• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.21 no.5
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• pp.714-719
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• 2012

In this paper, the polishing force monitoring and the control method were implemented for the polishing machine with the airbag tool. Airbag tool has been known to be adaptable to the curvature variation such as the aspherical and the free-form surface. However, it was necessary to control the tool movement of vertical axis also because of the table rotational wobble and vibration. To solve it by the polishing force control, we installed another stepping motor to the z-axis. And the polishing force was measured with the load cell and controlled by the PID Labview controller. A few hundreds gram of the polishing force were well controlled under 0.8 second of the response time and 5% variation. An experiment was done to clean the edge burrs of the micro channel structure of width $87{\mu}m$ using the polishing force control.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.19 no.3
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• pp.313-320
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• 2010

The magnetic abrasive polishing (MAP) process is used to achieve the nano-meter grade polishing results on flat or complicated surface. In previous study, polishing the stainless steel plate which is a non-magneto-material was tried. To polish non-magneto-materials using the MAP process was very difficult because the process was fundamentally possible by the help of a magnetic force. Therefore, it had lower efficiency than magneto-materials such as SM45C. In this study, optimization for tool geometry of the MAP was performed to improve the magnetic force between tool and workpiece. Moreover, a permanent magnet was installed below the non-magneto-material to improve the magnetic force. And then the design of experiments was carried out to evaluate the effect of the MAP parameters on the polishing results.

• Journal of the Korean Society for Precision Engineering
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• v.22 no.4
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• pp.44-51
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• 2005

In this paper, a new polishing head with the variable pressure structure was studied to improve the planarization uniformity of the conventional template-metal head. Metal surface waviness and slurry distribution on the pad have been known to affect the polishing uniformity even in the synchronized quill and platen velocities. A polishing head with silicon rubber sheet was used to get a curved pressure distribution. In the experiment, the vertical deflection behavior on the pad was characterized with back pressure in the air chamber. Quill force increased linearly with backpressure. However, backpressure under a quill force made the upward movements of the quill. In the wafer polishing experiments, polishing rate and polishing thickness distribution were severely changed with backpressure. The best uniformity was observed with the standard deviation off.5％ level of average polishing removal 215nm at backpressure 12.1kPa.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.29 no.7 s.238
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• pp.983-989
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• 2005

The effects of mechanical parameters on the characteristics of chemical mechanical polishing(CMP) can be directly evaluated by friction force. The piezoelectric quartz sensor for friction force measurement was installed, and friction force could be detected during CMP process. Furthermore, friction energy can be calculated by multiplying relative velocity by integration of the friction force throughout the polishing time. $SiO_2$ slurry for interlayer dielectric(ILD) CMP was used in this experiment to consider the relation of frictional characteristics and polishing results. From this experiment, it is proven that the friction energy is an essential factor of removal rate. Also, the friction force is related to removal amount per unit length(dH/ds) and friction energy has corelation to the removal rate(dH/dt) and process temporature. Moreover, within wafer non-unifornity(WIWNU) is related to coefficient of friction because of the mechanical moment equilibrium. Therefore, the prediction of polishing result would be possible by measuring friction force.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.15 no.1
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• pp.32-38
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• 2006

The magnetic fluid polishing technique can polish the tool of complex shape, because the polishing method which polishes as compress the workpiece by the magnetism abrasives to arrange to the linear according to the line of magnetic force. Therefore, we producted the magnetic fluid polishing device in order that mirror like finishing processes the tool surface. In order to a polishing condition selection, polishing characteristic was estimated by polishing conditions which are magnetic flux density, polishing speed, grain size, magnetic fluid. The tool was polished to the selected polishing condition. The result to evaluate the polished tool's performance with the cutting force and tool wear, the polished tool's performance was improved compared with the tool not to polish.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.24 no.11
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• pp.2786-2795
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• 2000

Recently, the technology for internal polishing is needed for ultra-clean machining for the prevention of corrosion and pollution of parts is the area of high technology industries such as semiconductor, electronics, telecommunication optics, aerospace, and motors. In this study, an internal polishing system using the magnetic force was developed for the production of ultra-clean tubes with averaged surface roughness ranging from 0.2㎛ to 0.05㎛ or less, and magnetic abrasives composed of WC/Co powder were developed, After finding the optimal condition on each, machining characteristics using newly developed abrasive were analyzed. Form the results obtained by experimental design method, the optimal polishing condition was analyzed and, thhereafter internal polishing was done.

• Journal of the Korean Society for Precision Engineering
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• v.20 no.3
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• pp.42-49
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• 2003

In this paper, we provide the results of polishing temperature distribution by way of infrared ray measurement system as well as polishing resistance, which can be interpreted as tribological aspects of CMP, using force measurement system. The results include the trend of polishing temperature, its distribution profile and temperature change during polishing. The results indicate that temperature affects greatly to the removal rate. Polishing temperature increases gradually and reaches steady state temperature and the period of temperature change occurs first tens of seconds. Furthermore, the friction force also varies as the same pattern with polishing temperature from high friction to low. These results suggest that the first period of the whole polishing time greatly affects the nonuniformity of removal rate.

• Journal of Institute of Control, Robotics and Systems
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• v.6 no.9
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• pp.786-795
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• 2000

In this paper, a new impedance force control method for deburring and polishing process is proposed. The proposed method is robust to deal with unknown environment stiffness as unknown well as environment location. An adaptive technique is used to minimize the force error occurred due to unknown environment surface profile. A robust position control algorithm based on time-delayed information is used to cancel out uncertainties in robot dynamics. A three link robot manipulator is used to demonstrate performances of the proposed control on deburring and polishing tasks. Stability analysis for the adaptive control is presented and its results are confirmed by simulations.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.20 no.10
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• pp.839-845
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• 2007

In this paper, a polishing pad has been analyzed in detail, to understand surface phenomena of polishing process. The polishing pad plays a key role in polishing process and is one of the important layer in polishing process, because it is a reaction layer of polishing[1]. Pad surface physical property is also ruled by pad profile. The profile and roughness of pad is controlled by different types of conditioning tool. Conditioning tool add mechanical force to pad, and make some roughness and profile. Formed pad surface will affect on polishing performance such as RR (Removal Rate) and uniformity in CMP Pad surface condition is changed by conditioning tool and dummy run and is stable at final. And this research, we want to reduce break-in and dummy polishing process by analysis of pad surface and artificial machining to make stable pad surface. The surface treatment or machining enables to control the surface of polishing pad. Therefore, this research intends to verify the effect of the buffing process on pad surface through analysis of the removal rate, friction force and temperature. In this research, urethane polishing pad which is named IC pad(Nitta-Haas Inc.) and has micro pore structure, is studied because, this type of pad is most conventional type.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2009.06a
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• pp.515-516
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• 2009