transistor(MOSFET) has undergone many changes in the last decade In response to the constant demand for increased speed, decreased power, and increased packing density. The state -of-the-art simulation programs are developed by engineers and scientists. This paper has compared commercial programs of Micro-tec and ISE-TCAD in device simulation. This paper investigates LDD MOSFET using two simulators. Bias condition is applied to the devices with gate lengths(Lg) 180㎚. We have presented MOSFET's characteristics such as I-V characteristic and electric field, and compared Micro-tec with ISE TCAD.

Development of Protection Device for Voltage Unbalance Faults using Three-Phase Neutral Voltage (삼상 중성점 전압을 이용한 전압불평형 사고 방지용 보호장치 개발)

  • Kwak, D.K.;Kim, D.S.;Kim, J.H.;Kim, S.C.;Jung, W.S.;Son, J.H.
    • Proceedings of the KIPE Conference
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    • 2012.07a
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    • pp.621-622
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    • 2012
  • The thermal over-current relay or electronic motor protection relay is mostly used as the open-phase detection device of the three-phase motor or load. When the over-current or overheat of electric line is generated, it detects and operates circuit breaker, but there is the defect that the sensing speed is slow, the operation can be sometimes failed, and the precision is decreased. In order to improve these problems, this paper is proposed a new control circuit topology for open-phase protection using semiconductor devices. Therefore, the proposed open-phase protection device enhances the sensing speed and precision, and has the advantage of simple fitting in the three-phase motor control panel in the field, as it manufactures into small size and light weight.

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Optical In-Situ Plasma Process Monitoring Technique for Detection of Abnormal Plasma Discharge

  • Hong, Sang Jeen;Ahn, Jong Hwan;Park, Won Taek;May, Gary S.
    • Transactions on Electrical and Electronic Materials
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    • v.14 no.2
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    • pp.71-77
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    • 2013
  • Advanced semiconductor manufacturing technology requires methods to maximize tool efficiency and improve product quality by reducing process variability. Real-time plasma process monitoring and diagnosis have become crucial for fault detection and classification (FDC) and advanced process control (APC). Additional sensors may increase the accuracy of detection of process anomalies, and optical monitoring methods are non-invasive. In this paper, we propose the use of a chromatic data acquisition system for real-time in-situ plasma process monitoring called the Plasma Eyes Chromatic System (PECS). The proposed system was initially tested in a six-inch research tool, and it was then further evaluated for its potential to detect process anomalies in an eight-inch production tool for etching blanket oxide films. Chromatic representation of the PECS output shows a clear correlation with small changes in process parameters, such as RF power, pressure, and gas flow. We also present how the PECS may be adapted as an in-situ plasma arc detector. The proposed system can provide useful indications of a faulty process in a timely and non-invasive manner for successful run-to-run (R2R) control and FDC.

A Study on the Characteristic Analysis of NUDFET by FEM (FEM에 의한 NUDFET의 특성해석에 관한 연구)

  • Kim, Jong-Ryeul;Jung, Jong-Chuck;Kim, Young-Cig;Sung, Man-Young;Cho, Ho-Yeol
    • Proceedings of the KIEE Conference
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    • 1993.07b
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    • pp.1247-1249
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    • 1993
  • In this paper, NUDFET(NonUniformly Doped Field Effect Transistor) is presented as an alternative which offers the possibility of reducing the power necessary to operate switching circuits without a substantial loss in speed. The purpose of this NUDFET is to modify the electric field profile in order to cause carrier velocity saturation to occur at a lower voltage than it would occur in the uniformly doped device of the same channel length. The more MESFET and NUDFET circuits are realized, the more accurate model ins the performance of these devices become required. Analytic model ins was replaced by numerical analysis because of the complexity of device configuration. In this paper, FEM is selected because of simpler local mesh refinement and smaller computer memory than FDM. For accurate analysis, this paper has applied the Scharfetter-Gummel(S-G) Scheme and seven-point Gaussian Quadrature rule to assembly of the finite-element stiffness matrices and right-hand side vector of the semiconductor equations.

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Gate Electrode Dependence of MFSFETs using $LiNbO_3$ Thin Film ($LiNbO_3$ 박막을 이용한 MFSFET의 게이트 전극 의존성)

  • 정순원;김용성;김채규;이남열;김광호
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 1999.11a
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    • pp.25-28
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    • 1999
  • Metal ferroelectric semiconductor Field Effect- Transistors(MFSFET) with various gate electrodes, that are aluminum, platinum and poly -Si, using LiNbO$_3$/Si(100) structures were fabricated and the properties of the FETs have been discussed. The drain current of the state of FET with Pt electrode was more than 3 orders of magnitude larger than the state current at the same gate voltage of 1.5 V, 7.rich means the memory operation of the MFSFET. A write voltage as low as about $\pm$4 V, which is applicable to low power integrated circuits, was used for polarization reversal. The retention properties of the FET using Al electrode were quite good up to about 10$^3$s and using Pt electrode remained almost the same value of its initial value over 2 days at room temperature.

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Efficient Design of BCD-EXCESS 3 Code Converter Using Quantum-Dot Cellular Automata (QCA를 이용한 효율적인 BCD-3초과 코드 변환기 설계)

  • You, Young-Won;Jeon, Jun-Cheol
    • Journal of Advanced Navigation Technology
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    • v.17 no.6
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    • pp.700-704
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    • 2013
  • Quantum-dot cellular automata(QCA) is a new technology and it is an one of the alternative high performance over existing complementary metal-oxide semi-conductor(CMOS). QCA is nanoscale device and ultra-low power consumption compared with transistor-based technologies, and various circuits using QCA technology have been proposed. Binary-coded decimal(BCD), which represents decimal digits in binary, is mainly used in electronic circuits and Microprocessor, and it is comfortable in conversion operation but many data loss. In this paper, we present an BCD-EXCESS 3 Code converter which can be efficiently used for subtraction and half adjust. The proposed scheme has efficiently designed considering space and time complexities and minimization of noise, and it has been simulated and confirmed.

Laser Micro-Joining and Soldering (레이저 마이크로 접합 및 솔더링)

  • Hwang, Seung Jun;Kang, Hye Jun;Kim, Jeng O;Jung, Jae Pil
    • Journal of the Microelectronics and Packaging Society
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    • v.26 no.3
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    • pp.7-13
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    • 2019
  • In this paper, the principles, types and characteristics of the laser and laser soldering are introduced. Laser soldering methods for electronics, metals, semiconductors are also presented. Laser soldering is a non-contact process that transfers energy to solder joint by a precisely controlled beam. Demands for laser soldering are increasing due to bonding for complex circuits and local heating in micro joint. Laser absorption ratio depends on materials, and each material has different absorption or reflectivity of the laser beam, which requires fine adjustment of the laser beam. Laser types and operating conditions are also important factors for laser soldering performance. In this paper, the performance of Nd:YAG laser soldering is compared to the hot blast reflow. Meanwhile, a diode laser gives different wavelength and smaller parts with high performance, but it has various reliability issues such as heat loss, high power, and cooling technology. These issues need to be improved in the future, and further studies for laser micro-joining and soldering are required.