• 반도체디스플레이기술학회지
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• 제10권4호
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• pp.47-51
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• 2011

We investigated the substrate surface polishing by the spherical rigid abrasive under the compression using classical molecular dynamics modeling. We performed three-dimensional molecular dynamic simulations using the Morse potential functions for the various slide-to-roll ratios, from 0 to 1, and then, the compressive forces acting on the spherical rigid abrasive were calculated as functions of the time and the slide-to-roll ratio. The friction coefficients obtained from the classical molecular dynamics simulations were compared to those obtained from the experiments; and found that the molecular dynamic simulation results with the slide-to-roll ratio of 0 value were in good agreement with the experimental results.

• E2M - 전기 전자와 첨단 소재
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• 제10권7호
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• pp.682-691
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• 1997

We have investigated the guided optical properties of a Ti:LiNbO$_3$optical waveguide which was fabricated by Ti-diffusion in an air atmosphere and proposed an effective polishing method of waveguide endfaces. And the results of guided optical mode and fabrication condition were obtained as follows; \circled1 propagation loss : 0.53 dB/cm \circled2 mode size : horizontal/vertical=12.5${\mu}{\textrm}{m}$ \circled3 mode mismatch : 1.7 dB \circled4 diffusion temperature : 105$0^{\circ}C$, time : 8 hours \circled5 atmosphere : air

• 대한전기학회:학술대회논문집
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• 대한전기학회 2002년도 추계학술대회 논문집 전기물성,응용부문
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• pp.122-123
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• 2002

Cu CMP process control for global planarization of semiconductor surface were studied on a platen polisher by using an experimental copper slurry containing ceria as the abrasive component. In order to understand the process. a design of experiment was conducted. From the experiment. the effects of polishing parameters such as polishing pressure, platen speed, and speed of wafer carrier on the removal rate of copper and the uniformity in copper removal were calculated and discussed. In this study, process parameters of Cu CMP and WIWNU(Within Wafer Non Uniformity) were presented.

• 반도체디스플레이기술학회지
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• 제21권4호
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• pp.71-76
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• 2022

We evaluated and developed a 6th generation large-size polisher in the type of face-up and Oscar. We removed the hillocks of the low temperature poly-silicon (LTPS) thin film with this polisher. The surface roughness of LTPS was lowered from 7.9 nm to 0.6 nm after CMP(chemical mechanical polishing). The thickness of the LTPS is measured through reflectance in real time during polishing, and the polishing process is completed according to this thickness. The within glass non-uniformity (WIGNU) was 6.2% and the glass-to-glass non-uniformity (GTGNU) was 2.5%, targeting the LTPS thickness of 400Å. In addition, the residual slurry after the CMP process was removed through the Core Flow PVA Brush and alkaline chemical.

• 한국재료학회:학술대회논문집
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• 한국재료학회 2011년도 추계학술발표대회
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• pp.24.2-24.2
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• 2011

Ru is used as a bottom electrode capacitor in dynamic random access memories (DRAMs) and ferroelectric random access memories (FRAMs). The surface of the Ru needs to be planarized which is usually done by chemical mechanical polishing (CMP). Ru CMP process requires chemical slurry consisting of abrasive particles and oxidizer. A slurry containing NaIO4 and alumina particles is already proposed for Ru CMP process. However, the stability of the slurry is critical in the CMP process since if the particles in the slurry get agglomerated it would leave scratches on the surface being planarized. Thus, in the present work, the stability behavior of the slurry using a suitable anionic polyelectrolyte is investigated. The parameters such as slurry pH, polyelectrolyte concentration, adsorption time and the sequence of addition of chemicals are optimized. The results show that the slurry is stable for longer time at an optimized condition. The polishing behavior of the Ru using the optimized slurry is also investigated.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2006년도 춘계학술대회 논문집
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• pp.481-482
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• 2006

Chemical-mechanical polishing, the dominant technology for LSI planarization, is trending to play an important function in micro-electro mechanical systems (MEMS). However, MEMS CMP process has a couple of different characteristics in comparison to LSI device CMP since the feature size of MEMS is bigger than that of LSI devices. Preliminary CMP tests are performed to understand material removal rate (MRR) with blanket wafer under a couple of polishing pressure and velocity. Based on the blanket CMP data, this paper focuses on the consumable approach to enhance MEMS CMP by the adjustment of slurry and pad. As a mechanical tool, newly developed microstructured (MS) pad is applied to compare with conventional pad (IC 1400-k Nitta-Haas), which is fabricated by micro melding method of polyurethane. To understand the CMP characteristics in real time, in-situ friction force monitoring system was used. Finally, the topography change of poly-si MEMS structures is compared according to the pattern density, size and shape as polishing time goes on.

• 한국정보통신학회논문지
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• 제18권6호
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• pp.1401-1406
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• 2014

반도체소자의 제조 공정 기술 중 구리패턴을 얻기 위해서 사용하는 화학 기계적 연마(CMP)를 이용한 평탄화와 연마 공정에서 Wafer에 도포된 구리의 두께를 실시간으로 측정하여 정밀하게 제어할필요가 있는데, 이때 획득되는 센서값을 실제 두께 값으로 환산하는 계산과정에서 오차가 발생할 수 있다. 실제 측정 값에 근사한 값을 얻도록 단순평균을 이용한 방법, 이동 평균, 필터 들을 사용하여 결과를 비교하여 옹고스트롬 단위의 두께를 실시간으로 측정하는 제어 시스템의 편차를 줄이도록 하는 방법의 구현에 대해 기술한다.

• 한국안광학회지
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• 제18권1호
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• pp.27-35
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• 2013

목적: 본 연구에서는 RGP렌즈의 제조과정 중 연마에 의하여 유발되는 렌즈의 물성 변화를 조사하고 이에 따른 실제 착용감과 착용자의 눈물막 파괴시간은 어떻게 달라지는지 알아보고자 하였다. 방법: RGP렌즈(fluorosilicone acrylate재질) 제조 시 연마시간을 각각 0초, 25초, 50초 및 100초로 달리하여 제조한 4개의 렌즈두께, 렌즈 표면 및 렌즈 접촉각을 비교하였다. 또한 이들 렌즈를 눈물량이 정상인 피검안에 착용시키고 피검자들이 느끼는 착용감을 설문조사하였으며, 피검자들의 비침습성 눈물막 파괴시간을 측정하였다. 결과: 연마시간을 달리한 4개의 RGP렌즈 두께는 유의한 차이는 없었으나 연마 후에는 렌즈 표면이 매끄러워짐을 주사전자현미경으로 확인하였다. RGP렌즈의 접촉각은 연마시간의 증가에 따라 유의하게 감소하여 연마시간이 0초인 렌즈와 100초인 렌즈 간의 접촉각 차이는 약 $16^{\circ}$ 정도이었으며 이는 통계적으로도 유의한 차이이었다. RGP렌즈의 실제 착용감은 렌즈의 습윤성이 증대할수록 좋아지는 경향을 보였으나 비례적으로 좋아지는 것은 아니었다. 연마조건에 따른 착용자의 눈물막 파괴시간변화는 습윤성이나 착용감의 변화와는 다른 양상을 보였다. 결론: 본 연구에서는 RGP렌즈 제조 시 물리적인 자극에 의한 습윤성의 증대나 렌즈두께의 얇아짐, 렌즈조도의 향상이 실제 착용 시 타각적 및 자각적 만족도의 증가와 일치하지 않는 것으로 나타났다. 따라서 RGP렌즈 제조 시 렌즈의 물성뿐만 아니라 착용자의 생리적인 요인 또한 고려되어야 할 것을 제안할 수 있다.

• 한국정밀공학회지
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• 제30권3호
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• pp.324-330
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• 2013

This paper describes a novel method to surface large optics mirror with an extremely high hardness, which could replace the high cost of the repetitive off-line measurement steps and the large ultra-precision grinding machine with ultra-positioning control of 10 nm resolution. A lot of diamond pellet to be attached on the convex aluminum base consists of a grinding tool for the concave large mirror, and the tool was pressured down on the large mirror blank. The tool motion at an interval on the spiral path was controlled with each feed rate as the dwell time in the conventional computer-controlled polishing. The shape to be surfaced was measured directly by a touch probe on the machine without any separation of the mirror blank. Total 40 iterative steps of the surfacing and measurement could demonstrate the form error of RMS $7.8{\mu}m$, surface roughness of Ra $0.2{\mu}m$ for the mirror blank with diameter of 1 m and spherical radius of curvature of 5400 mm.

• 대한치과보철학회지
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• 제41권1호
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• pp.1-19
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• 2003

The surface of metals should be as smooth as possible for optimum comfort, oral hygiene, low plaque retention, and resistance to corrosion. In this study five specimens of each precious metal(type III gold alloy, ceramic gold alloy, and Ag-Pd alloy) were divided into five groups according to finishing and polishing procedures : group 1(sandblaster), group 2(group 1+stone), group 3(group 2+brown rubber), group 4(group 3+green rubber), and group 5(group 4+rouge). Six specimens of each non-precious metal(Co-Cr alloy, Ni-Cr alloy, and Co-Cr-Ti alloy) were divided into six groups: group 1(sandblaster), group 2(group 1+hard stone), group 3(group 2+electrolytic polisher), group 4(group 3+brown hard rubber point), group 5(group 4+green hard rubber point), and group 6(group 5+rouge). Considering factors affecting the rate of abrasion, the same dentist applied each finishing and polishing procedure. In addition, the surface roughness of enamel, resin, and porcelain was evaluated. The effect of finishing and polishing procedures on surface roughness of precious and non-precious metals, enamel, resin, and porcelain was evaluated by means of Atomic Force Microscope(AutoProbe CP. Park Scientific Instruments, U.S.A.) that can image the three dimensional surface profile and measure average surface roughness values of each sample at the same time. The obtained results were as follows : 1. According to finishing and polishing procedures, the surface roughness of type III gold alloy, ceramic gold alloy, and Ag-Pd alloy was decreased in the order of group 1, 2, 3, 4, and 5 (P<0.01). 2. According to finishing and polishing procedures. the surface roughness of Co-Cr alloy, Ni-Cr alloy, and Co-Cr-Ti alloy was decreased in the order of group 1, 2, 3, 4, 5, and 6 (p<0.01). 3. There was not statistically significant difference in the surface roughness among three metals of precious metals in group 1 but was significant difference in group 2, 3, 4, and 5 (P<0.05). 4. There was not statistically significant difference in the surface roughness among three metals of non-precious metals in all groups. 5. When the surface roughness of the smoothest surface of each metal, enamel. porcelain, and resin was compared, porcelain was the smoothest and the surface roughness was decreased in the order of Ni-Cr alloy. Co-Cr alloy. Co-Cr-Ti alloy, resin. Ag-Pd alloy, ceramic gold alloy type III gold alloy, and enamel (P<0.01). The results of this study indicate that the finishing and polishing procedures should be carried out in a logical, systematic sequence of steps and the harder non-precious metals may be less resistance to abrasion than are the softer precious metals.