Journal of Power System Engineering (동력기계공학회지)
- Volume 4 Issue 2
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- Pages.31-39
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- 2000
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- 2713-8429(pISSN)
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- 2713-8437(eISSN)
Effect of Plating Condition and Surface on Electroless Co-Cu-P Alloy Plating Rate
무전해 Co-Cu-P 도금속도에 미치는 도금 조건과 표면상태의 영향
Abstract
Relationships between the plating condition and the plating rate of the deposition film for the electroless plating of Co-Cu-P alloy were discussed in this report. The result obtained from this experiment were summarized as follow ; The optimum bath composition was consisted of 0.8 ppm thiourea as a stabilizing agent. Composition of the deposit was found to be uniform after two hours of electroless plating. Plating rates of nickel-catalytic surface and zincate-catalytic surface were found to be very closely equal, but the plating time of nickel-catalytic surface took longer than that of the zincated-catalytic surface.
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