• Title/Summary/Keyword: Plating rate

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Effect of Plating Condition and Plating Rate on the Magnetic Properties of Electroless Ni-Cu-P Deposits (무전해 Ni-Cu-P 도금층의 자성에 미치는 도금조건과 도금속도의 영향)

  • Oh, I.S.;Lee, T.H.
    • Journal of Power System Engineering
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    • v.10 no.3
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    • pp.58-66
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    • 2006
  • The effect of bath composition, plating condition and plating rate on the magnetic properties of electroless Ni-Cu-P deposits were investigated. With increasing $CuSO_4$ concentration in the bath, plating rate increased, while the Br value of deposits decreased Sharply. Plating rate increased up to 34% with the addition of 200ppm of NaF and 0.8ppm of Thiourea to the bath. Plating reaction had been ceased by the increase of pH above 11.3, bath temperature higher than $90^{\circ}C$ and under $70^{\circ}C$. The Br value of deposit was uniform with various concentration of complexing agent (Sodium citrate, Ethylenediamine) in the bath. The Br value of deposit was almost equal to that found by the addition of stabilizer(Thiourea) and accelerator(NaF). The Br value of deposit was uniform in plating time(120 min) and heat treatment temperature(below $200^{\circ}C$), and were confirmed to have adequate bath stability for practical use.

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Effect of Plating Condition and Surface on Electroless Co-Cu-P Alloy Plating Rate (무전해 Co-Cu-P 도금속도에 미치는 도금 조건과 표면상태의 영향)

  • Oh, L.S.
    • Journal of Power System Engineering
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    • v.4 no.2
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    • pp.31-39
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    • 2000
  • Relationships between the plating condition and the plating rate of the deposition film for the electroless plating of Co-Cu-P alloy were discussed in this report. The result obtained from this experiment were summarized as follow ; The optimum bath composition was consisted of 0.8 ppm thiourea as a stabilizing agent. Composition of the deposit was found to be uniform after two hours of electroless plating. Plating rates of nickel-catalytic surface and zincate-catalytic surface were found to be very closely equal, but the plating time of nickel-catalytic surface took longer than that of the zincated-catalytic surface.

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Effect of Plating Condition and Plating Rate on the Magnetic Properties of Electroless Co-Cu-P Deposits (무전해 Co-Cu-P 도금층의 자성에 미치는 도금조건과 도금속도의 영향)

  • Oh, I.S.;Park, S.D.
    • Journal of Power System Engineering
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    • v.8 no.3
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    • pp.36-43
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    • 2004
  • The effect of bath composition, plating condition and plating rate on the magnetic property of electroless Co-Cu-P deposits were investigated. With increasing $CuCl_2$ concentration in the bath, plating rate increased, while the Br value of deposit decreased sharply. Deposited surface were inferiority by the increase pH above 10.5, bath temperature higher than $80^{\circ}C$. Plating reaction had been ceased by the increase of pH above 11, bath temperature higher than $90^{\circ}C$ and under $40^{\circ}C$. The Br value of deposit was uniform with various concentration of complexing agent(sodium citrate) in the bath. The Br value of deposit was almost equal to that found by the addition of stabilizer (thiourea) and accelerator(NaF). The Br value of deposit was uniform in plating time(20min) and heat treatment temperature(below $200^{\circ}C$), and were confirmed to have adequate bath stability for practical use.

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Studies on Electroless Nickel Plating on Alumina Ceramics(I) on Empirical Deposition Rate in Electroless Nickel Plating (알루미나 세라믹스 표면에 무전해 환원 니켈막의 형성에 관한 연구(I) 무전해 니켈도금의 실험적 석출속도에 관한 연구)

  • Kim, Yong-Dai;Lee, Joon
    • Journal of Surface Science and Engineering
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    • v.19 no.3
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    • pp.109-120
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    • 1986
  • The electroless nickel plating on high alumina ceramics was performed in the bath containing nickel chloride, sodium hypophosphite and mono- or bi-carboxylic acid as a complexing agent in order to examine the empirical rate law as well as the effects of the complexing agent, plating temperature and pH on the rate of deposition. Adding the carboxylic acid to the plating bath, the rate of deposition was increased considerably, and each of the complexing agents showed a maximum deposition rate plateau around a particular concentration of the complexing agent. The rate of deposition was increased with increasing either temperature or pH, but microstructure of the surface became more rough. Furthermore, empirical rate law of the elecltroless nickel deposition on high alumina ceramics was discussed with the activation energy and other rate parameters calculated.

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Effects of Multi-Complex Agent Addition on Characteristics of Electroless Ni-P Solution (복합 착화제 첨가가 무전해 Ni-P 도금액의 특성에 미치는 영향)

  • Lee, Hong-Kee;Lee, Ho-Nyun;Jeon, Jun-Mi;Hur, Jin-Young
    • Journal of Surface Science and Engineering
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    • v.43 no.2
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    • pp.111-120
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    • 2010
  • In this study, the effects of multi-complex agents addition on characteristics of electroless Ni plating solution are investigated. The species and the concentration of complexing agents are major factors to control the deposition rate, P concentration, and surface morphology of plating films. Adipic acid increases the deposition rate in regardless of single- or mutli-complex agent addition. However, lactic acid effectively increases the deposition rate in case of multi-addition as the complex agents with adipic or sodium succinate acid. In addition, sodium citric acid and malic acid show good stabilizing effects of plating solution and lowering the deposition rate, because they have high complexibility. Therefore, it is suggested that the development of Ni-P plating solution suitable for diverse usages can be carried out systematically using the database from this study.

A Study on Reusing of Electroless Ni-Cu-P Waste Solution (無電解 Ni-Cu-P 廢 도금액의 재사용에 관한 연구)

  • 오이식
    • Resources Recycling
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    • v.10 no.2
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    • pp.27-33
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    • 2001
  • Reusing of electroless Ni-Cu-P waste solution was investigated in the plating time, plating rate, solution composion and deposit. Plating time of nickel-catalytic surface took longer than that of zincated-catalytic surface. Initial solution with 50f) waste solution additive at batch type was possible to reusing of waste solution. Plating time of initial solution at continuous type took longer 10 times over than that of batch type. Plating time of 50% waste solution additive at continuous type took longer 3.7 times over than that of batch type. Component change of nickel-copper for electroless deposition was greatly affected by depolited inferiority and larger decreased plating rate.

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A Study on Reusing of Electroless Ni-Cu-B Waste Solution (무전해 Ni-Cu-B 폐 도금액의 재사용에 관한 연구)

  • Oh Iee-Sik;Bai Young-Han
    • Resources Recycling
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    • v.12 no.1
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    • pp.18-24
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    • 2003
  • Reusing of electroless Ni-Cu-B waste solution was investigated in the plating time, plating rate, solution composition and deposit. Plating time of nickel-catalytic surface took longer than that of zincated-catalytic surface. Initial solution with 40% waste solution additive at batch type was possible to reusing of waste solution. Plating time of initial solution at continuous type took longer 6 times over than that of batch type. Plating time of 40% waste solution additive at continuous type took longer 2 times over than that of batch type. Component change of nickel-copper for electroless deposition was greatly affected by deposited inferiority and larger decreased plating rate.

A Study on Composite Electroless Nikel Plating with Ceramic Dispersive (비금속 분체를 이용한 무전해 니켈 복합도금에 관한 연구)

  • 김용규;박수훈
    • Journal of Surface Science and Engineering
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    • v.22 no.1
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    • pp.43-51
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    • 1989
  • The characteristion of composite electroless Nikel palting on the condition of adding 3kinds ceramic dispersives, Al2O3, Si3O4 and artificial diamond powder were studied. Decreasing solution temperature for composite plating was required to depress the spontaneous decomposition caused by dispersive including enlargement of reaction surface. The rate of composite plating was faster than that of general electroless-Nickel plating without dispersive. this increasing tendency of plating rate was remarkable for the active catalysis, like diamond powder.

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Drying Characteristics of Plating Sludge by Microwave (마이크로파 가열에 의한 도금슬러지 건조특성)

  • 문경환;손종렬;김덕찬
    • Journal of environmental and Sanitary engineering
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    • v.13 no.1
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    • pp.9-15
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    • 1998
  • Microwave heating and drying processes have been well established in various industrial applications. Feasibilities of successful application of microwave drying to many material have been shown on the laboratory or pilot-plant scale. The microwave drying behavior of plating sludge are considered in this paper. The plating sludge containing 70%, 80% and 90% water exposed to microwave power at 2,450 MHz, 700W. An experimental microwave drying apparatus was designed and constructed to monitor weight loss during drying. By studying the drying characteristic curve, the moisture in sludge was almost classified into two categories : free moisture and intestinal moisture. And the critical moisture contents at which the drying rate ceases to be constant were from 10.1 to 10.5%. A simple drying model is proposed which may be used to describe drying behavior of plating sludge. The constant rate and the falling rate periods in microwave drying were addressed separately. From the eqation of constant rate period the drying rate constants decreased exponentially with increasing depth. Microwave heating compared with conventional heating offered higher heating rates from 9 to 16 times. Therefore, microwave drying process can be effective in removing moisture from plating sludge.

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Effects of Surfactants on Electroless Copper Planting Bath for PCB (PCB제조용 무전해 동도금액에 대한 계면활성제의 영향)

  • 이홍기;심미자;김상욱;여운관;이주성
    • Journal of Surface Science and Engineering
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    • v.26 no.5
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    • pp.263-270
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    • 1993
  • The effects of surfactants on electorless copper plating bath for PCB was studied. Basic bath composition was cuplic sulfate 10g/l, EDTA.2Na 40 g/l, formalin$ 3m\ell$/l and sodium hydroxide solution for pH adjust. After addition of accelerators, stabilizers and surfactants, the polarization curves in plating bath were carried out for presumption of the plating rate. From the plating rate in bath with the various concentration of additives, the optimum condition for manufacturing the electroless copper plating bath was confirmed. It was found that the addition of $\alpha$.$\alpha$'-dipyridyl, pyridine and polyxyethylene octylphenylether was good as stabilizer, accelerator and surfactants, respectively. With this additives, the maximum plating rate of $12\mu\textrm{m}$/h at $65^{\circ}C$ and $2\mu\textrm{m}$/h at $25^{\circ}C$ was obtained.

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