• Proceedings of the Korea Concrete Institute Conference
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• 1999.10a
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• pp.319-322
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• 1999

The adhesion properties of polymer cement mortars for cement concrete repair were evaluated with respect to polymer-cement ratios and the surface conditions of cement concrete substrate. Styrene-butadiene rubber (SBR) was used as an additive for polymer cement mortars. The adhesion strength of cement mortar was smaller than that of polymer cement mortar. The adhesion strengths to the dry surfaces of substrate were larger than those to the wet surfaces, indicating that the dryness of substrate increased the adhesion strength in repairing concrete structures.

• Transactions on Electrical and Electronic Materials
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• v.6 no.3
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• pp.106-109
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• 2005

We have investigated the generation of pretilt angle for a nematic liquid crystal (NLC) alignment with in-situ photoalignment method on polyimide (PI) surfaces using polymer films. Especially, we studied in-situ photoalignment changing heating temperature from $50^{\circ}C\;to\;120^{\circ}C$ on the polymer film. The LC aligning capabilities and pretilt angle on the polymer substrates were better than those on the glass substrate using in-situ photoalignment method. It is considered that this increase in pretilt angle may be attributed to the roughness of the micro-groove substrate induced by the in-situ photoalignment. As temperature of heated subtrate and UV exposure time increase, pretilt angle of the cell used polymer film increased. It is considered that the heating temperature of substrate is attributed to generate pretilt angle. Also, electro-optical performances of the in-situ photoaligned TN cell using the polymer substrate are almost the same as that of the TN cell using the glass substrate.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.07a
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• pp.504-505
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• 2005

In this report, we demonstrate a high performance polymer thin-film transistor fabricated on a paper substrate. As a water barrier layer, parylene was coated on the paper substrate by using vacuum deposition process. Using poly (3-hexylthiophene) as an active layer, a polymer thin-film transistor with field-effect of up to 0.086 $cm^2/V{\cdot}s$ and on/off ratio of $10^4$ was achieved. The fabrication of polymer thin-film transistor built on a cheap paper substrate is expected to open a channel for future applications in flexible and disposable electronics with extremely low-cost.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.22 no.8
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• pp.645-649
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• 2009

We investigated the effects of a high density $O_2$ plasma treatment on the structural and electrical properties of Ga-, B- codoped ZnO (GZOB) films. The GZOB films were deposited on polymer substrate without substrate heating by DC magnetron sputtering. Prior to the GZOB film growth, we treated a polymer substrate with highly dense inductively coupled oxygen plasma. The optical transmittance of the GZOB film, about 80 %, was maintained regardless of the plasma pre-treatment. The resistivity of the GZOB film on PC substrate decreased from 9.08 ${\times}$ $10^{-3}$ ${\Omega}-cm$ without an $O_2$ plasma pre-treatment to 2.12 ${\times}$ $10^{-3}$ ${\Omega}-cm$ with an $O_2$ plasma pre-treatment. And PES substrate decreased from 1.14 ${\times}$ $10^{-2}$ ${\Omega}-cm$ without an $O_2$ plasma pre-treatment to 6.13 ${\times}$ $10^{-3}$ ${\Omega}-cm$ with an $O_2$ plasma pre-treatment.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.413-413
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• 2007

In recent years, flexible display devices such as liquid crystal display (LCD), organic light emitting diode (OLED), etc. have attracted considerable interest in a wide variety of applications. Polymer substrate is absolutely necessary to realize this kind of flexible display devices. Using the polymer as a substrate, there are lots of advantages including not only mechanical flexibility such as rolling and bending characteristics but also light weights, low cost and so on. In detail, thickness and weights is only one forth and one second of glass substrate, respectively. However, it needs low temperature below $150^{\circ}C$ in the fabrication process comparing to conventional deposition process. The polymer substrate is not thermally stable as much as the glass substrate so that some deformation can be occurred according to variation of temperature. In particular, performance of devices can be easily deteriorated by shrinkage of substrate when heating it. In this paper, pre-annealing and deposition of buffer layer was introduced and studied to solve previously mentioned problems of the shrinkage and followed shear stress.

• ETRI Journal
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• v.26 no.3
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• pp.281-284
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• 2004

We demonstrate a new fabrication method for adjusting the temperature dependence of a polymeric arrayed-waveguide grating (AWG) on a Si substrate. A temperature-dependent wavelength shift of-0.1nm/$^{\circ}C$ in a polymeric AWG on a Si substrate is reduced of+0.1nm/$^{\circ}C$ by detaching part of the polymer film, including the grating channel region of the AWG, from the Si substrate while the other parts remain fixed on the substrate.

• Proceedings of the Korea Concrete Institute Conference
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• 1998.10a
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• pp.330-335
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• 1998

This research was conducted to evaluate the adhesion in tension of the polymer mortars for cement concrete repair. Various polymer types, binder ratios, and wet/dry conditions of the surface were considered in this study. Styrene-butadiene rubber (SBR) and ethylen vinyl acetate (EVA) used for polymer cement mortars. Epoxy resin (EP), and unsaturated polyester resin (UP) were used for polymer mertars. Adhesion in tension for the dry condition of the substrate surface was higher than that for the wet condition of the substrate surface under the same binder ratio. Therefore, in repairing concrete, the dry surface condition was effective on adhesion.

• Proceedings of the Materials Research Society of Korea Conference
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• 2011.05a
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• pp.66.2-66.2
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• 2011

A polymer-based multi-walled carbon nanotube (MWCNT) field emission device was fabricated from a composite dispersion of MWCNTs and waterborne polymethyl methacrylate (PMMA). The waterborne PMMA synthesized through the emulsion polymerization method was added to minimize the reagglomeration of dispersed MWCNTs with surfactants in water, and increase the adhesion between the and the substrate. The field emission properties of the fabricated device were optimized by adjusting the density of the emitter and the adhesion between the MWCNTs and the substrate. These were done by controlling the polymer concentration added to the MWCNT dispersion, as well as the amount of spray coating on the substrate. The results confirm the successful fabrication of a polymer-based MWCNT field emission device with a low field of 1.07 $V/{\mu}m$ and a good electric field enhancement factor of 2445. The device was fabricated by adding 0.8 mg/mL of polymer solution to the MWCNT dispersion and applying 20 cycles of spray coating. Application of this same MWCNT/polymer composite solution to a flexible polymer substrate also resulted in the successful fabrication of an electric field emission device with uniform emission and long time stability.

• Korean Journal of Materials Research
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• v.14 no.3
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• pp.203-210
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• 2004

Effects of various pretreatments on the adhesion of copper-coated polymer films were investigated. Copper-coated polymer films were prepared by an electron cyclotron resonance-metal organic chemical vapor deposition (ECR-MOCVD) coupled with a DC bias system at room temperature. PET(polyethylene terephthalate) film was employed as a substrate material and it was pretreated by industrially feasible methods such as chromic acid, sand-blasting, oxygen plasma and ion-implantation treatment. Surface characterization of the copper-coated polymer film was carried out by AFM(Atomic Force Microscopy) and FESEM(Field Emission Scanning Electron Microscopy). Surface energy was calculated by based on the value of the contact angle measured. The adhesion of copper/PET films was determined by a pull-off test according to ASTM D-5179. It was found that suitable pretreatment of the PET substrate was required for obtaining good adhesion property between copper films and the substrate. In this study the highest adhesion was observed in sand-blasting, and then followed by those of acid and oxygen plasma treatment. However, the effect of surface energy was insignificant in our experimental range. This is probably due to compensating the difference in surface energy from various pretreatments by exposing substrate to ECR plasma for 5 min or longer at the early stage of the copper deposition. Therefore, it can be concluded that surface roughness of the polymer substrate plays an important role to determine the adhesion of copper-coated polymer for the deposition of copper by ECR-MOCVD.

• Transactions of Materials Processing
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• v.13 no.1
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• pp.39-44
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• 2004

Transcribability of pit or land groove structures in replicating an optical disk substrate greatly affects the performance of a high-density optical disk. However, a solidified layer, generated during the polymer filling, deteriorates transcribability because the solidified layer prevents the polymer melt from filling the sub-micro patterns. Therefore, the development of the solidified layer during filling stage of injection molding must be delayed. For this delay, passive heating by insulation layer has been used. In the present study, to examine the development of the solidified layer delayed by passive heating, the flow of polymer melt with passive heating was analyzed. Passive heating markedly delayed the development of the solidified layer, reduced the viscosity of the polymer melt, and increased the fluidity of the polymer melt in the vicinity of the stamper surface with the sub-micro patterns. As a result, we predict that passive heating can improve transcribability of an optical disk substrate. To verify our prediction, we fabricated an optical disk substrate by using passive heating of a mold and measured the transcribability of an optical disk substrate.