• 제어로봇시스템학회:학술대회논문집
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• 제어로봇시스템학회 1993년도 한국자동제어학술회의논문집(국제학술편); Seoul National University, Seoul; 20-22 Oct. 1993
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• pp.541-544
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• 1993

This paper attempts to propose new procedures to evaluate roughness of ground metallic surface in the range of 1-10.mu.m from data gained by an optical, in-process measurement of the surfaces. Studies are made to process the data of reflected lights pointed at the surface to be measured. Results obtained are compared with those of measurement by stylus roughness meter. Correlations between the two types of roughness measurement are well. The proposed method can be used as a sensor for a polishing robot.

• 대한소아치과학회지
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• 제43권3호
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• pp.275-283
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• 2016

본 연구는 복합레진의 연마방법에 따른 표면특성을 평가하기 위해, microhybrid 레진(Filtek$^{TM}$ Z250)과 nanofill 레진(Filtek$^{TM}$ Z350)을 연마 전, abrasive disk(Sof-lex) 연마 후, polishing brush(Occlubrush) 연마 후로 나누어 분석하였다. 그 결과 레진 표면조도는 연마 후 증가하였는데, 미세조도는 연마방법에 따른 차이가 없었으나 거시조도는 Occlubrush를 이용한 경우 현저하게 커졌다(p < 0.05). Sof-lex 연마의 경우 레진의 filler까지 연마되어 표면이 보다 균일한 형상을 보였으나 Occlubrush 연마시편은 기질층이 뜯겨져 나간 불균일한 형상을 보였다. 두 연마방법 간의 미세경도 유의차는 없었으며(p > 0.05), 연마 후 경도 값이 약 25% 상승하였다. 결론적으로, 복합레진의 표면경도 향상을 위하여 적합한 연마가 필요하며, Sof-lex를 이용한 연마가 더 우수한 것으로 사료된다.

• Journal of Mechanical Science and Technology
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• 제15권5호
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• pp.580-591
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• 2001

This paper proposes a fuzzy-sliding mode control which is designed by a self tuning fuzzy inference method based on a genetic algorithm. Using the method, the number of inference rules and the shape of the membership functions of the proposed fuzzy-sliding mode control are optimized without the aid of an expert in robotics. The fuzzy outputs of the consequent part are updated by the gradient descent method. It is further guaranteed that the selected solution becomes the global optimal solution by optimizing Akaikes information criterion expressing the quality of the inference rules. In order to evaluate the learning performance of the proposed fuzzy-sliding mode control based on a genetic algorithm, a trajectory tracking simulation of the polishing robot is carried out. Simulation results show that the optimal fuzzy inference rules are automatically selected by the genetic algorithm and the trajectory control result is similar to the result of the fuzzy-sliding mode control which is selected through trial error by an expert. Therefore, a designer who does not have expert knowledge of robot systems can design the fuzzy-sliding mode controller using the proposed self tuning fuzzy inference method based on the genetic algorithm.

• 제어로봇시스템학회논문지
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• 제14권5호
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• pp.420-425
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• 2008

PMMA light guiding plate with nano-sized pattern was fabricated using anodized aluminum oxide membrane as a template for nano imprint lithography. Nano-sized pore arrays were prepared by the self-organization processes of the anodic oxidation using the aluminum plate with 99.999% purity. Since the aluminum plate has a rough surface, the aluminum plate with thickness of 1mm was anodized after the pre-treatments of chemical polishing, and electrochemical polishing. The surface morphology of the alumina obtained by the first anodization process was controlled by the concentration of electrochemical solution during the first anodization. The surface morphology of the alumina was also changed according to temperature of the solution during chemical polishing performed after first anodization. The pore widening process was employed for obtaining the one-channel with flat surface and height of the channel because the pores of the alumina membrane prepared by the fixed voltage method shows the structure of two-channel with rough surface. It is shown from SPM results that the nano-sized pattern on PMMA light guiding plate fabricated by nano imprint lithography method was well transferred from that of anodized aluminum oxide template.

• Tribology and Lubricants
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• 제33권6호
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• pp.282-287
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• 2017

SU-8 is an epoxy-type photoresist widely used for the fabrication of high-aspect-ratio (HAR) micro-structures in micro-electro-mechanical systems (MEMS). To fabricate highly integrated structures, chemical mechanical polishing (CMP) has emerged as the preferred manufacturing process for planarizing the MEMS structure. In SU-8 CMP, an oxidizer decomposes organic impurities and particles in the CMP slurry remove the chemically reacted surface of SU-8. To fabricate HAR microstructures using the CMP process, the adhesion between SU-8 and substrate material is important to avoid the delamination of the SU-8 film caused by the mechanical-dominant material removal characteristic. In this study, the friction force during the CMP process is measured with a CMP monitoring system to detect the delamination phenomenon and investigate the delamination of the SU-8 film from the silicon substrate under various pressure conditions. The increase in applied pressure causes an increase in the frictional force and wafer-edge stress concentration. The frictional force measurement shows that the friction force changes according to the delamination phenomenon of the SU-8 film, and that it is possible to monitor the delamination phenomenon during the SU-8 CMP process. The delamination at a high applied pressure is explained by the effect of stress distribution and pad deformation. Consequently, it is necessary to control the pressure of polishing, which can avoid the delamination in SU-8 CMP.

• 대한임베디드공학회논문지
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• 제12권4호
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• pp.213-221
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• 2017

Utilizing the existing polishing robot prevents unrestricted change of direction, driving, and identification of driving pathway. To overcome this barrier, driving mechaism has been designed with Omniwheels with encoders and RSSI method of beacon system has been utilized to identify the driving path by position recognition. Due to the wheel characteristics, the Omniwheel mobile robot generates greater slip than the conventional mobile robot, which reduces its driving accuracy. Therefore, to improve the driving accuracy, the localization is conducted through the fusion of encoder and RSSI of beacon data to compensate for the errors caused by Dead Reckoning and inaccuracy of sensors. Finally, the localization accuracies of the proposed and conventional indoor localization method are compared to show effectiveness of the proposed driving control for a polishing robot.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2006년도 춘계학술대회 논문집
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• pp.481-482
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• 2006

Chemical-mechanical polishing, the dominant technology for LSI planarization, is trending to play an important function in micro-electro mechanical systems (MEMS). However, MEMS CMP process has a couple of different characteristics in comparison to LSI device CMP since the feature size of MEMS is bigger than that of LSI devices. Preliminary CMP tests are performed to understand material removal rate (MRR) with blanket wafer under a couple of polishing pressure and velocity. Based on the blanket CMP data, this paper focuses on the consumable approach to enhance MEMS CMP by the adjustment of slurry and pad. As a mechanical tool, newly developed microstructured (MS) pad is applied to compare with conventional pad (IC 1400-k Nitta-Haas), which is fabricated by micro melding method of polyurethane. To understand the CMP characteristics in real time, in-situ friction force monitoring system was used. Finally, the topography change of poly-si MEMS structures is compared according to the pattern density, size and shape as polishing time goes on.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2007년도 하계학술대회 논문집 Vol.8
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• pp.79-80
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• 2007

Copper has been used as an interconnect material in the fabrication of semiconductor devices, because of its higher electrical conductivity and superior electro-migration resistance. Chemical mechanical polishing (CMP) technique is required to planarize the overburden Cu film in an interconnect process. Various problems such as dishing, erosion, and delamination are caused by the high pressure and chemical effects in the Cu CMP process. But these problems have to be solved for the fabrication of the next generation semiconductor devices. Therefore, new process which is electro-chemical mechanical planarization/polishing (ECMP) or electro-chemical mechanical planarization was introduced to solve the. technical difficulties and problems in CMP process. In the ECMP process, Cu ions are dissolved electrochemically by the applying an anodic potential energy on the Cu surface in an electrolyte. And then, Cu complex layer are mechanically removed by the mechanical effects between pad and abrasive. This paper focuses on the manufacturing of ECMP system and its process. ECMP equipment which has better performance and stability was manufactured for the planarization process.

• 제어로봇시스템학회:학술대회논문집
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• 제어로봇시스템학회 1999년도 제14차 학술회의논문집
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• pp.173-176
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• 1999

This paper shows a self tuning fuzzy inference method by the genetic algorithm in the fuzzy-sliding mode control for a Polishing robot. Using this method, the number of inference rules and the shape of membership functions are determined by the genetic algorithm. The fuzzy outputs of the consequent part are derived by the gradient descent method. Also, it is guaranteed that .the selected solution become the global optimal solution by optimizing the Akaike's information criterion expressing the quality of the inference rules. It is shown by simulations that the method of fuzzy inference by the genetic algorithm provides better learning capability than the trial and error method.

• 한국CDE학회논문집
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• 제20권3호
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• pp.312-319
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• 2015

The grinding and furbishing process as the finishing process for molds include the works such as the grinding, buffing, lapping and polishing among others. A finishing tool unit is applied to this finishing process for the burr, lapping, polishing and others of molds. A finishing tool unit can carry out the flexible machining, depending on the machining allowance for objects to be cut on the basis of the instrumental driving mechanism which enables the up, down, left and right floating, which is applied in link with the dedicated cutters and robot machining systems. This study selected the shape to increase the rotatory force of an impeller when air is discharged during the driving of a finishing tool unit, and reflected it to the impeller designing. In addition, the study analyzed each flow velocity and pressure distribution per air pressurization value and finally analyzed the rotating torque to suggest the optimal conditions in designing impellers.