• Journal of Sensor Science and Technology
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• v.22 no.2
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• pp.130-135
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• 2013

This study proposed a noble process to fabricate TSV (Through Silicon Via) structure which has lower cost, shorter production time, and more simple fabrication process than plating method. In order to produce the via holes, the Si wafer was etched by a DRIE (Deep Reactive Ion Etching) process. The via hole was $100{\mu}m$ in diameter and $400{\mu}m$ in depth. A dielectric layer of $SiO_2$ was formed by thermal oxidation on the front side wafer and via hole side wall. An adhesion layer of Ti and a seed layer of Au were deposited. Soldering process was applied to fill the via holes with solder paste and metal powder. When the solder paste was used as via hole metal line, sintering state and electrical properties were excellent. However, electrical connection was poor due to occurrence of many voids. In the case of metal powder, voids were reduced but sintering state and electrical properties were bad. We tried the via hole filling process by using mixing solder paste and metal powder. As a consequence, it was confirmed that mixing rate of solder paste (4) : metal powder (3) was excellent electrical characteristics.

• Korean Journal of Environmental Agriculture
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• v.18 no.3
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• pp.209-214
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• 1999

Objective of the research is to estimate neutralization capacity and to determine practical running parameters required in packing tower design of waste oyster shells using Bohart-Adams equation. It is expected that waste oyster shells are able to be recycled for removal of heavy metals through neutralization of plating wastewater because those contain approximate 93% $CaCO_3$. By applying the results of the continuous experiment to Bohart-Adams equation, service time decreases in the order of Cr>Fe>Cu, while removal efficiencies of metals become less in the order of Fe>Cr>Cu.

• Polymer(Korea)
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• v.30 no.6
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• pp.471-477
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• 2006

Ion exchange metal composite(IPMC) has toughness equivalent to the range of human's muscle, transformation-actuation force by relatively low voltage and the fast response time. Thus, as a new method for preparing thicker IPMC, the solution casting method to make the films of various thicknesses out of liquid nation was attempted in this study. To reduce the surface resistance of electrode, the first plated electrode prepared by Oguro method was replated with Au and Ir using ion beam assisted deposition(IBAD). The microstructures of electrode surfaces before and after IBAD plating were investigated using SEM. The change of water and ion-conductivity in IPMC were measured under applied voltage. The displacement and driving force of IPMCs with various thicknesses were measured to evaluate the driving properties.

• The Korean Journal of Zoology
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• v.27 no.2
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• pp.73-84
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• 1984

In order to investigate the effect of neurotransmitter on myoblast differentiation in vitro, the effects of dopamine and epinephrine on myoblast fusion and on the intracellular cAMP level in cultured myoblasts were examined. Dopamine $(3\\times10^{-5}M)$ and epinephrine $(3\\times10^{-5}M)$, when added at 34 hr after cell plating, markedly inhibited myoblast fusion, and dopamine was more potent than epinephrine. Both dopamine and epinephrine had no effect on intracellular cAMP level. At the same time, exogeneous dbcAMP, $PGE_1$, and aspirin were used to examine whether cAMP is involved in myoblast differentiation. dbcAMP $(1\\times10^{-4}M)$ inhibited myoblast fusion, whereas $PGE_1 (3\\times10^{-6}M)$ had no inhibitory effect, rather enhancing myoblast fusion. Aspirin, an inhibitor of PG synthetase, was shown to inhibit myoblast fusion. Possible mechanism by which dopamine or epinephrine at a specific concentration used inhibits myoblast fusion is discussed.

• Journal of Microbiology and Biotechnology
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• v.13 no.4
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• pp.509-516
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• 2003

A model system for the immnunochemical detection of Escherichia coli O157:H7 using a combined immunomagnetic separation (IMS) and test-strip liposome immunoassay (LIA) procedure was developed. Immunomagnetic beads coated with anti-E. coli O157 IgG antibodies were used to separate the E. coli O157 (including the H7 serotype) from culture. Immunoliposomes, whose surface was conjugated to goat anti-E. coli O157:H7 IgG and which encapsulated the marker dye, sulforhodamine B, were used as a detection label. The test strip, onto which antibodies to goat IgG were immobilized, was the immunosensor capturing immunoliposomes that did not bind to E. coli O157:H7 on the immunomagnetic bead-E. coli O157:H7 complexes. In experiments, pure cell culture suspensions of $10^5 E.$ coli O157:H7 organisms per ml produced a measurable signal inhibition, whereas a weak yet detectable signal inhibition occurred with $10^3CFU/ml$. The inhibition signals increased, when the incubation time for IMS was extended to 90 min and higher IgG-tag density (0.4mol%) was used on the liposomes. With 0.2 and 0.4mol% IgG-tagged liposomes, the IMS-LIA procedure showed more improved signal inhibitions than those of a direct (no IMS) LIA. The combined assay, which measures the instantaneous signal from immunoliposomes, can be completed within 90 min, making it significantly faster than conventional plating methods and enzyme-linked immunosorbent assay (ELISA). Accordingly, it is quite feasible to use the combined immunoassay format of IMS and dye-loaded immunoliposomes for the detection of E. coli O157:H7.

• Journal of the Korean institute of surface engineering
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• v.49 no.1
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• pp.40-45
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• 2016

Recently, $Bi_2Te_3$-based alloys are the best thermoelectric materials near to room temperature, so it has been researched to achieve increased figure of merit(ZT). Ternary compounds such as Bi-Te-Se and Bi-Sb-Te have higher thermoelectric property than binary compound Bi-Te and Sb-Te, respectively. Compared to DC plating method, pulsed electrodeposition is able to control parameters including average current density, and on/off pulse time etc. Thereby the morphology and properties of the films can be improved. In this study, we electrodeposited n-type ternary Cu-doped $Bi_2(Te-Se)_3$ thin film by modified pulse technique at room temperature. To further enhance thermoelectric properties of $Bi_2(Te-Se)_3$ thin film, we optimized Cu doping concentration in $Bi_2(Te-Se)_3$ thin film and correlated it to electrical and thermoelectric properties. Thus, the crystal, electrical, and thermoelectric properties of electrodeposited $Bi_2(Te-Se)_3$ thin film were characterized the XRD, SEM, EDS, Seebeck measurement, and Hall effect measurement, respectively. As a result, the thermoelectric properties of Cu-doped $Bi_2(Te-Se)_3$ thin films were observed that the Seebeck coefficient is $-101.2{\mu}V/K$ and the power factor is $1412.6{\mu}W/mK^2$ at 10 mg of Cu weight. The power factor of Cu-doped $Bi_2(Te-Se)_3$ thin film is 1.4 times higher than undoped $Bi_2(Te-Se)_3$ thin film.

• Korean Journal of Materials Research
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• v.16 no.11
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• pp.681-686
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• 2006

Plasma nitrocarburising and plasma post oxidation were performed to improve the wear and corrosion resistance of S45C and SCM440 steel by a plasma ion nitriding system. Plasma nitrocarburizing was conducted for 3h at $570^{\circ}C$ in the nitrogen, hydrogen and methane atmosphere to produce the ${\varepsilon}-Fe_{2-3}$(N, C) phase. Plasma post oxidation was performed on the nitrocarburized samples with various oxygen/hydrogen ratio at constant temperature of $500^{\circ}C$ for 1 hour. The very thin magnetite ($Fe_3O_4$) layer $1-2{\mu}m$ in thickness on top of the $15{\sim}25{\mu}m$ ${\varepsilon}-Fe_{2-3}$(N, C) compound layer was obtained by plasma post oxidation. A salt spray test and electrochemical testing revealed that in the tested 5% NaCl solution, the corrosion characteristics of the nitrocarburized compound layer could be further improved by the application of the superficial magnetite layer. Throttle valve shafts were treated under optimum plasma processing conditions. Accelerated life time test results, using throttle body assembled with shaft treated by plasma nitrocarburising and post oxidation, showed that plasma nitrocarburizing and plasma post oxidation processes could be a viable technology in the very near future which can replace $Cr^{6+}$ plating.

• Korean Journal of Metals and Materials
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• v.48 no.11
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• pp.1041-1046
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• 2010

The reactions between a Sn-3.0Ag-0.5Cu solder alloy and electroless Ni/electroless Pd/immersion Au (ENEPIG) surface finishes with various Pd layer thicknesses (0, 0.05, 0.1, 0.2, $0.4{\mu}m$) were examined for the effect of the Pd layer on the massive spalling of the $(Cu,Ni)_6Sn_5$ layer during reflow at $235^{\circ}C$. The thin layer deposition of an electroless Pd (EP) between the electroless Ni ($7{\mu}m$) and immersion Au ($0.06{\mu}m$) plating on the Cu substrate significantly retarded the massive spalling of the $(Cu,Ni)_6Sn_5$ layer during reflow. Its retarding effect increased with an increasing EP layer thickness. When the EP layer was thin (${\leq}0.1{\mu}m$), the retardation of the massive spalling was attributed to a reduced growth rate of the $(Cu,Ni)_6Sn_5$ layer and thus to a lowered consumption rate of Cu in the bulk solder during reflow. However, when the EP layer was thick (${\geq}0.2{\mu}m$), the initially dissolved Pd atoms in the molten solder resettled as $(Pd,Ni)Sn_4$ precipitates near the solder/$(Cu,Ni)_6Sn_5$ interface with an increasing reflow time. Since the Pd resettlement requires a continuous Ni supply across the $(Cu,Ni)_6Sn_5$ layer from the Ni(P) substrate, it suppressed the formation of $(Ni,Cu)_3Sn_4$ at the $(Cu,Ni)_6Sn_5/Ni(P)$ interface and retarded the massive spalling of the $(Cu,Ni)_6Sn_5$ layer.

• Nano
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• v.13 no.11
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• pp.1850134.1-1850134.10
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• 2018

Increasing active sites and enhancing electric conductivity are critical factors to improve sensing performance toward phenol. Herein, Ni nanoparticle was successfully anchored on acidified multiwalled carbon nanotube (a-MWCNT) surface by electroless plating technique to avoid Ni nanoparticle agglomeration and guarantee high conductivity. The crystal structure, phase composition and surface morphology were characterized by XRD, SEM and TEM measurement. The as-prepared Ni/a-MWCNT nanohybrid was immobilized onto glassy carbon electrode (GCE) surface for constructing phenol sensor. The phenol sensing performance indicated that Ni/a-MWCNT/GCE exhibited an amazing detection performance with rapid response time of 4 s, a relatively wide detection range from 0.01 mM to 0.48 mM, a detection limit of $7.07{\mu}M$ and high sensitivity of $566.2{\mu}A\;mM^{-1}\;cm^{-2}$. The superior selectivity, reproducibility, stability and applicability in real sample of Ni/a-MWCNT/GCE endowed it with potential application in discharged wastewater.

• Journal of Korea Society of Waste Management
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• v.35 no.7
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• pp.653-659
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• 2018

In the industrial wastewater that occupies a large proportion of river pollution, the wastewater generated in textile, leather, and plating industries is hardly decomposable. Though dyeing wastewater has generally been treated using chemical and biological methods, its characteristics cause treatment efficiencies such as chemical oxygen demand (COD) and suspended solids (SS) to be reduced only in the activated sludge method. Currently, advanced oxidation technology for the treatment of dyeing wastewater is being developed worldwide. Electro-coagulation is highly adapted to industrial wastewater treatment because it has a high removal efficiency and a short processing time regardless of the biodegradable nature of the contaminant. In this study, the effects of the current density and the electrolyte condition on the COD removal efficiency in dyeing wastewater treatment by using electro-coagulation were tested with an aluminum anode and a stainless steel cathode. The results are as follows: (1) When the current density was adjusted to $20A/m^2$, $40A/m^2$, and $60A/m^2$ under the condition without electrolyte, the COD removal efficiency at 60 min was 62.3%, 72.3%, and 81.0%, respectively. (2) The removal efficiency with NaCl addition was 7.9% higher on average than that with non-addition at all current densities. (3) The removal efficiency with $Na_2SO_4$ addition was 4.7% higher on average than that with non-addition at all current densities.