• 제목/요약/키워드: Power Amplifier Integrated Circuit

검색결과 101건 처리시간 0.026초

Efficiency Improvement of HBT Class E Power Amplifier by Tuning-out Input Capacitance

  • Kim, Ki-Young;Kim, Ji-Hoon;Park, Chul-Soon
    • JSTS:Journal of Semiconductor Technology and Science
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    • 제7권4호
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    • pp.274-280
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    • 2007
  • This paper demonstrates an efficiency improvement of the class E power amplifier (PA) by tuning-out the input capacitance ($C_{IN}$) of the power HBT with a shunt inductance. In order to obtain high output power, the PA needs the large emitter size of a transistor. The larger the emitter size, the higher the parasitic capacitance. The parasitic $C_{IN}$ affects the distortion of the voltage signal at the base node and changes the duty cycle to decrease the PA's efficiency. Adopting the L-C resonance, we obtain a remarkable efficiency improvement of as much as 7%. This PA exhibits output power of 29 dBm and collector efficiency of 71% at 1.9 GHz.

A 20 W GaN-based Power Amplifier MMIC for X-band Radar Applications

  • Lee, Bok-Hyung;Park, Byung-Jun;Choi, Sun-Youl;Lim, Byeong-Ok;Go, Joo-Seoc;Kim, Sung-Chan
    • 전기전자학회논문지
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    • 제23권1호
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    • pp.181-187
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    • 2019
  • In this paper, we demonstrated a power amplifier monolithic microwave integrated circuit (MMIC) for X-band radar applications. It utilizes commercial $0.25{\mu}m$ GaN-based high electron mobility transistor (HEMT) technology and delivers more than 20 W of output power. The developed GaN-based power amplifier MMIC has small signal gain of over 22 dB and saturated output power of over 43.3 dBm (21.38 W) in a pulse operation mode with pulse width of $200{\mu}s$ and duty cycle of 4% over the entire band of 9 to 10 GHz. The chip dimensions are $3.5mm{\times}2.3mm$, generating the output power density of $2.71W/mm^2$. Its power added efficiency (PAE) is 42.6-50.7% in the frequency bandwidth from 9 to 10 GHz. The developed GaN-based power amplifier MMIC is expected to be applied in a variety of X-band radar applications.

A High-Efficiency CMOS Power Amplifier Using 2:2 Output Transformer for 802.11n WLAN Applications

  • Lee, Ockgoo;Ryu, Hyunsik;Baek, Seungjun;Nam, Ilku;Jeong, Minsu;Kim, Bo-Eun
    • JSTS:Journal of Semiconductor Technology and Science
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    • 제15권2호
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    • pp.280-285
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    • 2015
  • A fully integrated high-efficiency linear CMOS power amplifier (PA) is developed for 802.11n WLAN applications using the 65-nm standard CMOS technology. The transformer topology is investigated to obtain a high-efficiency and high-linearity performance. By adopting a 2:2 output transformer, an optimum impedance is provided to the PA core. Besides, a LC harmonic control block is added to reduce the AM-to-AM/AM-to-PM distortions. The CMOS PA produces a saturated power of 26.1 dBm with a peak power-added efficiency (PAE) of 38.2%. The PA is tested using an 802.11n signal, and it satisfies the stringent error vector magnitude (EVM) and mask requirements. It achieves -28-dB EVM at an output power of 18.6 dBm with a PAE of 14.7%.

An Integrated Approach of CNT Front-end Amplifier towards Spikes Monitoring for Neuro-prosthetic Diagnosis

  • Kumar, Sandeep;Kim, Byeong-Soo;Song, Hanjung
    • BioChip Journal
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    • 제12권4호
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    • pp.332-339
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    • 2018
  • The future neuro-prosthetic devices would be required spikes data monitoring through sub-nanoscale transistors that enables to neuroscientists and clinicals for scalable, wireless and implantable applications. This research investigates the spikes monitoring through integrated CNT front-end amplifier for neuro-prosthetic diagnosis. The proposed carbon nanotube-based architecture consists of front-end amplifier (FEA), integrate fire neuron and pseudo resistor technique that observed high electrical performance through neural activity. A pseudo resistor technique ensures large input impedance for integrated FEA by compensating the input leakage current. While carbon nanotube based FEA provides low-voltage operation with directly impacts on the power consumption and also give detector size that demonstrates fidelity of the neural signals. The observed neural activity shows amplitude of spiking in terms of action potential up to $80{\mu}V$ while local field potentials up to 40 mV by using proposed architecture. This fully integrated architecture is implemented in Analog cadence virtuoso using design kit of CNT process. The fabricated chip consumes less power consumption of $2{\mu}W$ under the supply voltage of 0.7 V. The experimental and simulated results of the integrated FEA achieves $60G{\Omega}$ of input impedance and input referred noise of $8.5nv/{\sqrt{Hz}}$ over the wide bandwidth. Moreover, measured gain of the amplifier achieves 75 dB midband from range of 1 KHz to 35 KHz. The proposed research provides refreshing neural recording data through nanotube integrated circuit and which could be beneficial for the next generation neuroscientists.

A 77 GHz mHEMT MMIC Chip Set for Automotive Radar Systems

  • Kang, Dong-Min;Hong, Ju-Yeon;Shim, Jae-Yeob;Lee, Jin-Hee;Yoon, Hyung-Sup;Lee, Kyung-Ho
    • ETRI Journal
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    • 제27권2호
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    • pp.133-139
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    • 2005
  • A monolithic microwave integrated circuit (MMIC) chip set consisting of a power amplifier, a driver amplifier, and a frequency doubler has been developed for automotive radar systems at 77 GHz. The chip set was fabricated using a 0.15 ${\mu}$ gate-length InGaAs/InAlAs/GaAs metamorphic high electron mobility transistor (mHEMT) process based on a 4-inch substrate. The power amplifier demonstrated a measured small signal gain of over 20 dB from 76 to 77 GHz with 15.5 dBm output power. The chip size is 2mm${\times}$ 2mm. The driver amplifier exhibited a gain of 23 dB over a 76 to 77 GHz band with an output power of 13 dBm. The chip size is 2.1mm${\times}$ 2mm. The frequency doubler achieved an output power of -6 dBm at 76.5 GHz with a conversion gain of -16 dB for an input power of 10 dBm and a 38.25 GHz input frequency. The chip size is 1.2mm ${\times}$ 1.2mm. This MMIC chip set is suitable for the 77 GHz automotive radar systems and related applications in a W-band.

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A Decade-Bandwidth Distributed Power Amplifier MMIC Using 0.25 μm GaN HEMT Technology

  • Shin, Dong-Hwan;Yom, In-Bok;Kim, Dong-Wook
    • Journal of electromagnetic engineering and science
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    • 제17권4호
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    • pp.178-180
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    • 2017
  • This study presents a 2-20 GHz monolithic distributed power amplifier (DPA) using a $0.25{\mu}m$ AlGaN/GaN on SiC high electron mobility transistor (HEMT) technology. The gate width of the HEMT was selected after considering the input capacitance of the unit cell that guarantees decade bandwidth. To achieve high output power using small transistors, a 12-stage DPA was designed with a non-uniform drain line impedance to provide optimal output power matching. The maximum operating frequency of the proposed DPA is above 20 GHz, which is higher than those of other DPAs manufactured with the same gate-length process. The measured output power and power-added efficiency of the DPA monolithic microwave integrated circuit (MMIC) are 35.3-38.6 dBm and 11.4%-31%, respectively, for 2-20 GHz.

A Low-Power Portable ECG Touch Sensor with Two Dry Metal Contact Electrodes

  • Yan, Long;Yoo, Hoi-Jun
    • JSTS:Journal of Semiconductor Technology and Science
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    • 제10권4호
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    • pp.300-308
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    • 2010
  • This paper describes the development of a low-power electrocardiogram (ECG) touch sensor intended for the use with two dry metal electrodes. An equivalent ECG extraction circuit model encountered in a ground-free two-electrode configuration is investigated for an optimal sensor read-out circuit design criteria. From the equivalent circuit model, (1) maximum sensor resolution is derived based on the electrode's background thermal noise, which originates from high electrode-skin contact impedance, together with the input referred noise of instrumentation amplifier (IA), (2) 60 Hz electrostatic coupling from mains and motion artifact are also considered to determine minimum requirement of common mode rejection ratio (CMRR) and input impedance of IA. A dedicated ECG read-out front end incorporating chopping scheme is introduced to provide an input referred circuit noise of 1.3 ${\mu}V_{rms}$ over 0.5 Hz ~ 200 Hz, CMRR of IA > 100 dB, sensor resolution of 7 bits, and dissipating only 36 ${\mu}W$. Together with 8 bits synchronous successive approximation register (SAR) ADC, the sensor IC chip is implemented in 0.18 ${\mu}m$ CMOS technology and integrated on a 5 cm $\times$ 8 cm PCB with two copper patterned electrodes. With the help of proposed touch sensor, ECG signal containing QRS complex and P, T waves are successfully extracted by simply touching the electrodes with two thumbs.

Coreless Printed Circuit Board (PCB) Transformers - Fundamental Characteristics and Application Potential

  • Hui S. Y.;Tang S. C.;Chung H.
    • 전력전자학회:학술대회논문집
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    • 전력전자학회 2001년도 Proceedings ICPE 01 2001 International Conference on Power Electronics
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    • pp.1-6
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    • 2001
  • In this article, the fundamental concept, characteristics and application potentials of coreless printed-circuit-board (PCB) transformers are described. Coreless PCB transformers do not have the limitations associated with magnetic cores, such as the frequency limitation, magnetic saturation and core losses. In addition, they eliminate the manual winding process and its associated problems, including labor cost, reliability problems and difficulties in ensuring transformer quality in the manufacturing process. The parameters of the printed windings can be precisely controlled in modern PCB technology. Because of the drastic reduction in the vertical dimension, coreless PCB transformers can achieve high power density and are suitable for applications in which stringent height requirements for the circuits have to be met. A transformer's power density of $24W/cm^2$ has been reported in a power conversion application. When used in an isolation amplifier application, coreless PCB transformers tested so far enable the amplifier to achieve a remarkable linear frequency range of 1MHz, which is almost eight times higher than the frequency range of 120kHz in existing Integrated-Circuit products. PCB materials offer extremely high isolation voltage, typically from 15kV to 40kV, which is higher than many other isolation means such as optocouplers. It is envisaged that coreless PCB transformers can replace traditional core-based transformers in some industrial applications. Their application potentials deserve more attention and exploration.

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알루미늄 게이트 PMOS 차동증폭기의 설계 및 제작 (Design and Fabrication of an Aluminum-Gate PMOS Differential Amplifier)

  • 신장규;권우현
    • 대한전자공학회논문지
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    • 제19권1호
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    • pp.14-19
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    • 1982
  • 알루미늄 게이트 PMOS집적회로 제작기법을 이용하여 차동증폭기를 설계, 제작하였다. 증가형 MOSFET 만으로 회로를 구성하였으며, 각 트랜지스터의 크기는 시뮬레이션 프로그램 MSINC를 이용하여 결정하였다. 제작된 집적회로를 +15v와 -l5V의 전원으로 동작시켰을때 DC전압이득은 42dB, 동상신호제법비(CMRR)는 50dB, 전력소모는 20mW이었다.

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2-6 GHz GaN HEMT Power Amplifier MMIC with Bridged-T All-Pass Filters and Output-Reactance-Compensation Shorted Stubs

  • Lee, Sang-Kyung;Bae, Kyung-Tae;Kim, Dong-Wook
    • JSTS:Journal of Semiconductor Technology and Science
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    • 제16권3호
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    • pp.312-318
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    • 2016
  • This paper presents a 2-6 GHz GaN HEMT power amplifier monolithic microwave integrated circuit (MMIC) with bridged-T all-pass filters and output-reactance-compensation shorted stubs using the $0.25{\mu}m$ GaN HEMT foundry process that is developed by WIN Semiconductors, Inc. The bridged-T filter is modified to mitigate the bandwidth degradation of impedance matching due to the inherent channel resistance of the transistor, and the shorted stub with a bypass capacitor minimizes the output reactance of the transistor to ease wideband load impedance matching for maximum output power. The fabricated power amplifier MMIC shows a flat linear gain of 20 dB or more, an average output power of 40.1 dBm and a power-added efficiency of 19-26 % in 2 to 6 GHz, which is very useful in applications such as communication jammers and electronic warfare systems.