• Title/Summary/Keyword: Plating equipment

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CNT-Ni-Fabric Flexible Substrate with High Mechanical and Electrical Properties for Next-generation Wearable Devices (차세대 웨어러블 디바이스를 위한 높은 기계적/전기적 특성을 갖는 CNT-Ni-Fabric 유연기판)

  • Kim, Hyung Gu;Rho, Ho Kyun;Cha, Anna;Lee, Min Jung;Ha, Jun-Seok
    • Journal of the Microelectronics and Packaging Society
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    • v.27 no.2
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    • pp.39-44
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    • 2020
  • Recently, numerous researches are being conducted in flexible substrate to apply to wearable devices. Particularly, Conductive substrate researches that can implement the wearable devices on clothing are massive. In this study, we formed fiber substrate spraying CNT and Pd mixed solution on it and plated metal layer with electroless plating. Used SEM equipment and EDS analysis to analysis structure of the plated fiber substrate and discovered Ni layer was created. For check electrical properties, mapping was performed to check surface resistance and distribution of resistance of electroless plated fiber substrate with 4-point probe. It was confirmed that conductivity was improved as the duration of electroless plating was increased, and it was found that distribution of resistance by surface location was uniform. Changes in resistance due to mechanical stress were measured through tensile, bending, and twisting tests. As a result, it was confirmed that resistance change of flexible substrate gradually disappeared as plating time increased. Using UTM (Universal testing machine), it was analyzed mechanical properties of the electroless plated substrate with respect to changes in plating time were improved. In the case of conductive fiber substrate in which electroless plating was performed for 2 hours, tensile strength was increased by 16 MPa than fiber substrate. Based on these results, we found that Ni-CNT-Fabric flexible substrate is adequate for clothing-intergrated conductive substrate and we positively expect that this experiment shows flexible substrate can adapt to and develop not only a wearable device technology but also other fields needing flexibility such as battery, catalyst and solar cell.

Practical Application of Lead-free Solder in Electronic Products

  • Cho Il-Je;Chae Kyu-Sang;Min Jae-Sang;Kim Ik-Joo
    • Proceedings of the International Microelectronics And Packaging Society Conference
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    • 2004.09a
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    • pp.93-99
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    • 2004
  • At present, LG Electronics pushes ahead to eliminate the Pb(Lead) -a hazardous material- from all products. Especially, we have performed to select the optimum standard composition of lead free alloy for the application to products for about 3 years from 2000. These days, we have the chance for applying to the mass-production. This project constructed the system for applying the lead free solders on consumer electronic products, which is one of the major products of the LG Electronics. To select the lead free solders with corresponding to the product features, we have passed through the test and applied with Sn-3.0Ag-0.5Cu alloy system to our products, and for the application to the high melting temperature composition, we secured the thermal resistance of the many parts and substrate and optimized the processing conditions. We have operated the temperature cycling test and the high temperature storage test under the standards to confirm the reliability of the products. On these samples, we considered the consequence of our decision by the operating test. For the long life time of the product, we have operated the temperature cycling test at $-45^{\circ}C-+125^{\circ}C$, 1 cycle/hour, 1000 cycles. Also we have tested the tin whisker growth about lead free plating on lead finish. We have analyzed with the SEM, EDS and any other equipment for confirming the failure mode at the joint and the tin whisker growth on lead free finish.

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Inactivation of Legionella pneumophila by Electrochemical Disinfection (전기화학적 소독에 의한 Legionella pneumophila 불활성화)

  • Park, Young-Seek;Kim, Dong-Seog
    • Journal of Korean Society on Water Environment
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    • v.23 no.5
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    • pp.613-619
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    • 2007
  • This study has carried out a performance of dimensionally stable anode for the purpose of disinfection of Legionella pneumophila in water. Three kinds of electrode were prepared by plating and thermal deposition, which were coated by the oxides of Pt, Ru and Ir on Ti metal surface, respectively. The order of disinfection performance for Legionella pneumophila was Ru/Ti > Ir/Ti > Pt/Ti. Free Cl and $ClO_2$ generation of Ir/Ti electrode was higher than that of two electrodes. However, the concentrations of generated $H_2O_2$ and $O_3$ of the Ru/Ti electrode were highest among the three electrodes. The higher NaCl concentration was, the more oxidants was generated and disinfection effect was increased. However, optimum NaCl dosage was 0.0125% due to the regulation on the conductivity and $Cl^-$ concentration for the cooling water quality of air conditioning and refrigeration equipment. With the increase of current, oxidants was more generated and following disinfection effect was increased. The increase of electrode distance reduced oxidants generation due to the low electric power, and their disinfection effect was decreased accordingly.

Corrosion Analysis of Materials by High Temperature and Zn Fume (고온 및 Zn Fume에 의한 소재들의 부식성 분석)

  • Baek, Min Sook
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.19 no.5
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    • pp.551-556
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    • 2018
  • The material normally used in hot dip galvanizing facilities is SM45C (carbon steel for mechanical structure, KS standard), mainly because of its price. During this process, the oxidation of the plating facility occurs due to the heat of the Zn fumes coming from the molten zinc. Since the cycle time of the current facilities is 6 months, much time and money are wasted. In this study, the corrosive properties of various materials (Inconel625, STS304, SM45C) were investigated by oxidation in a high temperature and Zn fumes environment. The possibility of applying the hot-dip galvanizing equipment was investigated for each material. The Zn fumes were generated by directly bubbling Ar gas into Zn molten metal in a 650 degree furnace. High-temperature, Zn fumes corrosion was conducted for 30 days. The sample was removed after 30 days and the oxidation of the surface was confirmed with EDS and SEM, and the corrosion properties were examined using potentiodynamic polarization tests.

Practical Application of Sn-3.0Ag-0.5Cu Lead Free Solder in Electronic Production

  • Chae Kyu-Sang;Min Jae-Sang;Kim Ik-Joo;Cho Il-Je
    • Journal of the Microelectronics and Packaging Society
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    • v.12 no.1 s.34
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    • pp.65-71
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    • 2005
  • At present, Electronic industries push ahead to eliminate the Pb(Lead) -a hazardous material-from all products. Especially, we have performed to select the optimum standard composition of lead free alloy for the application to products for about 3 years from 2000. These days, we have the chance for applying to the mass-production. This project constructed the system for applying the lead free solders on consumer electronic products, which is one of the major products of the LG Electronics. To select the lead free solders with corresponding to the product features, we have passed through the test and applied with Sn-3.0Ag-0.5Cu alloy system to our products, and for the application to the high melting temperature composition, we secured the thermal resistance of the many parts and substrate and optimized the processing conditions. We have operated the temperature cycling test and the high temperature storage test under the standards to confirm the reliability of the products. On these samples, we considered the consequence of our decision by the operating test. For the long life time of the product, we have operated the temperature cycling test at $-45^{\circ}C\;-\;+125^{\circ}C$, 1 cycle/hour, 1000 cycles. Also we have tested the tin whisker growth about lead free plating on lead finish. We have analyzed with the SEM, EDS and any other equipment for confirming the failure mode at the joint and the tin whisker growth on lead free finish.

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Adhesive Behaviors of the Aluminum Alloy-Based CrN and TiN Coating Films for Ocean Plant

  • Murakami, Ri-Ichi;Yahya, Syed Qamma Bin
    • International Journal of Ocean System Engineering
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    • v.2 no.2
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    • pp.106-115
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    • 2012
  • In the present study, TiN and CrN films were coated by arc ion plating equipment onto aluminum alloy substrate, A2024. The film thickness was about 4.65 ${\mu}m$. TiN and CrN films were analyzed by X-ray diffraction and energy dispersive X-ray equipments. The Young's modulus and the micro-Vickers hardness of aluminum substrate were modified by the ceramic film coatings. The difference in Young's modulus between substrate and coating film would affect on the wear resistance. The critical load, Lc, was 75.8 N for TiN and 85.5 N for CrN. It indicated from the observation of optical micrographs for TiN and CrN films that lots of cracks widely propagated toward the both sides of scratch track in the early stage of MODE I. TiN film began to delaminate completely at MODE II stage. The substrate was finally glittered at MODE III stage. For CrN film, a few crack can be observed at MODE I stage. The delamination of film was not still occurred at MODE II and then was happened at MODE III. This agrees with critical load measurement which the adhesive strength was greater for CrN film than for TiN film. Consequently, it was difficult for CrN to delaminate because the adhesive strength was excellent against Al substrate. The wear process, which the film adheres and the ball transfers, could be enhanced because of the increase in loading. The wear weight of ball was less for CrN than for TiN. This means that the wear damage of ball was greater for TiN than for CrN film. It is also obvious that it was difficult to delaminate because the CrN coating film has high toughness. The coefficient of friction was less for CrN coating film than for TiN film.

Analysis of Commercial Recycling Technology and Research Trend for Waste Cu Scrap in Korea (국내 구리 함유 폐자원의 재활용 상용화 기술 및 연구동향 분석)

  • Kang, Leeseung;An, HyeLan;Kang, Hong-Yoon;Lee, Chan Gi
    • Resources Recycling
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    • v.28 no.1
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    • pp.3-14
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    • 2019
  • Copper is used in many electronic components and construction parts due to its excellent electrical conductivity and heat transfer characteristics, and also used for pre-plating for double layer coating such as nickel, so that copper is an essential material in modern industry. Despite the expected increase of usage and importance on wiring, sensors and data equipment in the next generation industries, it is hard for securing stable copper supply and resource management resulting from the copper prices are fluctuating owing to the economic crisis in Europe, the low economic growth trend in China, and President Trump's commitment to public industrial facilities investment in U.S.. Since most of the domestic copper consumption is used by electrolytic copper cathode, we studied not only copper recycling technology which is being commercialized but also current research trend under the research stage. This study aims to examine the characteristics of each process and the areas where future recycling technology development is required.

Analysis and Improvement Specific Frequency Reception Noise Phenomena Due to RF Radiation Signal (RF 방사 신호로 인한 특정 주파수 수신 잡음 현상의 원인분석 및 개선)

  • Kwon, Jung-Hyuk;Kim, Jong-Min;Lee, Wang-Sang
    • Journal of Aerospace System Engineering
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    • v.16 no.3
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    • pp.73-83
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    • 2022
  • The purpose of this paper was to identify a method to improve received noise in a specific frequency band, caused by RF radiation signals during aircraft operation. The communication equipment of the aircraft is critical to the performance and safety of the flight mission, as it is responsible for the function of internal and external communications. Noise-free, clean communication quality, as well as transmission and receiving functions have to be implemented. Thus, the cause analysis of the reception noise in a specific frequency band, was analyzed through trouble shooting. The receiving noise due to the RF radiation signal emitted from the subsystem unit inside the aircraft, was improved by shielding with a CAP with electroless nickel plating applied. Additionally, the measurement and verification results of the improvement method are also described.

A Comparative Analysis of the Level of Occupational Health : Before and After the Subsidiary Program on Health Care Management of Small Scale Industries (영세사업장 보건관리 지원사업 실시 전후의 산업보건수준 비교 분석)

  • Jung, Hye Sun
    • Korean Journal of Occupational Health Nursing
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    • v.4
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    • pp.58-83
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    • 1995
  • The small scale industries which have less than 30 employees occupy 86.5% of total number of industries in Korea. And though they have higher accident rate and lower environmental condition than big industries, it has been not mandatory to appointing health care manager at factory. So, from 1993, government subsidizes to the health care management of small industries. The purpose of this study is to identify the real feature of health care status in small industries, and to evaluate the level of health care management, before and after the subsidiary program. 65 small plating industries which have been managed by the same health care management support institution in 1993 were selected for study. Of the 65 industries, 3 which have not taken both environmental evaluation and health screening in 1994, and 9 which have closed were excluded from study sample. And the remaining 53 were analyzed by using the results of environmental evaluation and health screening, reported to the Ministry of Labor, before and after the subsidiary program, the analysis was done by the comparison of the two year paired data of the same industry. Over-permissible-limit rate, health screening implementation rate, above grade C rate were calculated and compared. The status of health care management ; 1. Of the sample industries, 96.9% provide protective equipment and 80.0% set up ventilating system. Protective gloves (89.2%) and protective clothing (80.0%) are widely provided, but ear plugs (4.6%) are rarely provided. 21.5% of the protective equipment are well put on, and 40.4% of the ventilating systems function well. 2. In 1993, 35 industries, 53.8% of the sample, checked working environment twice. Over-permissible-limit rates of heavy metal (12.2%), suspended particle (11.1%), noise (5.5%) were high. To put on protective equipment and to set up local ventilating system were pointed out by the examiners. 3. General health screening was done at 63.1% of the sample industries and 35.3% of total workers were examined. Specific health screening was done at 93.8% of the sample industries and 75.4% of workers were examined. 15.5% of workers was provided to be above grade C and to have digestive system disease (43.3%), circulatory disease (18.9%), and hematopoietic disease (14.2%), etc. 4. In 1993, the subsidiary program of health care management was provided in forms of health education, health counseling, and rounding check of working field. And 61.5%, 83.0%, 55.4% of sample industries respectively received it. The average visit per industry was 1.8. Comparisons of the level of occupational health before and after the subsidiary program ; 1. Over-permissible-limit rates of hazardous factors of 1993 and that of 1994 were compared. The rates of suspended particle, noise, organic solvent of 1994 (37.5%, 13.4%, 24.2% respectively) were higher than that of 1993 (25.0%, 6.0%, 6.3% respectively). In the case of acid, there was no difference between the rate of 1993 and that of 1994. Only the rate of heavy metal decreased from 12.9% in 1993 to 3.0% in 1994. 2. General health screening was done at 38.7% of the sample industries in 1993 and at 44.6% in 1994. But the implementation rate of specific health screening decreased from 72.4% in 1993 to 64.6% in 1994. 3. The implementation rate of specific health screening was analyzed by some health factors. The rate of suspended particle increased from 61.8% in 1993 to 91.2% in 1994. But the rates of the others-noise, organic solvent, heavy metal, specific chemical substances-decreased. 4. Above grade C rate in health screening increased from 27.8% in 1993 to 35.5% in 1994. But that of endocrine disorders and pulmonary disease decreased.

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