• 센서학회지
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• 제27권5호
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• pp.340-344
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• 2018

Electrodes are an important part of electrocardiography (ECG); disposable electrodes have been extensively used. However, personal ECG monitoring devices for Internet of Things applications require reusable electrodes. As there have been no systematic studies on the characteristics of reusable electrodes to date, we conducted this study to assess the performance and feasibility of electrodes with different materials. We built reusable electrodes using twelve different metallic materials, including commonly used copper, silver, zinc, plating materials, chemically inert titanium, stainless steel, and aluminum. Each electrode was fabricated to a size of $5{\times}10mm$. Their characteristics such as offset, baseline drift, stabilization time, and chemical inertness were compared. A personal ECG monitoring system was used to test the manufactured electrodes. The performances of the Ag, Cu, and Zn electrodes were better than the performances of other electrodes. However, these materials may not be used owing to the chemical changes that occur when the electrodes are in contact with the skin, such as discoloration and corrosion, which deteriorate their electrical characteristics. Titanium, stainless steel, and aluminum are chemically stable. The titanium electrode showed the best performance among the three, and it is our recommendation as a material for manufacturing reusable electrodes.

• 한국진공학회지
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• 제8권4A호
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• pp.482-489
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• 1999

AC PDP(P1asma Display Pane1)s use the mixture of inert gases to generate a discharge inside the display pixels. Impurities such as CO, $CO_2$ and OH inside discharge region may deteriorate the characteristics of PDP operation during long life time of PDP. Electro-negative gas such as CO can cause the sustain pulse amplitude to rise by attaching electrons which will play an important role in the earlier stage of the discharge. MgO film is used to protect the dielectric layer in AC PDP, and is in contact with the free space of display pixel where it is filled with the inert gas mixture. So, MgO film can be a main source of impurities. In this experiment, we observed the change of impurity generation of various MgO films which were deposited by different methods, by using QMS. (quadropole mass spectrometer) The main impurites were $H_2$, CO and $CO_2$. And with the comparison of the TPD (temperature programmed desorption) result, it can be understood that impurity gases are generated by sputtering of MgO surface not by outgassing. Deposition method had effects on the characteristics of the impurity generation. The MgO film manufactured by e-beam evaporation generated more amount of impurity gases than the MgO films manufactured by sputtering or ion-plating. And also heat treatment of MgO film after deposition decreased the magnitude of impurity gas generation.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2008년도 추계학술대회 논문집 Vol.21
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• pp.12-12
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• 2008

Ruthenium is one of the noble metals having good thermal and chemical stability, low resistivity, and relatively high work function(4.71eV). Because of these good physical, chemical, and electrical properties, Ru thin films have been extensively studied for various applications in semiconductor devices such as gate electrode for FET, capacitor electrodes for dynamic random access memories(DRAMs) with high-k dielectrics such as $Ta_2O_5$ and (Ba,Sr)$TiO_3$, and capacitor electrode for ferroelectric random access memories(FRAMs) with Pb(Zr,Ti)$O_3$. Additionally, Ru thin films have been studied for copper(Cu) seed layers for Cu electrochemical plating(ECP) in metallization process because of its good adhesion to and immiscibility with Cu. We investigated Ru thin films by thermal ALD with various deposition parameters such as deposition temperature, oxygen flow rate, and source pulse time. Ru thin films were grown by ALD(Lucida D100, NCD Co.) using RuDi as precursor and $O_2$ gas as a reactant at 200~$350^{\circ}C$.

• 한국전자파학회논문지
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• 제19권2호
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• pp.257-262
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• 2008

본 논문에서는 열전도도가 우수한 AIN 기판에 $CO_2$ Laser 장비 를 이용하여 Thru-hole과 scribing line을 형성하기 위해 $CO_2$ laser의 파라미터(촛점 거리, 공기량, 레이저 빔 시간, 펄스 개수)를 실험하고, 자체 정렬 마스킹 기법을 이용한 5 um 두께의 Cu 도금으로 AIN 기판에 전송 선로와 나선형 평면 인덕터를 제작하였다. AIN 기판에서의 마이크로스트립 라인의 전송 손실은 10 GHz에서 0.1 dB/mm, 6 nH 나선형 평면 인덕터는 1 GHz에서 56의 품질 계수를 얻었고, 이를 통해 열전도도가 우수한 AIN 기판의 고전력 RF 응용이 가능할 것으로 기대한다.

• Structural Engineering and Mechanics
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• 제9권5호
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• pp.505-518
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• 2000

A major cause of premature debonding of tension face plates is shear peeling (Jones et al. 1988, Swamy et al. 1989, Ziraba et al. 1994, Zhang et al. 1995), that is debonding at the plate ends that is associated with the formation of shear diagonal cracks that are caused by the action of vertical shear forces. It is shown in this paper how side plated beams are less prone to shear peeling than tension face plated beams, as the side plate automatically increases the resistance of the reinforced concrete beam to shear peeling. Tests are used to determine the increase in the shear peeling resistance that the side plates provide, and also the effect of vertical shear forces on the pure flexural peeling strength that was determined in the companion paper. Design rules are then developed to prevent premature debonding of the plate ends due to peeling and they are applied to the strengthening and stiffening of continuous reinforced concrete beams. It is shown how these design rules for side plated beams can be adapted to allow for propped and unpropped construction and the time effects of creep and shrinkage, and how side plates can be used in conjunction with tension face plates.

• 마이크로전자및패키징학회지
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• 제14권3호
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• pp.37-42
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• 2007

반도체 소자의 집적도가 높아짐에 따라 3D SiP에 대한 관심이 높아지고 전기도금법을 이용한 구리 via filling이 활발히 연구되어왔다. Via filling시 via 입구와 바닥에 전류밀도 차이로 인해 via 내부에 결함이 발생하기 쉽다. 여러 가지 유기물 첨가제와 전류인가 방식의 변화를 통한 via filling을 하였다. 첨가된 유기물은 PEG, SPS, JGB, PEI를 사용하였다. 유기물이 첨가된 용액을 이용하여 펄스와 역펄스 방법을 이용하여 via filling을 하였다. 유기물의 첨가에 따른 도금된 구리 입자의 크기 및 형상에 관하여 고찰하였으며 도금 후 via 시편의 단면을 FESEM으로 관찰하였다. JGB에 비하여 PEI를 사용한 경우 치밀한 도금층을 얻을 수 있었다. 2 step via filling을 사용한 경우 via filling 시간을 단축시킬 수 있었다.

• 한국전자파학회논문지
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• 제15권9호
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• pp.835-840
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• 2004

현재 사용되고 있는 소형 레이더 장치는 타선의 진운동정보(진침로, 진속력)나 충돌회피정보(CPA, TCPA) 및 주위 상황 변화에 대한 다양한 물표 정보를 제공할 수 없는 문제가 있다. 따라서 본 논문에서는 이와 같은 문제에 주목하여 일반 소형 어선에 탑재되어 있는 저가형의 소형 레이더 장치로부터 analog video signal, trigger, bearing 및 heading pulse를 공급받아 현용의 자동 레이더 플롯팅 장치(Automatic Radar Plating Aid, ARPA) 레이더에서 제공하는 수준의 각종 정보를 정량적으로 추출 및 제공할 수 있는 레이더 목표 추출 장치(Radar Target Extractor, RTE)를 개발하여 소형 레이더 장치에 부착시켜 소형 연근해 어선에서도 타선의 진운동정보 및 충돌회피 정보와 같은 항해 정보를 수집, 활용할 수 있도록 하였다.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2000년도 제18회 학술발표회 논문개요집
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• pp.121-121
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• 2000

반도체 산업의 발달에 따라 소자의 보다 빠른 동작 속도와 큰 집적도를 갖은 ULSI 구조를 얻기 위해, 새로운 금속배선 재료가 요구되고 있다. 기존의 금속 배선인 Al 및 Al 합금은 비교적 낮은 비저항과 박막형성의 용이함으로 인하여 현재까지 금속배선 재료로 사용되고 있으나, 고집적화에 따라 RC Time Delay와 Electromigration의 문제점을 들어내었다. 이러한 문제를 해결할 새로운 배선 재료로 Al보다 낮은 비저항을 가지며, electromigration 저항성을 갖는 Cu 금속배선 재료가 활발히 연구되고 있다. 본 실험에서는 (100) Si 웨이퍼를 기판으로 사용하였으며, 각층은 SiO2/Si3N4/EP Cu/Seed Cu/ TaN/SiO2/Si wafer 상태로 증착하였다. 확산방지막으로 TaN을 사용하였고, seed Cu는 sputtering 으로 증착하였으며, seed Cu 만으로 된 박막과 seed Cu + electro plating Cu로 구성된 박막을 제작하였다. 제작 완료된 박막은 N2 분위기에서 20$0^{\circ}C$ 120 min, 45$0^{\circ}C$ 60min 동안 열처리하여 Cu 박막의 조직 변화를 TEM 및 여러 분석방법을 이용하여 분석하였다. Plan-view TEM결과, 45$0^{\circ}C$, 60min 열처리함에 따라 결정립 성장이 일어난 것을 확인 할 수 있었다. 그러나, 성장후에도 twin boundary, stacking fault, dislocation, small defect 등은 여전히 남아 있음이 관찰된다. 그림 1(a)는 as-deposit 상태이며, 그림 1(b)는 45$0^{\circ}C$, 60min 열처리한 plan-view TEM 사진이다.

• International Journal of Precision Engineering and Manufacturing
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• 제4권4호
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• pp.51-56
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• 2003

Generally, the build-up printed circuit board manufactured by a sequential process involving etching, plating, drilling, etc, which requires many types of equipments and long lead time. Etching process is suitable for mass production, however, it is not adequate for manufacturing a prototype in the development stage. In this study, we introduce a screen printing technology for prototyping a build-up printed circuit board. As for the material, photo/thermal curable resin and conductive paste are used for the formation of dielectric and conductor. The build-up structure is made by subsequent processes such as formation of a liquid resin thin layer, solidification by a UV/IR light, and via hole filling with a conductive paste. By use of photo curable resin, productivity is greatly enhanced compared with thermal curable resin. Finally, the basic concept and the possibility of build-up printed circuit board prototyping are proposed in comparison with the conventional process.

• Journal of Microbiology
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• 제39권4호
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• pp.321-325
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• 2001

Baird-Parker agar with egg yolk/tellurite emulsion (BPA) is widely accepted as a medium for the enu-meration of Staphylococcus aureus in foods. Howerver, it is not vompletely selective and colonies of other genera of species could be similar to those of Staphylococcus aureus. Moreover, the strains of Staphylococcus aureus that are lecithinase negatrive could go unnoticed. Both facts could affect the counts. The aim of this study was to dtermine whether the enumeration of the colonies with the typical morphol-ogy of Staphylococcus aureus on BPA is sufficien to quantity this species in poultry meat. Forty chiken carcasses were tested for Staphylococcus aureus by surface plating using BPA, Results indicate that the predictiv value of the morphoogy of the colonies of BPA is 85.71% and 68.42% for typical and atypical colonies of Staphylococcus aureus, respectively. However, Staphylococcus aureus counts (after identification) and counts of typical colonies did not show any significant differences(P>0.05) and are significantly(P<0.001) correlated (r=0.996).These results suggest that , for screening purposes. enumeration of Staphylococcus aureus from poultry meat does not require any identification of stains. resulting in a saving of time and money.