• 자원리싸이클링
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• 제10권2호
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• pp.27-33
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• 2001

무전해 Ni-Cu-P폐 도금액의 재사용에 대해 소정의 조건에서 조사하였다. 아연화처리한 후 니켈 촉매의 처리는 니켈 촉매처리를 하지 않았을 때 보다 도금시간이 연장되었다 Batch type에서 새로 제조한 도금액에 폐 도금액을 50% 첨가하여도 무전해 Ni-Cu-P 폐 도금액의 재사용이 가능하였다. 새로 제조한 도금액에 소모된 도금액의 성분을 연속적으로 보충하여 도금하면(Continuous type), 보충하지 않았을 경우(B기ch type)보다 도금시간이 10배 연장되었다. 새로 제조한 도금액에 폐 도금액 50%를 첨가하여 소모된 도금액의 성분을 연속적으로 보충할 경우(Continuous type)의 도금시간은 보충하지 않았을 경우(Batch type)의 도금시간 보다 3.7배 연장되었다. 도금층의 불량과 급격한 도금속도의 감소는 도금층의 Ni과 Cu의 성분 변화에 큰 영향을 미쳤다.

• 자원리싸이클링
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• 제12권1호
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• pp.18-24
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• 2003

무전해 Ni-Cu-B 폐 도금액의 재사용에 대해 소정의 조건에서 조사하였다. 아연화처리한 후 니켈 촉매의 처리는 니켈 촉매처리를 하지 않았을 때 보다 도금시간이 연장되었다. Batch type에서 새로 제조한 도금액에 폐 도금액을 40% 첨가하여도 무전해 Ni-Cu-B 폐 도금액의 재사용이 가능하였다. 새로 제조한 도금액에 소모된 도금액의 성분을 연속적으로 보충하여 도금하면(continuous type), 보충하지 않았을 경우(batch type) 보다 도금시간이 6배 연장되었다. 새로 제조한 도금액에 폐 도금액 40%를 첨가하여 소모된 도금 액의 성분을 연속적으로 보충할 경우(continuous type)의 도금시간은 보충하지 않았을 경우(continuous type)의 도금시간 보다 2배 연장되었다. 도금층의 불량과 급격한 도금속도의 감소는 도금층의 Ni과 Cu의 성분 변화에 큰 영향을 미쳤다.

• Carbon letters
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• 제9권2호
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• pp.105-107
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• 2008

In this work, we employed an electroless nickel plating on glass fibers in order to enhance the electric conductivity of fibers. And the effects of metal content and plating time on the conductivity of fibers were investigated. From the results, island-like metal clusters were found on the fiber surfaces in initial plating state, and perfect metallic layers were observed after 10 min of plating time. The thickness of metallic layers on fiber surfaces was proportion to plating time, and the electric conductivity showed similar trends. The nickel cluster sizes on fibers decreased with increasing plating time, indicating that surface energetics of the fibers could become more homogeneous and make well-packed metallic layers, resulting in the high conductivity of Ni/glass fibers.

• 한국표면공학회지
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• 제50권4호
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• pp.244-250
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• 2017

Effects of plating conditions (dispersant concentration, plating time, and ultrasonication) on electroless Cu plating on SiC fabric woven by crossing of SiC continuous fibers vertically were studied. The ultrasonic dispersion treatment not only did not improve the dispersion of the SiC fibers, but also did not change the plating thickness. The ultrasonication in the pretreatment step of electroless plating did not improve the dispersion of the fibers, while the ultrasonication in the plating step enhanced the dispersion of the fibers and decreased the thickness of the Cu films. It was possible to control the thickness of the Cu coating layer as well as the dispersion of the fibers in the fabric by changing the plating conditions such as dispersant concentration, plating time, and ultrasonication, but it was very difficult to coat copper on the intersection of vertical fibers in the fabric.

• 한국표면공학회지
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• 제53권6호
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• pp.312-321
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• 2020

Morphology of porous cobalt electro-deposits was systematically investigated as functions of cobalt precursors in the plating bath and applied cathodic current density with a special focus on cobalt nano-rod formation. It was proved that the concentration of cobalt precursor plays little effect on the morphology of cobalt electro-deposits at relatively low plating current density while it significantly affects the morphology with increasing plating current density. Such a dependence was discussed in terms of the kinetics of two competitive reactions of cobalt reduction and hydrogen evolution. Cobalt nano-rod structure was created at specific ranges of cobalt precursor content and applied cathodic current density, and its diameter and length varied with plating time without notable formation of side branches which is usually found during dendrite formation. Specifically, the nano-rod length was preferentially increased in relative short plating time (<15 s), resulting in higher aspect ratio of nano-rod with plating time. Whereas, both the nano-rod length and diameter were increased nearly at the same level in a prolonged plating time, making the aspect ratio unchanged. From the analysis of crystal structure, it was confirmed that the cobalt nano-rod preferentially grew in the form of single crystal on a dense poly-crystalline cobalt thin film initially formed on the substrate.

• 자원리싸이클링
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• 제14권4호
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• pp.34-40
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• 2005

무전해 Co-Cu-P 폐 도금액의 재사용에 대해 소정의 조건에서 조사하였다. 아연화처리한 후 코발트 촉매의 처리는 코발트 촉매 처리를 하지 않았을 때 보다 도금시간이 연장되었다. Batch type에서 새로 제조한 도금액에 폐 도금액을 $50\%$ 첨가하여도 무전해 Co-Cu-P폐 도금액의 재사용이 가능하였다. 새로 제조한 도금액에 소모된 도금액의 성분을 연속적으로 보충하여 도금하면(Continuous 쇼pe), 보충하지 않았을 경우(Batch type) 보다 도금시간이 7.5배 연장되었다. 새로 제조한 도금액에 폐 도금액 $50\%$를 첨가하여 소모된 도금액의 성분을 연속적으로 보충할 경우(Continuous type)의 도금시간은 보충하지 않았을 경우(Batch type)의 도금시간 보다 2.5배 연장되었다. 도금층의 불량과 급격한 도금속도의 감소는 도금층의 Co와 Cu의 성분 변화에 큰 영향을 미쳤다.

• 한국표면공학회지
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• 제42권4호
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• pp.152-156
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• 2009

Electroless plating is influenced by kinds of parameters including concentrations of electrolyte, plating time, temperature and so on. In this study, the Pt thin films were prepared on GaAs substrate by a 2-step electroless plating depending method. The small Pt catalytic particles by using Pt I bath exhibited islands-morphology dispersed throughout the substrate surface at $65^{\circ}C$, as function as a sensitized thin film, and then a thicker Pt film grew upon the sensitized layer by the second Pt II bath. As the growth of Pt film is strongly influenced by the plating time and temperature, the plating time of Pt II bath varied from 5 min to 40 min at $60{\sim}80^{\circ}C$ after Pt I bath at $60{\sim}80^{\circ}C$ for 5 min. It is found that the film grows with the increasing plating time and temperature. The resistivity value of Pt deposited layer was characterized to study the growth mechanism of 2-step plating.

• 한국표면공학회지
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• 제35권3호
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• pp.141-148
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• 2002

Fe-C alloy layers were produced by pulse plating and the properties were compared with those produced by D.C. plating. When the pulse on time ($T_{on}$ ) was the same, both the duty cycle and peak current density($I_{p}$ ) had little influence on the carbon content and the hardness of the layer. The structure and hardness of the direct current plating were similar to those of the pulse current plating. However, the ductility was enhanced when the pulse current was applied due to the release of residual stress during the pulse off time($T_{off}$).).

• 산업경영시스템학회지
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• 제38권4호
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• pp.72-79
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• 2015

A number of plating companies have been exposed to the risk of fire due to unexpected temperature increasing of water in a plating bath. Since the companies are not able to forecast the unexpected temperature increasing of water and most of raw materials in the plating process have low ignition temperature, it is easy to be exposed to the risk of fire. Thus, the companies have to notice the changes immediately to prevent the risk of fire from plating process. Due to this reason, an agile and systematic temperature monitoring system is required for the plating companies. Unfortunately, in case of small size companies, it is hard to purchase a systematic solution and be offered consulting from one of the risk management consulting companies due to an expensive cost. In addition, most of the companies have insufficient research and development (R&D) experts to autonomously develop the risk management solution. In this article, we developed a real time remote temperature monitoring system which is easy to operate with a lower cost. The system is constructed by using Raspberry Pi single board computer and Android application to release an economic issue for the small sized plating manufacturing companies. The derived system is able to monitor the temperature continuously with tracking the temperature in the batch in a short time and transmit a push-alarm to a target-device located in a remoted area when the temperature exceeds a certain hazardous-temperature level. Therefore, the target small plating company achieves a risk management system with a small cost.

• 동력기계공학회지
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• 제4권2호
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• pp.31-39
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• 2000

Relationships between the plating condition and the plating rate of the deposition film for the electroless plating of Co-Cu-P alloy were discussed in this report. The result obtained from this experiment were summarized as follow ; The optimum bath composition was consisted of 0.8 ppm thiourea as a stabilizing agent. Composition of the deposit was found to be uniform after two hours of electroless plating. Plating rates of nickel-catalytic surface and zincate-catalytic surface were found to be very closely equal, but the plating time of nickel-catalytic surface took longer than that of the zincated-catalytic surface.