• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2003년도 하계학술대회 논문집 Vol.4 No.1
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• pp.382-385
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• 2003

Chemical mechanical polishing(CMP) is an essential process in the production of copper-based chips. On this work, the stability of Hydrogen Peroxide($H_2O_2$) as oxidizer of Cu CMP slurry has been investigated. $H_2O_2$ is known as the most common oxidizer in Cu CMP slurry. Copper slowly dissolves in $H_2O_2$ solutions and the interaction of $H_2O_2$ with copper surface had been studied in the literature. Because hydrogen peroxide is a weak acid in aqueous solutions, a passivation-type slurry chemistry could be achieved only with pH buffered solution.[1] Moreover, $H_2O_2$ is so unstable that its stabilization is needed using as oxidizer. As adding KOH as pH buffering agent, stability of $H_2O_2$ decreased. However, stability went up with putting in small amount of BTA as film forming agent. There was no difference of $H_2O_2$ stability between KOH and TMAH at same pH. On the other hand, $H_2O_2$ dispersion of TMAH is lower than that of KOH. Furthermore, adding $H_2O_2$ in slurry in advance of bead milling lead to better stability than adding after bead milling. Generally, various solutions of phosphoric acids result in a higher stability. Using Alumina C as abrasive was good at stabilizing for $H_2O_2$; moreover, better stability was gotten by adding $H_3PO_4$.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2017년도 춘계학술대회 논문집
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• pp.149-149
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• 2017

Aluminum alloys have poor corrosion resistance compared to the pure aluminum due to the additive elements. Thus, anodizing technology artificially generating thick oxide films are widely applied nowadays in order to improve corrosion resistance. Anodizing is one of the surface modification techniques, which is commercially applicable to a large surface at a low price. However, most studies up to now have focused on its commercialization with hardly any research on the assessment and improvement of the physical characteristics of the anodized films. Therefore, this study aims to select the optimum temperature of sulfuric electrolyte to perform excellent corrosion resistance in the harsh marine environment through electrochemical experiment in the seawater upon generating porous films by variating the temperatures of sulfuric electrolyte. To fabricate uniform porous film of 5083 aluminum alloy, we conducted electro-polishing under the 25 V at $5^{\circ}C$ condition for three minutes using mixed solution of ethanol (95 %) and perchloric (70 %) acid with volume ratio of 4:1. Afterward, the first step surface modification was performed using sulfuric acid as an electrolyte where the electrolyte concentration was maintained at 10 vol.% by using a jacketed beaker. For anode, 5083 aluminum alloy with thickness of 5 mm and size of $2cm{\times}2cm$ was used, while platinum electrode was used for cathode. The distance between the two was maintained at 3 cm. Anodic polarization test was performed at scan rate of 2 mV/s up to +3.0 V vs open circuit potential in natural seawater. Surface morphology was compared using 3D analysis microscope to observe the damage behavior. As a result, the case of surface modification showed a significantly lower corrosion current density than that without modification, indicating excellent corrosion resistance.

• 한국세라믹학회지
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• 제40권1호
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• pp.77-80
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• 2003

수용액 내에서 질화물 박막의 산화저항성 흡착 피막의 형성을 확인하기 위하여 Si$_3$N$_4$분말 표면의 glycine 흡착 거동을 조사하였다. 염기성분위기에서 glycine은 Si$_3$N$_4$ 분말 표면에 포화 흡착되었으며 이러한 흡착거동은 Si$_3$N$_4$ 박막의 경우에도 동일하게 일어날 것으로 예상되었다. Glycine을 첨가한 CeO$_2$ 슬러리를 제조하고 PH에 따른 Si$_3$N$_4$와 SiO$_2$ 박막의 연마시험을 수행하여 연마율은 감소하고 선택비는 증가하는 것을 확인하였다. 실험에서 얻은 최대 선택비는 pH=12에서 35 이상이었다. 이는 염기성 분위기에서 glycine이 해리하여 막 표면에 화학흡착하고 산화와 용해를 억제함으로써 연마율을 낮추고 선택비 향상에 기여하였기 때문으로 판단된다. 아미노산 계열의 첨가제를 CeO$_2$계 CMP용 슬러리에 적용하는 경우 산화물/질화물 박막의 선택비를 향상시키는데 효과적임을 확인하였다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2008년도 하계학술대회 논문집 Vol.9
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• pp.117-117
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• 2008

In MIM capacitor, poly-Si bottom electrode is replaced with metal bottom electrode. Noble metals can be used as bottom electrodes of capacitors because they have high work function and remain conductive in highly oxidizing conditions. In addition, they are chemically very stable. Among novel metals, Ru (ruthenium) has been suggested as an alternative bottom electrode due to its excellent electrical performance, including a low leakage of current and compatibility to high dielectric constant materials. Chemical mechanical planarization (CMP) process has been suggested to planarize and isolate the bottom electrode. Even though there is a great need for development of Ru CMP slurry, few studies have been carried out due to noble properties of Ru against chemicals. In the organic chemistry literature, periodate ion ($IO_4^-$) is a well-known oxidant. It has been reported that sodium periodate ($NaIO_4$) can form $RuO_4$ from hydrated ruthenic oxide ($RuO_2{\cdot}nH_2O$). $NaIO_4$ exist as various species in an aqueous solution as a function of pH. Also, the removal mechanism of Ru depends on solution of pH. In this research, the static etch rate, passivation film thickness and wettability were measured as a function of slurry pH. The electrochemical analysis was investigated as a function of pH. To evaluate the effect of pH on polishing behavior, removal rate was investigated as a function of pH by using patterned and unpatterned wafers.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2005년도 하계학술대회 논문집 Vol.6
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• pp.282-283
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• 2005

Ion beam assisted deposition(IBAD) technique was used to produce biaxially textured polycrystalline MgO thin films for high critical current YBCO coated conductor. Hastelloy tapes were continuous electropolished with very smooth surface for IBAD-MgO deposition, RMS roughness of Hastelloy tape values below 2 nm and local slope of less than $1^{\circ}$. After the polishing of the tape an amorphous $Y_2O_3$ and $Al_2O_3$ are deposited Biaxially textured MgO was deposited on amorphous layer bye-beam evaporation with a simultaneous bombardment of high energy ions. We had developed the RHEED to measure in-situ biaxial texture of film surface as thin as tens angstrom. And also ex-situ characterization of buffer layers was studied using XRD and SEM. The full-width at half maximum(FWHM) out of plane texture of IBAD-MgO template is $4^{\circ}$.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2005년도 하계학술대회 논문집 Vol.6
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• pp.649-650
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• 2005

반도체는 고집적화, 고속도화, 저전력화를 목적으로 발전하고 있다. 이를 위하여 design rule의 감소, 새로운 물질과 프로세스의 적용 등 많은 연구가 이루어지고 있으며, RC delay time을 줄이기 위한 Cu 와 저유전율 재료의 적용이 그 대표적인 예라 할 수 있다. Cu 배선은 기존의 Al 배선에 비하여 높은 전자이동 (electro-migration)과 응력 이동 (stress-migration) 저항을 가짐으로써 전기적인 성능 (electrical performance) 에서 이점을 가지고 있다. 반도체에서의 Cu 배선 구조는 평탄화된 표면 및 배선들 사이에서의 좋은 전기적인 절연성을 가져야 하며, 이는 디싱(dishing)과 에로젼(erosion)의 중요한 인자가 된다. 기존의 평탄화 공정인 Cu CMP(Chemical Mechanical Polishing)에 있어서 이러한 디싱, 에로전과 같은 결함은 선결되어져야 할 문제로 인식되고 있다. 따라서 본 연구에서는 이러한 결합들을 감소시키기 위한 새로운 평탄화 방법으로 Cu gap-filling 을 하는 동시에 평탄화된 표면을 이루는 ECMD(Electro-Chemical Mechanical Deposition) 공정의 전기적 기계적 특성을 파악하였다.

• 한국표면공학회지
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• 제37권5호
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• pp.249-252
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• 2004

Effects of HA and TiN coating on the electrochemical characteristics of Ti-6AI-4V alloys for bone plates were investigated using various test methods. Ti-6AI-4V alloys were fabricated by using a vacuum induction furnace and bone plates were made by laser cutting and polishing. HA was made of extracted tooth sintered and then tooth ash was used as HA coating target. The TiN and HA film coating on the surface were carried on using electron-beam physical vapor deposition (EB-PVD) method. The corrosion behaviors of the samples were examined through potentiodynamic method in 0.9% NaCI solutions at $36.5\pm$$1^{\circ}C$ and corrosion surface was observed using SEM and XPS. The surface roughness of TiN coated bone plates was lower than that of tooth ash coated plates. The structure of TiN coated layer showed the columnar structure and tooth ash coated layer showed equiaxed and anisotrophic structure. The corrosion potential of the TiN coated specimen is comparatively high. The active current density of TiN and tooth ash coated alloy showed the range of about $1.0xl0^{-5}$ $A\textrm{cm}^2$, whereas that of the non-coated alloy was$ 1.0xl0^{-4}$ $A\textrm{cm}^2$. The active current densities of HA and TiN coated bone plates were smaller than that of non-coated bone plates in 0.9% NaCl solution. The pitting potential of TiN and HA coated alloy is more drastically increased than that of the non-coated alloy. The pit number and pit size of TiN and HA coated alloy decreased in compared with those of non-coated alloy. For the coated samples, corrosion resistance increased in the order of TiN coated, tooth ash coated, and non-coated alloy.

• Tribology and Lubricants
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• 제39권1호
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• pp.28-34
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• 2023

Because of their cleanliness, low friction, and high stiffness, aerostatic bearings are used in numerous applications. Aerostic bearings that use porous materials as means of flow restriction have higher stiffness than other types of bearings and have been successfully applied as guide bearings, which have high motion accuracy requirements. However, the performances of porous bearings exhibit strong nonlinearity and can vary considerably depending on design parameters. Therefore, accurate prediction of the performance characteristics of porous bearings is necessary or their successful application. This study presents a porous bearing design and performance analysis for a spindle used in wafer polishing. The Reynolds and Darcy flow equations are solved to calculate the pressures in the lubrication film and porous busing, respectively. To verify the validity of the proposed analytical model, the calculated pressure distribution in the designed bearing is compared with that derived from previous research. Additional parametric studies are performed to determine the optimal design parameters. Analytical results show that optimal design parameters that obtain the maximum stiffness can be derived. In addition, the results show that cross-coupled stiffness increases with rotating speed. Thus, issues related to stability should be investigated at the design stage.

• Tribology and Lubricants
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• 제39권5호
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• pp.190-196
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• 2023

Anti-adhesion coatings are very important in the processing of adhesive materials such as optical clear adhesive (OCA) films. Choosing the appropriate release coating material for dies and tools can be quite challenging. Hydrophobic surface treatment is usually performed, and its performance is often estimated by the static water contact angle (CA). However, the relationship between the release performance and the CA is not well understood. In this study, the water CAs of surfaces coated with anti-adhesion materials and the peel strengths of the acrylic-based adhesive films are evaluated. STC5 and SUS304 are selected as the base materials. Base materials with different surface roughnesses are produced by hairline finishing, mirror-polishing, and end milling. Four fluoropolymer compounds, including a self-assembled monolayer, are selected to make the base surface hydrophobic. Static, advancing, and receding CAs are mostly increased due to the coating, but the CA hysteresis is found to increase or decrease depending on the coating material. The peel strengths all decreased after coating and are largely dependent on the coating material, with significantly lower values observed for fluorosilane and perfluoropolyether silane coatings. The peel strength is observed to correlate better with the static CA and advancing CA than with the receding CA or hysteresis. However, it is not possible to accurately predict the anti-adhesion performance based on water CA alone, as the peel strengths are not fully proportional to the CAs.

• 전기전자학회논문지
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• 제12권3호
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• pp.131-137
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• 2008

실리콘 박막 코팅을 이용한 WDM용 파장가변 실리콘 파브리-페로 열광학 필터를 제안하고 실험하였다. 실리콘 파브리-페로 파장가변 필터는 일반적인 실리콘 웨이퍼를 CMP 공정을 통해 100${\mu}m{\pm}$1%의 두께로 가공하여 양면에 거울면을 갖도록 박막 코팅하고 온도를 변화시키기 위해 PTC 써미스터를 부착하여 제작하였다. 거울면의 형성은 1550nm를 중심 파장을 갖도록 양면에 굴절율이 다른 물질 $SiO_2$($n_{low}$=1.44)와 a-Si($n_{high}$=3.48)을 ${\lambda}$/4의 두께로 증착시켜 2층 박막과 3층 박막의 거울면을 제작하였다. 실험결과, 2층 박막의 경우 FSR이 3.61nm, FWHM이 0.56nm, finesse가 6.4로 나타났고, 3층 박막의 경우 FSR이 3.36nm, FWHM이 0.13nm, finesse가 25.5로 나타났다. 열광학 효과에 의한 파장 이동은 2층 박막 거울을 가진 필터의 경우 온도가 $23^{\circ}C$에서 투과 중심 파장이 1549.73nm $30^{\circ}C$에서 1550.91nm, $60^{\circ}C$에서 1553.46nm로 파장 이동을 하였고, 3층 박막 거울을 가진 필터의 경우는 온도가 $23^{\circ}C$에서 투과 중심 파장이 1549.83nm, $30^{\circ}C$에서 1550.92nm, $60^{\circ}C$에서 1553.07nm로 파장 이동을 하였다.