• Journal of the Korea Fashion and Costume Design Association
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• v.5 no.3
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• pp.7-14
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• 2003

Fabrics dyed with artemisia extract have quite natural and elegant tones of color. This study purposed to find the best one for dyeing among artemisia collected in the four seasons in order to develop a more efficient method of dyeing with artemisia. As for the method of research, the researcher dyed wool fabric and silk fabric with artemisia, and measured dyeability according to the number of repeats of dyeing, coloration by post-mordant, color fastness to washing, color fastness to dry cleaning and color fastness to light. The results are as follows. 1. In dyeing with artemisia, dyeability was improved as the number of repeat of dying increased, and it was higher in wool fabric than in silk fabric. 2. Among artemisia collected in the four seasons, autumn artemisia had dyeability much inferior to that of artemisia from the other seasons, and winter artemisia had the best dyeability. 3. According to the result of treating fabric with post-mordant, the dyeability was improved significantly, and coloration was most remarkable when copper and iron mordant were used. 4. The color fastness to washing and color fastness to dry cleaning of fabric mordanted with artemisia were as high as grade 4-5 and grade 5 respectively. The color fastness to light was highest in winter artemisia as grade 4.

• Transactions of the Korean Society of Automotive Engineers
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• v.13 no.4
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• pp.167-173
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• 2005

Thermal regeneration means burning-off and cleaning-up the particulate matters piled up in DPF(diesel particulate filter), and it requires both high temperature $(550\~600^{\circ}C)$ and appropriate concentration of oxygen at DPF entrance. However, it is not easy to satisfy such conditions because of the low temperature window of the HSDI(high speed direct injection) diesel engine(approximately $200\~350^{\circ}C$ at cycle). Therefore, this study is focused on the method to raise temperature using the trade-off relation between temperature, oxygen concentration, and the influence of many parameters of common rail injection system including post injection. After performing an optimal mapping of the common rail parameters for regeneration mode, the actual cleaning process during regeneration mode is investigated and evaluated the availability of the regeneration mode mapping through regenerating soot trapped in the DPF.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.24 no.1
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• pp.17-21
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• 2011

Copper (Cu) had been attractive material due to its superior properties comparing to other metals such as aluminum or tungsten and considered as the best metal which can replace them as an interconnect metal in integrated circuits. CMP (Chemical Mechanical Polishing) technology enabled the production of excellent local and global planarization of microelectronic materials, which allow high resolution of photolithography process. Cu CMP is a complex removal process performed by chemical reaction and mechanical abrasion, which can make defects of its own such as a scratch, particle and dishing. The abrasive particles remain on the Cu surface, and become contaminations to make device yield and performance deteriorate. To remove the particle, buffing cleaning method used in post-CMP cleaning and buffing is the one of the most effective physical cleaning process. AE(Acoustic Emission) sensor was used to detect dynamic friction during the buffing process. When polishing is started, the sensor starts to be loaded and produces an electrical charge that is directly proportional to the applied force. Cleaning efficiency of Cu surface were measured by FE-SEM and AFM during the buffing process. The experimental result showed that particles removed with buffing process, it is possible to detect the particle removal efficiency through obtained signal by the AE sensor.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.11a
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• pp.366-367
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• 2006

In general, HF chemistry lifts off the particles during scrubbing after polishing and effectively removes particles. It is sometimes impossible to apply HF chemistry on W plug due to the degradation of electrical characteristics of a device. In this paper, a post W CMP cleaning process is proposed to remove residue particles without applying HF chemistry. After W CMP, recessed plugs are created, therefore they easily trap slurry particles during CMP process. These particles in recessed plug are not easy to remove by brush scrubbing when $NH_4OH$ chemistry is used for the cleaning because the brush surface can not reach the recessed area of plugs. Buffing with oxide slurry was followed by W CMP due to its high selectivity to W. The buffing polishes only oxide slightly which creates higher plug profiles than surrounding oxide. Higher profiles make the brush contact much more effectively and result in a similar particle removal efficiency even in $NH_4OH$ cleaning to that in HF brush scrubbing.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2007.10a
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• pp.747-750
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• 2007

This study proposes that chlorine residue after metal etch as the source of metal corrosion, and charges should be removed by optimizing etch, PR strip and cleaning condition. Charges distributed along the metal line acts as a source of tungsten (W) plug corrosion when associated with following cleaning solution. In cleaning process after metal etch and PR strip, chemical selection is significantly important in terms of metal corrosion. Optimal corrosion preventive PH, no metal attack (choice of optimal inhibitants), high by product removal efficiency and optimal de ionized water treatment condition is critical to the metal corrosion prevention.

• Journal of Fashion Business
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• v.15 no.4
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• pp.182-189
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• 2011

Dyeing properties of cow leather was investigated with Tumeric powder. The effects of dyeing conditions, mordanting conditions, color change, and color fastnesses were studied. The results were as follows. The dye uptake increased as dye concentration, dyeing temperature, and bath ratio increased. In the effect of dyeing time, the highest dye uptakes showed at 20 minutes and decreased after that point. Pre mordanting was more effective than the post mordanting, and the dye uptakes improved all mordanted fabrics. The highest K/S values showed in pre-Al sample, and the lowest K/S values showed in post-Cu one. The values of Hunter on the samples were more changeable $L^*$ and $b^*$ than $a^*$, and all samples showed Yellow color in Munsell value. But the mordanting methods and mordanting agents were not significant in the color changes. The light fastness of dyed samples showed 1 grade, the dry cleaning and abrasion fastnesses did not improved except post-Fe wet sample.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2013.05a
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• pp.170-170
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• 2013

We present a novel etching technique for 2-dimentional (2-D) hexagonal boron nitride (h-BN) by using capacitively coupled plasma (CCP) of oxygen combined with a post-treatment by de-ionized (DI) water. Oxygen CCP etching process for h-BN has been systematically studied. It is found that a passivation layer was generated to obstruct further etching while it can be easily and radically removed by DI water. An essential cleaning effect also has been observed in the etching process, organic residues are successfully removed and the surface roughness has much decreased. Considering h-BN is the most important 2-D dielectric material and its potential application for graphene to silicon-based electronic devices, such an etching method can be widely used to control the 2-D h-BN thickness and improve the surface quality.

• Electrical & Electronic Materials
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• v.7 no.4
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• pp.294-299
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• 1994

CHF$_{3}$/CH$_{4}$Ar 플라즈마에 의해 형성된 산화막 식각 잔류물의 화학구조와 이 잔류물의 제거를 위한 세정방법을 x-ray photoelectron spectroscopy를 이용하여 조사하였다. 잔류무르이 구조는 CF$_{x}$-polymer와 Si-C, Si-O 결합으로 이루어진 SiO$_{y}$ C$_{z}$ 이었다. CF$_{4}$O$_{2}$ 플라즈마에 의한 silicon light etch는 산화막 식각 잔류물인 SiO$_{y}$ C$_{z}$ 층과 손상된 실리콘 표면을 제거하엿으며 NH$_{4}$OH-H$_{2}$O$_{2}$과 HF용액으로 완전히 제거되는 CF$_{x}$-polymer/SiO$_{x}$층을 남겼다. 100.angs.정도의 silicon light etch는 minority carrier life time과 thermal wave signal값을 초기 웨이퍼 수준까지 회복시켰으며 접합누설 전류도 거의 습식 식각 공정수준까지 감소시켰다.

• Membrane and Water Treatment
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• v.7 no.5
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• pp.451-462
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• 2016

The molecular weight of proteins and protein hydrolysis products (PHP) in the fractionated post-production marinating brines left after herring marination process was determined by the HPLC. The proteins and PHP retention was evaluated in the three-stage purification process with the usage of polypropylene bag ($25{\mu}m$) and ceramic membranes with the cut-off of 150 and 1 kDa. It was found that the process of marination contributes to high participation of compounds in the post-production marinating brines. Those are characterised by low molecular weight, formed as a result of protein hydrolysis. Each stage of the scavenging process was reducing the content of proteins and PHP. The lowest retention was observed in the stage at which a PP bag was used, while the highest in the UF process, with the usage of 150 kDa membrane. The total retention of proteins and PHP differed according to the type of post-production marinating brines and reached the level of 16-22%.

• Proceedings of the Korean Society of Dyers and Finishers Conference
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• 2008.04a
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• pp.117-119
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• 2008

This study was investigated for the dyeing properties of silk fabrics with Annatto Extract. The dye stuff was extracted by distilled water at 60$^{\circ}C$, 10minutes, 100:1 of bath ratio. The highest K/S value was showed at 25% dye concentration, 60minutes of dyed time at 50$^{\circ}C$ in the temperature. The post mordant conditions were better than that of pre mordant, especially post-Fe mordant showed highest K/S value. The laundering fastness was relatively good by Cu-mordant. Drying cleaning fastness appeared 4-5 grades.