• Journal of Mechanical Science and Technology
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• v.18 no.9
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• pp.1572-1581
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• 2004

The purposes of the paper are to apply the axiomatic design methodology to the design of PBGA package with polyimide coating under hygrothermal loading in the IR soldering process and to suggest more reliable design conditions by stress analysis. The analysis model is a 256-pin perimeter Plastic Ball Grid Array (PBGA) package with the polyimide coating surrounding chip and above surface of BT-substrate. The polyimide coating is suggested to depress the maximum stresses occurred on the stress concentration positions. The axiomatic design methodology is proved to be useful to find the more reliable design conditions for PBGA package. Finally, the optimal values of design variables to depress the stress in the PBGA package are obtained.

• Journal of Mechanical Science and Technology
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• v.18 no.3
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• pp.357-369
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• 2004

The purposes of the paper are to analyze the fracture phenomenon by delamination and cracking when the encapsulant of plastic IC package with polyimide coating shows viscoelastic behavior under hygrothermal loading in the IR soldering process and to suggest more reliable design conditions by the approaches of stress analysis and fracture mechanics. The model is the plastic SOJ package with the polyimide coating surrounding chip and dimpled diepad. On the package without cracks, the optimum position and thickness of polyimide coating to decrease the maximum differences of strains at the bonding surfaces of parts of the package are studied. For the model delaminated fully between the chip and the dimpled diepad, C(t)-integral values are calculated for the various design variables. Finally, the optimal values of design variables to depress the delamination and crack growth in the plastic IC package are obtained.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.35 no.1
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• pp.58-65
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• 2022

The field of liquid crystal display (LCD) is constantly in the spotlight and the process of depositing an alignment layer in the LCD manufacturing process is very important to obtain excellent performance such as low-power driving and high-speed response to improve LCD performance. Therefore, research on liquid crystal (LC) alignment is being actively conducted. When manufacturing LCD, it is necessary to consider the effect of the alignment layer thickness as one of the factors affecting various LCD performances. In addition, previous studies confirmed the LC alignment characteristics correlate with the rotation speed in the spin coating process. Therefore, the electro-optical properties of the LCD were investigated by manufacturing a polyimide alignment layer by varying the rotation speed in the spin coating process in this study. It was confirmed that the thickness of the polyimide alignment layer was controlled according to the spin coating conditions. The average transmittances of anti-parallel LC cells at the spin coating speed of 2,500 rpm and 3,000 rpm are about 60%, which indicates that the LC cell has relatively higher performance. At the spin coating speed of 3,000 rpm, the voltage-transmittance curve of twisted nematic (TN) LC cell was below 1.5 V, which means that the TN LC cell operated at a low power. In addition, high-speed operating characteristics were confirmed with a response time of less than 30 ms. From these derived data, we confirmed that the ideal spin coating speed is 3,000 rpm. And these results provide an optimized polyimide alignment layer process when considering enhanced future LCD manufacturing.

• 한국정보디스플레이학회:학술대회논문집
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• 2007.08a
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• pp.348-351
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• 2007

A pure polyimide substrate and polyimide substrate with nano-silica additive have been formed on glass by coating. The a-Si:H TFT arrays have been formed on such polyimide substrate for driving TNLCD.

• Electrical & Electronic Materials
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• v.9 no.1
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• pp.59-66
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• 1996

Polyimides containing cyclobutane ring in main chain is known to be thermally stable and able to be developed in organic solvents after photolysis with 254 nm UV light. This type of polyimides can be used as promising positive photoresist in VLSI fabrication process. In the current VLSI process, photoresist films are formed by spin coating. The film thickness is more than several hundred nano meters. It seems that there is room for improvement of film coating process by introducing Langmuir Blodgett technique. Thereby ultra thin film photoresist can be formed, and higher density of integration in VLSI be achieved. In the present work, depositing procedure of LB films of this polyimide was investigated. LB film thickness was measured by ellipsometry to evaluate deposited film status. Chemical imidization procedure was studied to avoid several problems in thermal imidization. The pattern of submicron dimension has successfully formed on LB film of 8nm thick, which found showing good contrast.

• Journal of the Korean institute of surface engineering
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• v.38 no.2
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• pp.49-54
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• 2005

Flexible copper clad laminates (FCCL) fabricated by sputtering has advantages in fine pitch etching and dimensional accuracy than previous casting or laminating type FCCL, But its lower adhesion is inevitable technical challenge to solve for commercializing it. Chromium (Cr) which strongly reacts with O moiety was used as tie-coating layer in order to improve low adhesion between copper (Cu) and polyimide (PI). Sputtering raw polyimide (SRPI) and casting raw polyimide (CRPI) were used as substrates at this research. PI was pretreated by plasma before sputtering, and each sample was varied with RF power and Cr thickness on sputtering. Peel strength of the FCCL on SRPI was higher than that on CRPI. Adhesion had maximum value when 10 nm of Cr was deposited on SRPI by RF power of 50 W. It seems to be by the formation of Cu-Cr-O solid solution at the metal-PI interface.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.16 no.2
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• pp.1364-1369
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• 2015

As the wire bonding process has been converted into BUMP process due to the high density integration of semiconductor chip, the telecommunication line connecting to semiconductor chip and external devices have become finer. As a result, a more precise work is necessary. However, it is difficult to control quantity given the nature of high viscosity of PSPI and the yield rate continues to decline due to the inflow of bubble. Therefore, this paper developed the D&P(degassing and pumping) system to remove and supply gas that is generated from coating the high viscosity photosensitive polyimide(PSPI) in the semiconductor BUMP process.

• Journal of the Semiconductor & Display Technology
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• v.1 no.1
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• pp.9-13
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• 2002

A polyimide-type electrostatic chuck (ESC) was fabricated for the application of holding 8-inch silicon wafers in the oxide etching equipment. For the fabrication of the unipolar ESC, core technologies such as coating of polyimide films and anodizing treatment of aluminum surface were developed. The polyimide films were prepared on top of thin coated copper substrates for the good electrical contacts, and the helium gas cooling technique was used for the temperature uniformity of the silicon wafers. The ESC was essentially working with an unipolar operation, which was easier to fabricate and operate compared to a bipolar operation. The chucking force of the ESC has been measured to be about 580 gf when the applied voltage was 1.5 kV, which was considered to be enough force to hold wafers during the dry etching processing. The employment of the ESC in etcher system could make 8% enhancement of the wafer processing yield.

• Applied Microscopy
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• v.25 no.1
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• pp.130-138
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• 1995

TEM specimen preparation methods have been examined to characterize Cu oxide particles in the polyimide film. Polyimide films were prepared by coating polyamic acid onto Cu films which had been deposited on TEM-mask and glass substrates and Cu foil, followed by thermal curing. In case of TEM-mask, direct observation was possible without further preparation. In other cases, TEM specimen were made by separating polyimide film from the substrate. Polyimide films were removed from glass and Cu foil by dissolving glass in HF solution and Cu foil in $H_{2}SO_{4}$ solution. TEM-mask observation confirms that fine $Cu_{2}O$ particles precipitate in the polyimide as a result of reaction of polyamic acid with Cu. However $Cu_{2}O$ particle reacts with HF and $H_{2}SO_{4}$ solution during dissolving the substrate and interpretation could be misled. It is concluded characterization of $Cu_{2}O$ particle in polyimide using TEM-mask is better than other methods.

• Journal of the Korean Electrochemical Society
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• v.14 no.2
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• pp.117-124
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• 2011

We demonstrate a new surface modification of high-voltage lithium cobalt oxide ($LiCoO_2$) cathode active materials for lithium-ion batteries. This approach is based on exploitation of a polarity-tuned gel polymer electrolyte (GPE) coating. Herein, two contrast polymers having different polarity are chosen: polyimide (PI) synthesized from thermally curing 4-component (pyromellitic dianhydride/biphenyl dianhydride/phenylenediamine/oxydianiline) polyamic acid (as a polar GPE) and ethylene-vinyl acetate copolymer (EVA) containing 12 wt% vinyl acetate repeating unit (as a less polar GPE). The strong affinity of polyamic acid for $LiCoO_2$ allows the resulting PI coating layer to present a highly-continuous surface film of nanometer thickness. On the other hand, the less polar EVA coating layer is poorly deposited onto the $LiCoO_2$, resulting in a locally agglomerated morphology with relatively high thickness. Based on the characterization of GPE coating layers, their structural difference on the electrochemical performance and thermal stability of high-voltage (herein, 4.4 V) $LiCoO_2$ is thoroughly investigated. In comparison to the EVA coating layer, the PI coating layer is effective in preventing the direct exposure of $LiCoO_2$ to liquid electrolyte, which thus plays a viable role in improving the high-voltage cell performance and mitigating the interfacial exothermic reaction between the charged $LiCoO_2$ and liquid electrolytes.