• Korean Journal of Materials Research
• /
• v.24 no.4
• /
• pp.186-193
• /
• 2014

A thin Cu seed layer for electroplating has been employed for decades in the miniaturization and integration of printed circuit board (PCB), however many problems are still caused by the thin Cu seed layer, e.g., open circuit faults in PCB, dimple defects, low conductivity, and etc. Here, we studied the effect of heat treatment of the thin Cu seed layer on the deposition rate of electroplated Cu. We investigated the heat-treatment effect on the crystallite size, morphology, electrical properties, and electrodeposition thickness by X-ray diffraction (XRD), atomic force microscope (AFM), four point probe (FPP), and scanning electron microscope (SEM) measurements, respectively. The results showed that post heat treatment of the thin Cu seed layer could improve surface roughness as well as electrical conductivity. Moreover, the deposition rate of electroplated Cu was improved about 148% by heat treatment of the Cu seed layer, indicating that the enhanced electrical conductivity and surface roughness accelerated the formation of Cu nuclei during electroplating. We also confirmed that the electrodeposition rate in the via filling process was also accelerated by heat-treating the Cu seed layer.

• Transactions of the Korean Society of Mechanical Engineers A
• /
• v.21 no.10
• /
• pp.1674-1682
• /
• 1997

Fatigue tests were performed to investigate the effect of ceramic coatings as in TiN and TiCN on fatigue crack growth properties of ceramic coated 1Cr-1Mo-0.25V steel with different coating thickness in laboratory air conditions. The experimental results are described with respect to a Paris equation, da/dN=C(.DELTA.K)$^{m}$ , where the crack growth rate of coated specimens provided as similar growth rate as that of the uncoated specimen regardless of coating thickness. Furthermore, it was observed that the type of coating layer had virtually no effect on crack growth rate in the full region of stress intensity factor range. And it was also appeared that the final crack length of TiCN coated specimens was short compared to that of TiN coated, and the substrate specimens, in which it was inferred due to lowering the toughness of coated material from high hardness of TiCN coating layer itself.

• Korean Journal of Materials Research
• /
• v.27 no.2
• /
• pp.119-126
• /
• 2017

WC-CrC-Ni coatings were prepared by nine processes of the Taguchi program with three levels for the four spray parameters: spray distance, flow rates of hydrogen and oxygen, and powder feed rate. The optimal coating process (OCP) was oxygen flow rate of 38 FMR, hydrogen flow rate of 53 FMR, powder feed rate of 25 g/min, and spray distance of 7 inches. Hardness of 1150 Hv and porosity of 1.2 %, were obtained by OCP; these are better results compared with the highest 1033 Hv and the lowest 1.5 % porosity obtained by nine processes of the Taguchi program. Friction coefficient of the WC-CrC-Ni coating decreased from $0.36{\pm}0.07$ at $25^{\circ}C$ to $0.23{\pm}0.07$ at $450^{\circ}C$. These values were smaller than those of the EHC (electrolytic hard chrome) plating at both temperatures due to lubrication from the oxide debris. The wear trace and wear depth of the coating are smaller than those of the EHC at both temperatures. Pitting was not found in the WC-CrC-Ni coating sample, while it did appear in the EHC sample.

• Journal of Surface Science and Engineering
• /
• v.23 no.2
• /
• pp.24-29
• /
• 1990

The TiN filmms were deposited on the stainless steel substrates by BARE techinique in order to investigate the effects of process parameters such as source-to-substate distance (15-35cm), N2 pressure(4$\times$10-10 -1$\times$10-3mb)and bias voltage(O-2000V), on the deposition rate, the concentration ratio [N/Ti] and the surface color of the films. The deposition rate was deduced from the weight measurement, the [N/ti] ratio by ESCA. The deposition rate decreased with a relationship of=40.2/D2 where D was source-to-substrate distance. The effect of the bias voltage and the N2pressure on the deposition rate, however, appeared negligble. The [N/Ti] ratio was in the narrow range of 0.7 tp 0.8 It increased slightly with the N2 partial pressure and deceased with the source-to-substrate distance. It was confired by ESCA that a significant amount of oxygen and carbon was contaminated after deposition in the top surface of TiN films. The surface color of TiN film was changed from light gold yellow to reddish gold yellow with increasing [N/Ti] ratio.

• Journal of the Korean Society for Heat Treatment
• /
• v.25 no.1
• /
• pp.6-13
• /
• 2012

HVOF thermal spray coating of 80%WC-CoFe powder is one of the most promising candidate for the replacement of the traditional hard chrome plating and hard ceramics coating because of the environmental problem of the very toxic $Cr^{6+}$ known as carcinogen by chrome plating and the brittleness of ceramics coatings. 80%WC-CoFe powder was coated by HVOF thermal spraying for the study of durability improvement of the high speed spindle such as air bearing spindle. The coating procedure was designed by the Taguchi program, including 4 parameters of hydrogen and oxygen flow rates, powder feed rate and spray distance. The surface properties of the 80%WC-CoFe powder coating were investigated roughness, hardness and porosity. The optimal condition for thermal spray has been ensured by the relationship between the spary parameters and the hardness of the coatings. The optimal coating process obtained by Taguchi program is the process of oxygen flow rate 34 FRM, hydrogen flow rate 57 FRM, powder feed rate 35 g/min and spray distance 8 inch. The coating cross-sectional structure was observed scanning electron microscope before chemical etching. Estimation of coating porosity was performed using metallugical image analysis. The Friction and wear behaviors of HVOF WC-CoFe coating prepared by OCP are investigated by reciprocating sliding wear test at $25^{\circ}C$ and $450^{\circ}C$. Friction coefficients (FC) of coating decreases as sliding surface temperature increases from $25^{\circ}C$ to $450^{\circ}C$.

• Journal of Surface Science and Engineering
• /
• v.20 no.3
• /
• pp.118-126
• /
• 1987

The Zn-Al composite electroplating was studied by using chloride zinc bath containing metal hydroxides $(Zn(OH)_2,\;Al(OH)_3))$ and aluminium powder. The size of Al powder codeposited in the beaker bath with Al powder of-400 mesh was under 10${\mu}m$. The Zn-Al composite was electro-deposited at 40$^{\circ}C$ in the ranges of current density of 5-50 A/$dm^2$ in the flowing electrolyte. The content of aluminium particles codeposited increased slightly with increasing flow rate of electrolyte from 0.5 m/sec to 1.0 m/sec, and decreased with increasing current density from 5 A/$dm^2$ to 50 A/$dm^2$. The content of aluminium particles codeposited by using the electrolyte containing zinc hydroxide(0.1M) was 2~4 wt%. The Al powder was codeposited mainly near the surface layer of the electrodeposits. The dissolution rate of aluminium particles in the electrolyte containing 0.1M $Zn(OH)_2$ and Boric acid was 0.41 g/l. day in comparison with 1.5 g/l. day dissolution rate in pure chloride bath.

• Polymer(Korea)
• /
• v.30 no.4
• /
• pp.332-337
• /
• 2006

Monodisperse polymer particles were prepared via one-step seeded polymerization using PMMA seed particles and HDDA (or EGDMA) as crosslinking monomer. For the study, the effects of 1) the ratio of the absorbed monomer or monomer mixture to the seed polymer particles (swelling ratio), 2) the ratio of EGDMA in absorbed monomer mixture, 3) the dosage of initiator, and 4) electro less Ni plating on the variation of mechanical properties of monodisperse polymer particles, such as recovery rate, K-values, breaking strength and breaking displacement, were investigated by using MCT (micro compression test). It was observed that monomer swelling ratio influenced only breaking strength, but EGDMA ratio in monomer mixture, dosage of initiator and electroless Ni plating affected both K-values and breaking strength.

• The Korean Journal of Zoology
• /
• v.32 no.1
• /
• pp.40-47
• /
• 1989

Alteration of intracellular calcium ion Concentration by adding of either calcium ionophore A23187 or EGTA in culture medium at 24 hr after cell plating resulted in remarkable changes in the progression of differentiation of chick embryo myoblast. When separated myoblast proteins using two-dimensional gel electrophoresis, synthesis patterns of several proteins changed upon the addition of either A23187 or EGTA. Treatment of A23187 and calciumactivated neutral protease at 24 hr after initial plating caused an increase in the rate of fusion compared to control culture. However, EGTA inhibited the myoblast fusion to a marked degree. A23187 treated at 24hr also increased the activity of protein kinase C during the fusionprogressed period. It seems that intracellular calcium ion plays an important role in the myoblast differentiation in vitro together with the protein kinase C and calcium-activated neutral protease.

• Journal of the Microelectronics and Packaging Society
• /
• v.19 no.2
• /
• pp.55-59
• /
• 2012

Defects such as voids or seams are frequently found in TSV via filling process. To achieve defect-free copper via filling, organic additives such as suppressor, accelerator and leveler were necessary in a copper plating bath. However, by-products stemming from the breakdown of these organic additives reduce the lifetime of the devices and plating solutions. In this research, the effects of levelers on copper electrodeposition were investigated without suppressor and accelerator to lower the concentration of additives. Threelevelers(janus green B, methylene violet, diazine black) were investigated to study the effects of levelers on copper deposition. Electrochemical behaviors of these levelers were different in terms of deposition rate. Filling performances were analyzed by cross sectional images and its characteristics were different with variations of levelers.

• Journal of Surface Science and Engineering
• /
• v.44 no.3
• /
• pp.95-104
• /
• 2011

Ti based nanocomposite films including V, Si and Nb (Ti-Me-N, Me=V, Si and Nb) were fabricated by hybrid physical vapor deposition (PVD) method consisting of unbalanced magnetron (UBM) sputtering and arc ion plating (AIP). The pure Ti target was used for arc ion plating and other metal targets (V, Si and Nb) were used for sputtering process at a gas mixture of Ar/$N_2$ atmosphere. Mostly all of the films were grown with textured TiN (111) plane except the Si doped Ti-Si-N film which has strong (200) peak. The microhardness of each film was measured using the nanoindentation method. The minimum value of removal rate ($0.5{\times}10^{-15}\;m^2/N$) was found at Nb doped Ti-Nb-N film which was composed of Ti-N and Nb-N nanoparticles with small amount of amorphous phases.