• JSTS:Journal of Semiconductor Technology and Science
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• v.15 no.4
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• pp.454-461
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• 2015

Light enhancement of GaN based light emitting diodes (LEDs) have been investigated by texturing the top p-GaN surface. Nano-textured LEDs have been fabricated using self-assembled Ni nano mask during dry etching process. Experimental results were further compared with simulation data. Three types of LEDs were fabricated: Conventional (planar LED), Surface nano-porous (porous LED) and Surface nano-cluster (cluster LED). Compared to planar LED there were about 100% and 54% enhancement of light output power for porous and cluster LED respectively at an injection current of 20 mA. Moreover, simulation result showed consistency with experimental result. The increased probability of light scattering at the nano-textured GaN-air interface is the major reason for increasing the light extraction efficiency.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.17 no.8
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• pp.893-897
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• 2004

In this paper, we studied the mechanical and thermal properties on slice XLPE sheet from 22 kV and 154 kV power cables. Interface structures are XLPE/semiconductor and XLPE/water/semiconductor. We evaluated mechanical property, thermal analysis, moisture analysis. Based on mechanical and thermal properties of the 22 kV XLPE sheet, elongation, mechanical strength, and melting point were evaluated to be 485.48 %, 1.74 kgf/$\textrm{mm}^2$ and $102.48^{\circ}C$, respectively. It was also evaluated from the mechanical and thermal properties of 154 kV XLPE sheet that elongation, mechanical strength, and melting point are 507.81 %, 1.8 kgf/$\textrm{mm}^2$, $106.9^{\circ}C$, respectively. A region shows a rapid increase in tension strength, and B region only shows increase in elongation under 1.0 kgf/$\textrm{mm}^2$, C region shows increase in both elongation and tension strength. Difference of melting point came from the chain of XLPE polymer and the difference of crystallization. Moisture density of semiconductor showed 800 ∼ 1200 ppm before extrude, 14000 ∼24000 ppm after extrude. These values were higher than the moisture density of XLPE (300∼560) ppm.

• Proceedings of the IEEK Conference
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• 2003.11c
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• pp.32-36
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• 2003

In this work, we have designed a fully integrated 2.4GHz LC-tuned voltage-controlled oscillator (VCO) with multiple tuning inputs for a 0.25-$\mu\textrm{m}$ standard CMOS process. The design of voltage-controlled oscillator is based on an LC-resonator with a spiral inductor of octagonal type and pMOS-varactors. Only two metal layer have been used in the designed inductor. The frequency tuning is achieved by using parallel pMOS transistors as varactors and back-gate tuned pMOS transistors in an active region. Coarse tuning is achieved by using 3-bit pMOS-varactors and fine tuning is performed by using back-gate tuned pMOS transistors in the active region. When 3-bit digital and analog inputs are applied to the designed circuits, voltage-controlled oscillator shows the tuning feature of frequency range between 2.3 GHz and 2.64 GHz. At the power supply voltage of 2.5 V, phase noise is -128dBc/Hz at 3MHz offset from the carrier. Total power dissipation is 7.5 mW.

• KIEE International Transactions on Electrophysics and Applications
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• v.11C no.4
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• pp.99-106
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• 2001

An overview of Silicon Carbide (SiC) Static Induction Transistor (SIT) development is presented. Basic conduction mechanisms are introduced and discussed, including ohmic, exponential, and space charge limited conduction (SCLC) mechanisms. Additionally, the impact of velocity saturation and temperature effects on SCLC are reviewed. The small-signal model, breakdown voltage, power density, and different gate structures are also discussed, before a final review of published SiC SIT results. Published S-band (3-4 GHz) results include 9.5 dB of gain and output power of 120 W, and L-band (1.3 GHz) results include 400 W output power, 7.7 dB of gain, and power density of 16.7 W/cm.

• Journal of the Semiconductor & Display Technology
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• v.15 no.4
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• pp.22-26
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• 2016

In this paper, we measured the efficiency of the receiver for 5.8GHz Microwave Smartphone Charging. We have designed and fabricated 1W and 2W power amplifier, respectively. A 1W power amplifier used a TC3531 power device of TRANSCOM Inc. In addition, a 2W power amplifier using the two TC3531 devices was constructed with divider and combiner. We used the Wilkinson divider theory for divider and combiner. The voltage was measured using the 1W and 2W power amplifier and integrated receivers to the distance of 50cm.

• Journal of the Semiconductor & Display Technology
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• v.18 no.1
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• pp.123-128
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• 2019

Currently mobile services are on the verge of full commercialization ahead of 5G mobile communication (5G). The first goal could be to preempt the 5G market through realistic media services utilizing VR (Virtual Reality) and AR (Augmented Reality) technologies that users can most easily experience. Basically this movement is based on the advanced development of smart devices and high quality graphics processing computing power of mobile application processors. Accordingly, the importance of mobile GPUs is emerging and the most concern issue becomes a model for predicting the power and performance for smooth operation of high quality mobile contents. In many cases, the performance of mobile GPUs has been introduced in terms of power consumption of mobile GPUs using dynamic voltage and frequency scaling and throttling functions for power consumption and heat management. This paper introduces several studies of mobile GPU performance prediction model with user-friendly methods not like conventional power centric performance prediction models.

• The Transactions of the Korean Institute of Power Electronics
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• v.25 no.6
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• pp.496-502
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• 2020

The reliability of a solid-state transformer (SST) is one of the important aspects to consider when replacing a conventional low-frequency passive transformer with SST for urban railway vehicles. Lifetime evaluation of SST in the design phase is therefore essential in guaranteeing a certain SST reliability. In this study, a lifetime evaluation of power semiconductor devices in SST is performed with respect to temperature stress. For a case study, a 3 MW SST with three kinds of power modules (one IGBT module and two SiC-MOSFET modules) is used for the lifetime estimation under the operation profile of urban railway vehicles.

• The Transactions of the Korean Institute of Power Electronics
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• v.25 no.6
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• pp.451-458
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• 2020

In this study, a trade-off analysis of a power conversion system (PCS) is performed in accordance with a power semiconductor device to establish the suitable operating frequency range for the anyplace induction heating system. A resonant network is designed under each operating frequency condition to compare and analyze the PCS losses depending on the power semiconductor device. On the basis of the simulation results, the PCS losses and frequency condition are calculated. The calculated results are then used for a trade-off analysis between Si-MOSFET and GaN-HEMT based on PCS. The suitable operating frequency range is determined, and the validity of the analysis results is verified by the experiment results.

• 한국정보디스플레이학회:학술대회논문집
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• 2000.01a
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• pp.231-234
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• 2000

Vertically aligned carbon nanotubes were synthesized on Ni-coated Si substrates using microwave plasma-enhanced chemical vapor deposition. The grain size of Ni thin films was varied with the RF power density during the RF magnetron sputtering process. It was found that the diameter, growth rate, and density of carbon nanotubes could be controlled systematically by the grain size of Ni thin films. With decreasing the grain size of Ni thin films, the diameter of the nanotubes decreased, whereas the growth rate and density increased. High-resolution transmission electron microscope images clearly demonstrated synthesized nanotubes to be multiwalled. The number of graphitized wall decreased with decreasing the diameter. Field emission properties will be further presented.

• Journal of Power Electronics
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• v.5 no.3
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• pp.233-239
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• 2005

In this paper, a new conceptual circuit configuration of a 3-phase voltage source, soft switching AC-DC-AC converter using an IGBT module, which has one ARCPL circuit and one ARDCL circuit, is presented. In actuality, the ARCPL circuit is applied in the 3-phase voltage source rectifier side, and the ARDCL circuit is in the inverter side. And more, each power semiconductor device has a novel clamp snubber circuit, which can save the power semiconductor device from voltage and current across each power device. The proposed soft switching circuits have only two active power semiconductor devices. These ARCPL and ARDCL circuits consist of fewer parts than the conventional soft switching circuit. Furthermore, the proposed 3-phase voltage source soft switching AC-DC-AC power conversion system needs no additional sensor for complete soft switching as compared with the conventional 3-phase voltage source AC-DC-AC power conversion system. In addition to this, these soft switching circuits operate only once in one sampling term. Therefore, the power conversion efficiency of the proposed AC-DC-AC converter system will get higher than a conventional soft switching converter system because of the reduced ARCPL and ARDCL circuit losses. The operation timing and terms for ARDCL and ARCPL circuits are calculated and controlled by the smoothing DC capacitor voltage and the output AC current. Using this control, the loss of the soft switching circuits are reduced owing to reduced resonant inductor current in ARCPL and ARDCL circuits as compared with the conventional controlled soft switching power conversion system. The operating performances of proposed soft switching AC-DC-AC converter treated here are evaluated on the basis of experimental results in a 50kVA setup in this paper. As a result of experiment on the 50kVA system, it was confirmed that the proposed circuit could reduce conduction noise below 10 MHz and improve the conversion efficiency from 88. 5% to 90.5%, when compared with the hard switching circuit.