• Journal of the Korean Society for Precision Engineering
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• v.29 no.6
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• pp.686-692
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• 2012

Solid free-form fabrication (SFF) technology was developed to fabricate three-dimensional (3D) scaffolds for tissue engineering (TE) applications. In this study, we developed a polymer deposition system (PDS) and created 3D microstructures using a bioresorbable polycaprolactone (PCL) polymer. Fabrication of 3D scaffolds by PDS requires a combination of several devices, including a heating system, dispenser, and motion controller. The system can process a polymer with extremely high precision by using a 200 ${\mu}m$ nozzle. Based on scanning electron microscope (SEM) images, both the line width and the piled line height were fine and uniform. Several 3D micro-structures, including the ANU pattern (a pattern named after Andong National University), $45^{\circ}$ pattern square, frame, cylindrical, triangular, cross-shaped, and hexagon, have been fabricated using the polymer deposition system.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.32 no.5
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• pp.419-423
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• 2008

A new polymer replication technology using ultrasonic vibration is proposed and demonstrated. A commercial ultrasonic welder has been used in this experiment. Two different types of nickel molds have been fabricated: pillar type and pore type microstructures. Polymethyl methacrlylate (PMMA) has been used as the replication material and the optimal molding time was 2 sec and 2.5 sec for pillar-type and pore-type micromolds, respectively. Compared with the conventional polymer micromolding techniques, the proposed ultrasonic micromolding technique has the shortest processing time. In addition, only contact area between micromold and polymer substrate is melted so that the thermal shrinkage can be minimized. The fabricated PMMA microstructures have been very accurately replicated without vacuum. The proposed ultrasonic molding technique is a good alternative for high volume production.

• Journal of Sensor Science and Technology
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• v.15 no.2
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• pp.148-152
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• 2006

This paper describes the fabrication of SiCN microstructures for super-high temperature MEMS using photopolymerization of pre-ceramic polymer. In this work, polysilazane liquide as a precursor was deposited on Si wafers by spin coating, microstructured and solidificated by UV lithography, and removed from the substrate. The resulting solid polymer microstructures were cross-linked under HIP process and pyrolyzed to form a ceramic of withstanding over $1400^{\circ}C$. Finally, the fabricated SiCN microstructures were annealed at $1400^{\circ}C$ in a nitrogen atmosphere. Mechanical characteristics of the SiCN microstructure with different fabrication process conditions were evaluated. The elastic modules, hardness and tensile strength of the SiC microstructure implemented under optimum process condtions are 94.5 GPa, 10.5 GPa and 11.7 N/min, respectively. Consequently, the SiCN microstructure proposed in this work is very suitable for super-high temperature MEMS application due to very simple fabrication process and the potential possiblity of sophisticated mulitlayer or 3D microstructures as well as its good mechanical properties.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.06a
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• pp.392-393
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• 2006

This paper describes the fabrication of SiCN microstructures for super-high temperature MEMS using photopolymerization of pre-ceramic polymer. In this work. polysilazane liquide as a precursor was deposited on Si wafers by spin coating. microstructured and solidificated by UV lithography. and removed from the substrate. The resulting solid polymer microstructures were cross-linked under HIP process and pyrolyzed to form a ceramic of withstanding over $1400^{\circ}C$. Finally, the fabricated SiCN microstructures were annealed at $1400^{\circ}C$ in a nitrogen atmosphere. Mechanical characteristics of the SiCN microstructure with different fabrication process conditions were evaluated. The elastic modules. hardness and tensile strength of the SiC microstructure implemented under optimum process conditions are 94.5 GPa, 10.5 GPa and 11.7 N/min, respectively. Consequently, the SiCN microstructure proposed in this work is very suitable for super-high temperature MEMS application due to very simple fabrication process and the potential possiblity of sophisticated multlayer or 3D microstructures as well as its good mechanical properties.

• Polymer Science and Technology
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• v.23 no.5
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• pp.525-540
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• 2012

• Journal of Information Display
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• v.12 no.3
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• pp.115-119
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• 2011

Optically isotropic liquid crystal (LC) mixture such as blue-phase LC and nanostructured LC composites exhibit the advantages of fast response time, high contrast ratio and wide-viewing angle due to the induced birefringence along the horizontal electric field. Utilizing this mixture, a novel single cell gap in-plane switching-type polymer-stabilized blue-phase transflective liquid crystal display by embedding the nanowire grid polarizer as a polarization-dependent reflective polarizer in the R region is proposed. This device can be used as a normal black mode without any quarter-wave plate or patterned in-cell phase retarder. Moreover, the transmittance is identical to the reflectance so that it will be suitable for single gamma driving. Detailed electro-optic performances, such as voltage-dependent light efficiency and viewing angle of the proposed device configuration, are investigated.

• Journal of the Korean Ceramic Society
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• v.31 no.12
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• pp.1467-1474
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• 1994

The effects of the dispersion, drying, and binder burning-out on the green-microstructures of gelcasted alumina were studied. The slip consisting of 55 vol% alumina powder and 5 wt% organic materials was well-dispersed by adding 0.28 wt% polyelectrolyte polymer. Green bodies were dried at >85% relative humidity at room temperature. Green-microstructures were observed to be depended on the heating rate during binder burnout. Constant drying rate was not observed in drying process of gelcasted alumina. Sintered body showed its relative density higher than 99% when it was sintered at 1$600^{\circ}C$ for 2 hours.

• Journal of Sensor Science and Technology
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• v.15 no.1
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• pp.53-57
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• 2006

This paper describes a novel processing technique for fabrication of polymer-derived SiCN (silicone carbonitride) microstructures for super-temperature MEMS applications. PDMS (polydimethylsiloxane) mold is fabricated on SU-8 photoresist using standard UV photolithographic process. Liquid precursor is injected into the PDMS mold. Finally, solid polymer structure is cross-linked using HIP (hot isostatic pressure) at $400^{\circ}C$, 205 bar. Optimum pyrolysis and annealing conditions are determined to form a ceramic microstructure capable of withstanding over $1400^{\circ}C$. The fabricated SiCN ceramic microstructure has excellent characteristics, such as shear strength (15.2 N), insulation resistance ($2.163{\times}10^{14}{\Omega}$) and BDV (min. 1.2 kV) under optimum process condition. These fabricated SiCN ceramic microstructures have greater electric and physical characteristics than bulk Si wafer. The fabricated SiCN microstructures would be applied for supertemperature MEMS applications such as heat exchanger and combustion chamber.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.04b
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• pp.125-128
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• 2004

In this paper, a novel processing technique for fabrication of high-temperature MEMS based on polymer-derived SiCN microstructures is described. PDMS molds are fabricated on SU-8 photoresist using standard UV-photolithographic processes. Liquid precursors are injected into the PDMS mold. And then, the resulting solid polymer structures are crosslinked under isostatic pressure, and pyrolyzed to form a ceramic capable of withstanding over $1500^{\circ}C$. These fabricated SiCN structures would be applied for high-temperature applications, such as heat exchanger and combustion chamber.

• Journal of the Korean Electrochemical Society
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• v.7 no.2
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• pp.100-107
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• 2004

The nano or micro sized structures of conducting polymer had been prepared by synthesizing the desired polymer within the pores of template of nano or micro porous membrane filter. In this study, we had tried to fabricate conducting polymer microstructures on an electrode by using electrochemical deposition adopting template synthesis. Our attention was focused on two different things, attaching template on the electrode and fabricating microstructures only at limited areas of the electrode. A conducting polymer, PEDiTT (poly 3,4-ethylenedithi-athiophene) solution was blended with PVA(polyvinyl alcohol) solution and used as an conducting adhesive. After attaching template membrane, the electrode were immersed in 0.5M pyrrole in 0.1M KCI solution, and electrochemical polymerization was performed. The growth process of the microstructures studied by SEM. The electrochemical fabrication of conducting polymer was performed by using two-electrode system. A large working electrode and a micro scale disc electrode were used for the confined area synthesis. Polymerization potential was 4V in an electrolytic solution made of KCI in deionized water. The optimum polymerization conditions were, i.e. (4V/100sec) for $250{\mu}m$ electrode and (6V/30 sec) for $10{\mu}m$ electrode.