• Title/Summary/Keyword: Plating rate

검색결과 262건 처리시간 0.029초

AIN 기판의 수동 소자 특성 (The Characteristic of Passive Elements on Aluminum Nitride Substrate)

  • 김승용;육종민;남충모
    • 한국전자파학회논문지
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    • 제19권2호
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    • pp.257-262
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    • 2008
  • 본 논문에서는 열전도도가 우수한 AIN 기판에 $CO_2$ Laser 장비 를 이용하여 Thru-hole과 scribing line을 형성하기 위해 $CO_2$ laser의 파라미터(촛점 거리, 공기량, 레이저 빔 시간, 펄스 개수)를 실험하고, 자체 정렬 마스킹 기법을 이용한 5 um 두께의 Cu 도금으로 AIN 기판에 전송 선로와 나선형 평면 인덕터를 제작하였다. AIN 기판에서의 마이크로스트립 라인의 전송 손실은 10 GHz에서 0.1 dB/mm, 6 nH 나선형 평면 인덕터는 1 GHz에서 56의 품질 계수를 얻었고, 이를 통해 열전도도가 우수한 AIN 기판의 고전력 RF 응용이 가능할 것으로 기대한다.

수소저장합금의 마이크로캡슐화 (Microencapsulation of Hydrogen Storage Alloys)

  • 김대룡;김용철;금동욱
    • 한국수소및신에너지학회논문집
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    • 제1권1호
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    • pp.31-39
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    • 1989
  • Although it has been well known that many metal hydrides are promising to use for hydrogen storage and other applications, some difficulties still remain. Metal hydrides, particularly in powder form, have very poor thermal conductivity. The hydrogen storage alloys degrade intrinsically or extrinsically during repeated hydriding and dehydriding. Elimination of these problems is very important in the practical applications. In order to prevent degradation and to improve the thermal conductivity, the hydrogen storage characteristics of rare-earth type alloy encapsulated with Cu or Ni by means of chemical plating have been investigated. No changes has occured in hydrogen absorption capacity and equilibrium pressure even though the alloy powder is microencapsulated. The first hydrogen absorption rate of the alloy encapsulated increased considerably comparing to uncapsulated sample. In the case of encapsulating the fine powder ($>10{\mu}m$) and subsequent compacting by $8ton/cm^2$, shape of compact is maintained regardless of hydriding and dehydriding. The degree of degradation of the alloy caused by impurity gas of CO or $O_2$ was decreased prominently by encapsulation.

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무전해 팔라듐-인 도금의 석출속도에 미치는 에틸렌디아민 농도의 영향 (Effect of Ethylenediamine Concentraion on Precipitation Rate of Electroless Palladium-Phosphorous Plating)

  • 배성화;한세훈;손인준
    • 한국표면공학회:학술대회논문집
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    • 한국표면공학회 2017년도 춘계학술대회 논문집
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    • pp.128-128
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    • 2017
  • 무전해 도금이란 외부의 전원을 사용하지 않고 환원제를 이용하여 금속 피막을 석출시키는 방법이다. 이러한 무전해 도금은 최근에 와서 인쇄회로기판(printed circuit board)등 다양한 전자부품에 적용되고 있다. 최근 급격한 금 가격 상승으로 인해 전자부품용에 사용되는 금의 사용량을 감소시키거나 또는 금을 대체할 수 있는 도금 층에 관한 연구가 활발하게 진행되고 있다. 금을 대체할 수 있는 즉 비용 경감의 가능성이 있는 도금 재료로는 팔라듐이 유력하다. 팔라듐은 금의 약 1/2가격으로 우수한 내식성 및 낮은 접촉저항을 가지기 때문에 접점재료로서 오래전부터 사용되어져왔다. 무전해 팔라듐-인 도금의 착화제, 환원제, 경도, 접촉저항에 대한 연구는 많이 있지만 도금속도에 미치는 인자에 대해서는 명확하지 않은 것이 많다. 따라서 본 연구는 무전해 팔라듐-인 도금의 석출석도에 미치는 에틸렌디아민 농도의 영향에 대하여 조사하였다. 실험방법으로는 환원제로 차아인산을 사용하고 착화제로는 에틸렌디아민을 사용하여 문전해 팔라듐-인 도금액을 제조하였다. 에틸렌디아민의 농도는 각각 5ml/L, 7.5ml/L, 10ml/L, 12ml/L로 하였다. pH는 7.5, 온도는 $45^{\circ}C$로 하여 30분 동안 도금을 실시하였다. 무전해 팔라듐-인 도금속도는 정밀저울로 무게를 측정하였고 ICP-OES을 사용하여 도금층의 농도를 분석, XRF를 사용하여 성분분석과 XRD를 사용해 결정회절을 분석하였다. 또한 SEM을 사용하여 단면 관찰을 하였으며 석출속도에 미치는 에틸렌디아민의 영향을 전기화학 분극곡선을 통해서 고찰을 시도해 보았다.

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Effect of Zincate Treatment of As-Cast AZ91 Mg Alloy on Electrodeposition of Copper in a Copper Pyrophosphate Bath

  • Nguyen, Van Phuong;Park, Min-Sik;Yim, Chang Dong;You, Bong Sun;Moon, Sungmo
    • 한국표면공학회지
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    • 제49권5호
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    • pp.401-407
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    • 2016
  • In this work, effect of zincate treatment of AZ91 Mg alloy on the following electrodeposition of copper was examined in a non-cyanide bath containing pyrophosphate ions in view of surface morphology and adhesion of the electrodeposited copper layer. Without zincate treatment, the electrodeposited copper layer showed very porous structure and poor adhesion. On the other hand, the copper layer electrodeposited on the zincate-treated surface showed dense structure and good adhesion. The dissolution rate of AZ91 Mg alloy after the zincate treatment appeared to decrease about 40 times in the copper pyrophosphate bath, as compared to that of the surface without zincate treatment. The porous morphology and poor adhesion of a copper layer on the AZ91 Mg alloy surface without zincate treatment were attributed to small number of nucleation sites of copper because of rapid dissolution of the magnesium substrate in the pyrophosphate bath. Based on the experimental results, it is concluded that the zincate treatment to form a conducting and protecting layer on the AZ91 Mg alloy surface is essential for successful electrodeposition of a copper layer on AZ91 Mg alloy with good adhesion and dense structure in the copper pyrophosphate bath.

A Review of Pressure Tube Failure Accident in the CANDU Reactor and Methods for Improving Reactor Performance

  • Yoo, Ho-Sik;Chung, Jin-Gon
    • Nuclear Engineering and Technology
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    • 제30권3호
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    • pp.262-272
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    • 1998
  • The experiences and causes of pressure tube cracking accidents in the CANDU reactors and the development of the fuel channel at AECL(Atomic Energy Canada Limited) have been described. Most of the accidents were caused by Delayed Hydride Cracking(DHC). In the cases of the Pickering units 3&4 and the Bruce unit 2, excessive residual stresses induced by an improper rolled joint process played a role in DHC. In the Pickering unit 2, cracks formed by contact between the pressure and calandria tubes due to the movement of the garter spring were the direct cause of the failure. To extend the life of a fuel channel, several R&D programs examining each component of the fuel channel have been carried out in Canada. For a pressure tube, the main concern is focused on changing the fabrication processes, e.g., increasing cold working rate, conducting intermediate annealing and adding a third element like Fe, V, and Cr to the tube material. In addition to them, chromium plating on the end fitting and increasing wall thickness at both ends of the calandria tube are considered. There has also been much interest in the improvement of fuel channel performance in our country and several development programs are currently under way.

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경질용 3가 크롬전착에 미치는 전해조건의 영향 (Effect of Electrolysis Conditions on Hard Chromium Deposition from Trivalent Chromium Bath)

  • 김대영;박상언;김만;권식철;최주원;최용
    • 한국표면공학회지
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    • 제36권2호
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    • pp.155-160
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    • 2003
  • The effect of the temperature, current density and deposit time on hard chromium deposition in trivalent chromium bath was investigated. Cathode current efficiency increased with increasing current density. Increasing bath temperature from $20^{\circ}C$ to $50^{\circ}C$, chromium deposits were produced in higher current density and the maximum current efficiency was increased. At the plating conditions of $40^{\circ}C$, $30A/dm\m^2$, the deposition thickness increased in proportion to increasing electrolysis time The rate is$ 90\mu\textrm{m}$/hrs. for 2 hours. Microhardness of chromium deposits increased with increasing bath temperature and decreasing current density, and it was constant with electrolysis time. All of bath conditions, microstructure of chromium deposits has nodular structure with some cracking pattern and nodule size increased with increasing deposit thickness.

마그네슘 티타네이트 표면의 조골세포 부착도와 분화 (Osteoblast adhesion and differentiation on magnesium titanate surface)

  • 최승민;이재관;고성희;엄흥식;장범석
    • Journal of Periodontal and Implant Science
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    • 제35권4호
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    • pp.851-861
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    • 2005
  • The nature of the implant surface can directly influence cellular response, ultimately affecting the rate and quality of new bone tissue formation. The aim of this in vitro study was to investigate if human osteoblast-like cells, Saos-2, would respond differently when plated on disks of magnesium titanate and machined titanium. Magnesium titanate disks were prepared using Micro Arc Oxidation(MAO) methods. Control samples were machined commercially pure titanium disks. The cell adhesion, proliferation and differentiation were evaluated by measuring cell number, and alkaline phosphatase(ALPase) activity at 1 day and 6 day after plating on the titanium disks. Measurement of cell number and ALPase activity in Saos-2 cells at 1 day did not demonstrate any difference between machined titanium and magnesium titanate. When compared to machined titanium disks, the number of cells was reduced on the magnesium titanate disks at 6 day, while ALPase activity was more pronounced on the magnesium titanate. Enhanced differentiation of cells grown on magnesium titanate samples was indicated by decreased cell proliferation and increased ALPase activity.

음극 아크 이온플레이팅법으로 코팅된 TiN 박막의 수명결정요인에 관한 연구 (A study on life decision factors of TiN films coated by Cathode Arc ion Plating Method)

  • 최석우;백영남
    • 한국표면공학회지
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    • 제33권4호
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    • pp.222-228
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    • 2000
  • The life time of cutting tool was studied in the relation with the properties of TiN coating tools. The purpose of this study is to compare the cutting conditions of the TiN coated tools with those of the non-coated tools and to find out the optimal cutting condition of the TiN coated tool. The coated tools were prepared by the sputtering process at $4$\times$10^{-3}$Torr. When the cutting speed is increased 22.2% from 90m/min, the limited life of coating bite was decreased by 60.61%, but non-coating bite was decreased by 64.05%. In the tool lifetime equation of the coated tools "a"(exponent of feed rate) was not much changed in comparison with that of the non-coated tools but "n" (exponent of tool′s life) was increased by 9.3% and "b" (exponent of cutting depth) was increased by 2.4%. It was thought to be that TiN coated tools was used for higher cutting speed than non-coated tools to improve the lifetime of the coated tools.

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Contact resistance characteristics of 2G HTS coils with metal insulation

  • Sohn, M.H.;Ha, H.;Kim, S.K.
    • 한국초전도ㆍ저온공학회논문지
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    • 제20권4호
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    • pp.26-30
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    • 2018
  • The turn-to-turn contact resistance of 2G high temperature superconducting (HTS) coils with metal insulation (MI) is closely related to the stability of the coils, current charging rate and delay time [1]. MI coils were fabricated using five kinds of metal tapes such as aluminum (Al) tape, brass tape, stainless steel (SS) tape, copper (Cu)-plated tape and one-sided Cu-plated SS tape. The turn-to-turn contact surface resistances of co-winding model coils using Al tape, brass tape, and SS tape were 342.6, 343.6 and $724.8{\mu}{\Omega}{\cdot}cm^2$, respectively. The turn-to-turn contact resistance of the model coil using the one-sided Cu-plated SS tape was $ 248.8{\mu}{\Omega}{\cdot}cm^2$, which was lower than that of Al and brass tape. Al or brass tape can be used to reduce contact resistance and improve the stability of the coil. Considering strength, SS tape is recommended. For strength and low contact resistance, SS tape with copper plating on one side can be used.

Fabrication of three-dimensional electrical patterns by swollen-off process: An evolution of the lift-off process

  • Mansouri, Mariam S.;An, Boo Hyun;Shibli, Hamda Al;Yassi, Hamad Al;Alkindi, Tawaddod Saif;Lee, Ji Sung;Kim, Young Keun;Ryu, Jong Eun;Choi, Daniel S.
    • Current Applied Physics
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    • 제18권11호
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    • pp.1235-1239
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    • 2018
  • We present a novel process to fabricate three-dimensional (3D) metallic patterns from 3D printed polymeric structures utilizing different hygroscopic swelling behavior of two different polymeric materials. 3D patterns are printed with two different polymers as cube shape. The surface of the 3D printed polymeric structures is plated with nickel by an electroless plating method. The nickel patterns on the surface of the 3D printed cube shape structure are formed by removing sacrificial layers using the difference in the rate of hygroscopic swelling between two printing polymer materials. The hygroscopic behavior on the interfaced structure was modeled with COMSOL Multiphysics. The surface and electrical properties of the fabricated three-dimensional patterns were analyzed and characterized.