• 대한안전경영과학회:학술대회논문집
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• 대한안전경영과학회 2004년도 추계학술대회
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• pp.189-195
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• 2004

It compared quality characteristics for the stone surface treatment system and its products. With the result, the flame burner equipment was mainly used to the surface treatment of granite, but it occurred greatly the high temperature, the rock fragment, the noise and dust. For the other side, the whetstone polishing machine for the polishing was a maintenance for the specific physical properties of stone, and it did not occur the stone fragment and the dust. The durability of the stone products due to the flame burner was investigated with that it falls to $20\sim25\%$ more than the surface treatment by the whetstone polishing. Share's hardness of the polishing products in the durability test showed more greatly index than the flame burner and conventional product. The polishing products of Pochon stone in the case of the abrasion resistance showed great more $15\%$ than the general products, more $9\%$ than the products by the flame burner.

• 동굴
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• 제78호
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• pp.23-27
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• 2007

In this paper, we have investigated the characteristics of the magnetic abrasive using sludge on polishing of internal finishing of seamless stainless steel tube applying magnetic abrasive polishing. Either white alumina grain was used to resin sludge at a low temperature, and the sludge of magnetic abrasive powder was synthesized and crushed into 200 meshes. Surface roughness was measured before and after polishing, and more than 40% of improvement of surface roughness was achieved when grain was used under a specific condition. Even though some degree of surface roughness due to deeper scratches still exist, but the result showed a prospective magnetic abrasive polishing using sludge with white alumina grains.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2005년도 하계학술대회 논문집 Vol.6
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• pp.193-194
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• 2005

By the high-temperature pad conditioning process: The slurry residues in pores and grooves of the polishing pad were clearly removed. These clear pores and enlarged grooves made the slurry attack the oxide surface. The changed slurry properties by high-temperature pad conditioning process made the oxide surface hydro-carbonate to be removed easily.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2004년도 하계학술대회 논문집 Vol.5 No.2
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• pp.1283-1287
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• 2004

The design rules are being more strict with requirement of operation speed and development of IC industry. For this reason, required minimum line-width has been narrowed under sub-micron region. As the length of minimum line-width is narrowed, local and global planarization are being prominent. CMP(Chemical-Mechanical Polishing), one of the planarizarion technology, is a process which polishes with the ascent of chemical reaction and relative velocity between pad and wafer without surface defects. CMP is performed with a complex interaction among many factors, how CMP has an interaction with such factors is not evident. Accordingly, the studies on this are still carrying out. Therefore, an examination of the CMP phenomena and an accurate understanding of compositive factors are urgently needed. In this paper, we will consider of the relations between the effects of temperature which influences many factors having an effect on polishing results and the characteristics of CMP in order to understand and estimate the influence of temperature. Then, through the interaction of shown temperature and polishing result, we could expect to boost fundamental understanding on complex CMP phenomena.

• 한국전기전자재료학회논문지
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• 제18권3호
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• pp.219-225
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• 2005

To investigate the effects of slurry temperature on the chemical mechanical polishing(CMP) performance of oxide film with silica and ceria slurries, we have studied slurry properties as a function of different slurry temperature. Also, the effects of each input parameter of slurry on the oxide CMP characteristics were investigated. The pH showed a slight tendency of decrease, the conductivity in slurries showed an increased tendency, the mean particle size in slurry decreased, and the zeta potential of slurry decreased with temperature. The removal rates significantly increased and maintained at the specific levels over 4$0^{\circ}C$. The better surface morphology of oxide films could be obtained at 40 $^{\circ}C$ of silica slurry and at 90 $^{\circ}C$ of ceria slurry. It is found that the CMP performance of oxide film could be significantly improved or controlled by change of slurry temperature.

• Transactions on Electrical and Electronic Materials
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• 제6권3호
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• pp.128-132
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• 2005

In this paper, we have investigated the characteristics of the magnetic abrasive using sludge on polishing of internal finishing of seamless stainless steel (STS304) tube applying magnetic abrasive polishing. Either white alumina (WA) or green carborundum (GC) grain was used to resin sludge at a low temperature, and the sludge of magnetic abrasive powder was synthesized and crushed into 200 meshes. Surface roughness was measured before and after polishing, and more than $40\%$ of improvement of surface roughness was achieved when WA grain was used under a specific condition. Even though some degree of surface roughness due to deeper scratches still exist, but the result showed a prospective magnetic abrasive polishing using sludge with WA or GC grains.

• 한국자동차공학회논문집
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• 제12권6호
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• pp.151-157
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• 2004

In this paper deals with behavior of the magnetic abrasive using sludge on polishing characteristics in a new internal finishing of seamless stainless steel tube applying magnetic abrasive polishing. The magnetic abrasive using sludge-abrasive grain WA and GC used to resin bond fabricated low temperature. And sludge of magnetic abrasive powder fabricated that sludge was crused into 200 mesh. The previous research have made an experiment in the static state the movement of magnetic abrasive grain is nevertheless in the dynamic state. In this paper, We could have investigated into the changes of the movement of magnetic abrasive grain. In reference to this result, we could have made the experiment which is set under the condition of the magnetic flux density, polishing velocity according to the form of magnetic brush.

• Transactions on Electrical and Electronic Materials
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• 제8권2호
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• pp.79-83
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• 2007

The implications of a theory of lubricated pad asperity wafer contact are traced through several fundamental areas of chemical-mechanical polishing. The hypothesized existence of a nanolubrication layer underlies a high accuracy model of polish rates. It also provides a quantitative explanation of a power law relationship between the coefficient of friction and a measure of pad surface flattening. The theory may further be useful for interpreting friction changes during polishing, and may explain why the coefficient of friction is sometimes observed to have a temperature or velocity dependence.

• 한국전기전자재료학회논문지
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• 제21권2호
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• pp.93-98
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• 2008

We investigated the effect of process temperature on removal rate and non-uniformity based on single head kinematics in oxide CMP. Generally, it has been known that the temperature profile directly transfers to the non~uniformity of removal rate on the wafer, which has similar tendency with the sliding distance of wafer. Experimental results show that platen velocity is a dominant factor in removal rate as well as average temperature. However, the non-uniformity does not coincide between process temperature and removal rate, due to slurry accumulation and low deviation of temperature. Resultantly, the removal rate is strongly dependent on the rotational speed of platen, and its non -uniformity is controlled by the rotational speed of polishing head. It means lower WIWNU (With-in-wafer-non-uniformity) can be achieved in the region of higher head speed.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2012년도 추계학술대회 논문집
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• pp.153-154
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• 2012