• 제목/요약/키워드: Post-annealing treatment

검색결과 164건 처리시간 0.024초

Improvement of Carrier Mobility on Silicon-Germanium on Insulator MOSFET Devices with a Strained-Si Layer

  • Cho, Won-Ju;Koo, Hyun-Mo;Lee, Woo-Hyun;Koo, Sang-Mo;Chung, Hong-Bay
    • 한국전기전자재료학회논문지
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    • 제20권5호
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    • pp.399-402
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    • 2007
  • The effects of heat treatment on the electrical properties of strained-Si/SiGe-on-insulator (SGOI) devices were examined. We proposed the optimized heat treatment processes for improving the back interfacial electrical properties in SGOI-MOSFET. By applying the additional pre-RTA (rapid thermal annealing) before gate oxidation step and the post-RTA after source/drain dopant activation step, the electrical properties of strained-Si channel on $Si_{1-x}Ge_x$ layer were greatly improved, which resulting the improvement of the driving current, transconductance, and leakage current of SGOI-MOSFET.

Preparation of TiO2 Nanotube Arrays from Thin Film Grown by RF Sputtering

  • Kim, Chang Woo
    • Applied Science and Convergence Technology
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    • 제27권5호
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    • pp.105-108
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    • 2018
  • Transparent $TiO_2$ nanotube arrays are successfully prepared by a two-step approach involving electrochemical anodization and RF magnetron sputtering. First, a Ti film is deposited on an FTO substrate by RF magnetron sputtering at room temperature. The morphologies of the Ti film are controlled by the working distance, Ar flow, and DC power. Second, an anodization treatment is electrochemically performed for the formation of nanotube arrays from the deposited Ti film, followed by post-annealing treatment in air for the formation of $TiO_2$ crystallization. The back side of the crystallized $TiO_2$ nanotube arrays is illuminated with solar light to characterize the photoelectrochemical reaction, and their photoelectrochemical properties are investigated. This work provides information on application of a thin film deposited by RF sputtering in the field of photoelectrochemical water splitting.

Cu(In,Ga)Se2 박막의 KF 처리가 CIGS태양전지에 미치는 영향 (Effect of KF Treatment of Cu(In,Ga)Se2 Thin Films on the Photovoltaic Properties of CIGS Solar Cells)

  • 정광선;차은석;문선홍;안병태
    • Current Photovoltaic Research
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    • 제3권2호
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    • pp.65-70
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    • 2015
  • We applied KF on CIGS film to modify CIGS surface with a wider-bandgap surface layer. With the KF deposition the surface of CIGS film had fine particle on the CIGS surface at 350 and $300^{\circ}C$. No fine particle was detected at 500 and $250^{\circ}C$. With the KF treatment, the Ga and O content increased at the surface, while the In and Cu content decreased. The valence band maximum was lowered with KF treatment. The composition profile and band structure were positive side of applying KF on the CIGS surface. However, the efficiency decreased with the KF treatment due to high series resistance, probably due to too thick surface layer. A smaller amount of KF should be supplied and more systematic analysis is necessary to obtain a reproducible higher efficiency CIGS solar cells.

Effect of Dopants on Cobalt Silicidation Behavior at Metal-oxide-semiconductor Field-effect Transistor Sidewall Spacer Edge

  • Kim, Jong-Chae;Kim, Yeong-Cheol;Kim, Byung-Kook
    • 한국세라믹학회지
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    • 제38권10호
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    • pp.871-875
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    • 2001
  • Cobalt silicidation at sidewall spacer edge of Metal-Oxide-Semiconductor Field-Effect Transistors (MOSFETs) with post annealing treatment for capacitor forming process has been investigated as a function of dopant species. Cobalt silicidation of nMOSFET with n-type Lightly Doped Drain (LDD) and pMOSFET with p-type LDD produces a well-developed cobalt silicide with its lateral growth underneath the sidewall spacer. In case of pMOSFET with n-type LDD, however, a void is formed at the sidewall spacer edge with no lateral growth of cobalt silicide. The void formation seems to be due to a retarded silicidation process at the LDD region during the first Rapid Thermal Annealing (RTA) for the reaction of Co with Si, resulting in cobalt mono silicide at the LDD region. The subsequent second RTA converts the cobalt monosilicide into cobalt disilicide with the consumption of Si atoms from the Si substrate, producing the void at the sidewall spacer edge in the Si region. The void formed at the sidewall spacer edge serves as a resistance in the current-voltage characteristics of the pMOSFET device.

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Ta/TaN 복합 다층 피막의 기계적 특성 (Mechanical Properties of Ta/TaN Multilayer)

  • 강영권;이종무;최상욱
    • 한국재료학회지
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    • 제9권8호
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    • pp.837-842
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    • 1999
  • Ta/TaN 다층피막구조는 경도는 떨어지지만 연성이 큰 Ta 막과 취성을 가지며 경도가 높은 TaN 막을 교대로 반복하여 만든 다층구조로서 경도와 연성의 장점이 잘 조화되어 높은 인성을 나타낼 것으로 기대된다. 본 연구에서는 고속도강 기판위에 Ta/TaN 복합다층피막과 compositional gradient Ta-TaN 막을 각각 반응성 스퍼터링에 의하여 증착하고 열처리에 따른 경도 및 접착성을 조사하였다. $N_2$/Ar 유량비가 0.4일 때 결정성이 가장 우수한 TaN 막이 얻어지며, Ta/TaN 복합다층피막의 경도 및 스크래치 테스트 결과도 가장 우수하였다. 또한 Ta/TaN 복합다층피막 증착후의 어닐링 처리 시 어닐링 온도가 증가할수록 피막의 경도와 접착성이 악화되었으며, compositional modulation wavelength가 감소함에 따라 Ta/TaN 복합다층피막의 경도는 증가하지만 접착성은 wavelength에 대한 의존성이 약하게 나타났다. 그리고 compositional gradient Ta-TaN 막 증착후의 어닐링 처리 시 경도와 스크래치 테스트 값은 각각 20$0^{\circ}C$와 40$0^{\circ}C$에서 최대값을 나타내었다.

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Electrical Characteristics of SiO2/4H-SiC Metal-oxide-semiconductor Capacitors with Low-temperature Atomic Layer Deposited SiO2

  • Jo, Yoo Jin;Moon, Jeong Hyun;Seok, Ogyun;Bahng, Wook;Park, Tae Joo;Ha, Min-Woo
    • JSTS:Journal of Semiconductor Technology and Science
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    • 제17권2호
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    • pp.265-270
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    • 2017
  • 4H-SiC has attracted attention for high-power and high-temperature metal-oxide-semiconductor field-effect transistors (MOSFETs) for industrial and automotive applications. The gate oxide in the 4H-SiC MOS system is important for switching operations. Above $1000^{\circ}C$, thermal oxidation initiates $SiO_2$ layer formation on SiC; this is one advantage of 4H-SiC compared with other wide band-gap materials. However, if post-deposition annealing is not applied, thermally grown $SiO_2$ on 4H-SiC is limited by high oxide charges due to carbon clusters at the $SiC/SiO_2$ interface and near-interface states in $SiO_2$; this can be resolved via low-temperature deposition. In this study, low-temperature $SiO_2$ deposition on a Si substrate was optimized for $SiO_2/4H-SiC$ MOS capacitor fabrication; oxide formation proceeded without the need for post-deposition annealing. The $SiO_2/4H-SiC$ MOS capacitor samples demonstrated stable capacitance-voltage (C-V) characteristics, low voltage hysteresis, and a high breakdown field. Optimization of the treatment process is expected to further decrease the effective oxide charge density.

탄화규소 반도체의 구리 오옴성 접촉 (Copper Ohmic Contact on n-type SiC Semiconductor)

  • 조남인;정경화
    • 마이크로전자및패키징학회지
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    • 제10권4호
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    • pp.29-33
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    • 2003
  • n-형 탄화규소 반도체에 대한 구리금속을 이용하여 오옴성 접촉 구조를 제작하였다. 제작된 구리접촉에 대해 후속열처리 조건과 금속접촉 구조에 따른 재료적, 전기적 성질의 변화를 조사하였다. 금속접촉의 오옴성 성질은 금속박막의 구조 뿐 아니라 열처리조건에 대해서도 크게 좌우됨을 알 수 있었다. 열처리는 급속열처리 장치를 이용한 진공상태 및 환원 분위기에서 2단계 열처리방식을 통하여 시행하였다. 접촉비저항의 측정을 위해 TLM 구조를 만들었으며 면저항 ($R_{s}$), 접합저항 ($R_{c}$), 이동거리 ($L_{T}$), 패드간거리 (d), 전체저항 ($R_{T}$) 값을 구하여 알려진 계산식에 의해 접촉비저항 ($p_{c}$) 값을 추정하였다. 진공보다 환원분위기에서 후속 열처리를 수행한 시편이 양호한 전기적 성질을 가짐을 알 수 있었다. 가장 양호한 결과는 Cu/Si/Cu 구조를 가진 금속접촉 결과이었으며 접촉비저항 ($p_{c}$)은 $1.2\times 10^{-6} \Omega \textrm{cm}^2$의 낮은 값을 얻을 수 있었다. 재료적 성질은 XRD를 이용하여 분석하였고 SiC 계면 상에 구리와 실리콘이 결합한 구리 실리사이드가 형성됨을 알 수 있었다.

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HD 처리 및 열처리공정 개선에 의한 (Nd, Dy)-Fe-B 소결자석의 자기특성 향상 (Improvement of the Magnetic Properties of (Nd, Dy)-Fe-B Sintered Magnets by Modification of HD and Annealing Processes)

  • 남궁석;이연호;김문갑;장태석
    • 한국분말재료학회지
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    • 제17권5호
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    • pp.359-364
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    • 2010
  • In an attempt to optimize the magnetic properties of (Nd, Dy)-Fe-B sintered magnets, hydrogenation and post-sintering heat treatment processes were investigated at various hydrogenation temperatures and heat treatment temperatures. The coercivity of (Nd, Dy)-Fe-B sintered magnets hydrogenated at $400^{\circ}C$ increased to about 1.2 kOe without any detrimental effect on the remanence. Moreover, the coercivity of the magnets was enhanced further by a consecutive $2^{nd}$ and $3^{rd}$ step heat treatment. These results eventually leaded to the reduction of the Dy content in a high coercive (> 30 kOe) (Nd, Dy)-Fe-B sintered magnets, as much as 10%.

RF 스퍼터링 및 급속열처리 공정으로 제작한 ZnS:Nd 박막의 구조 및 광학적 특성 (Structure and Optical Properties of ZnS:Nd Thin filmsss Produced by RF Sputtering and Rapid Thermal Annealing Process)

  • 김원배
    • 한국전자통신학회논문지
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    • 제16권2호
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    • pp.233-240
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    • 2021
  • 다양한 함량으로 네오디뮴이 도핑된 황화아연 박막제작은 RF 마그네트론 스퍼터링 장비를 이용하여 황화아연과 네오디뮴을 동시 증착하여 박막을 제작하였고, 후처리 공정으로 급속열처리를 400℃ 에서 30분간 실시하였다. 다양한 네오디뮴의 도핑 함량(0.35at.%, 1.31at.%, 1.82at.% 및 1.90at.%)을 갖는 ZnS 박막의 구조, 형태, 광학적 특성을 연구하였다. X-선 회절 패턴은 모든 박막에서 (111)방향의 큐빅 구조로 성장하였다. SEM 이미지와 AFM 이미지를 통해 네오디뮴 도핑 함량에 의한 박막의 표면 및 구조적 형태에 대하여 설명하였다. EDAX를 통해 다른 불순물이 포함되지 않은 Zn, S 및 Nd의 원소만을 확인하였다. UV-vis 스펙트럼을 이용하여 제작된 박막의 투과율과 밴드갭을 확인하였다.

용접 공정 디자인에 따른 클래드강의 기계적 성질 변화 (Change of Mechanical Properties of Clad Steel According to the Welding Process Design)

  • 이정현;박재원
    • 한국생산제조학회지
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    • 제22권3호
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    • pp.372-379
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    • 2013
  • In this study, we investigated the traits of the clad metals used in hot-rolled clad steel plates. We examined the sensitization and mechanical properties of STS 316 steel plate and carbon steel (A516) under the specific circumstances of post heat treatment and whether a weld was multilayered and thick or repeated because of repairs. The test conditions were as follows. The clad steel plates were butt-welded using FCAW/SAW, and the heat treatment was conducted at $625^{\circ}C$, for 80, 160, 320, 640, or 1280 min. The change in the corrosion resistance was evaluated in these specimens. In the case of the carbon steel (A516), as the heat treatment time increased, the annealing effect caused the tensile strength to decrease. The micro- hardness gradually increased and then decreased after 640 min. The elongation and contraction of the area increased gradually. An oxalic acid etch test and EPR test on STS316, a clad metal, showed a STEP structure and no sensitization. From the test results for the multi-layered and repair welds, it could be concluded that there is no effect on the corrosion resistance of clad metals. In summary, the purpose of this study was to suggest some considerations when developing on-site techniques and evaluate the sensitization of stainless steels.