• Journal of the Korean institute of surface engineering
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• v.36 no.3
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• pp.256-262
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• 2003

The current efficiency and the composition of Zn-Cr and Zn-Cr-X (X : Co, Mn) alloy electrodeposits were investigated by using chloride bath with EDTA auditive and flow cell plating system. The current efficiency of Zn-Cr alloy decreased with increasing current density, while it increased with the content of Co and Mn of the Zn-Cr-X alloy bath in high current density region. The Cr content in Zn-Cr alloy increased from 1.4-2.7 to $28wt\%$ with increasing current density and the phase structure of the alloys changed from $\eta-Zn$ through $\eta-Zn+\gamma'-ZnCr\;to\;\gamma'-ZnCr$ with Increasing Cr content of the alloys. The Co content in Zn-Cr-Co alloys increased with Co content of the bath, while Cr content of the alloy increased or decreased in low current density region $(10-75A/dm^2)$ or high current density region $(75-100A/dm^2)$, respectively. $\gamma-ZnCo$ phase was formed in the Zn-Cr-Co alloy with above $9.0wt\%$ Co. The content of Mn and Cr in Zn-Cr-Mn alloys increased or decreased with the increase of current density in high current density region, respectively while Cr content of the alloy decreased noticeably with the increase of Mn content in the bath. Two phases of $\delta_1-ZnMn$ and $\gamma'-ZnCr$ were formed in the Zn-Cr-Mn alloy with above $8.6wt\%$ Mn.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.20 no.9
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• pp.749-755
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• 2007

Recently, novel MEMS probe cards can support reliable wafer level chip test with high density probing capacity. However, manufacturing cost and process complexity are crucial weak points for low cost mass production. To overcome these limitations, we have developed micro spring structured MEMS probe card. For fabrication of micro spring module, a wire bonder and electrolytic polished gold wires are used. In this case, stringent tension force control is essential to guarantee the low level contact resistance of micro spring for reliable probing performance. For this, relation between tension force of fabricated probe card and contact resistance is characterized. Compare to conventional probe cards, developed MEMS probe card requires fewer fabrication steps and it can be manufactured with lower cost than other MEMS probe cards. Also, due to the small contact scratch patterns, we expect that it can be applied to bumping types chip test which require higher probing density.

• Journal of Korean Society on Water Environment
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• v.23 no.3
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• pp.377-384
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• 2007

This study has carried out a performance of dimensionally stable anode for the purpose of decolorization of Rhodamine B (RhB) in water. Seven kinds of 1, 2 and 3 component electrodes were prepared by plating and thermal deposition, which were coated by the oxides of Pt, Ru, Ir, Sn-Sb, Ir-Sn-Sb, Ru-Sn-Sb and Ru-Sn-Ti on Ti metal surface, respectively. Performance for RhB decolorization of the seven electrodes lay in: Ru-Sn-Ti/Ti ${\fallingdotseq}$ Ru-Sn-Sb/Ti > Ir-Sn-Sb/Ti > Sn-Sb/Ti > Ru/Ti > Ir/Ti > Pt/Ti. The effects of electrode area and distance, electrolyte type and concentration, current density and pH were investigated on the decolorization of RhB using Ru-Sn-Ti/Ti electrode. Decolorization of RhB was not influenced by electrode area and distance largely, however wattage was influenced by them. NaCl was superior to the decolorization of RhB than $Na_2SO_4$. Optimum NaCl dosage and current density were 0.5 g/L and $0.183A/cm^2$, respectively. The pH effect of decolorization of RhB was not significant within the range of 3-7.

• Applied Chemistry for Engineering
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• v.24 no.4
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• pp.438-442
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• 2013

In the present work, electroless plating was used for coating thin films consisting mainly of Ni and P on carbon fiber. Structural changes appeared upon the post-annealing at various temperatures of the Ni-P film on carbon fiber was studied using various analysis methods. Scanning, a flat surface structure of Ni-P film on carbon fiber was found after electroless plating of Ni-P film on carbon fiber without post-annealing, whereas annealing at $350^{\circ}C$ resulted the formation of porous structures. With increasing the annealing temperature to $650^{\circ}C$ with an interval of $50^{\circ}C$, the pore size increased, but the density decreased. X-ray diffraction (XRD) showed the existence of metallic Ni, and Ni-P compounds before post-annealing, whereas the post-annealing resulted in the appearance of NiO peaks, and the decrease in the intensity of the peak of metallic Ni. Using X-ray photoelectron spectroscopy (XPS), phosphorous oxides were detected on the surface upon annealing at $650^{\circ}C$, and $700^{\circ}C$, which can be attributed to the phosphorous compounds originally existing in the deeper layers of the Ni films, which undergo sublimation and escape from the film upon annealing. Escape of phosphorous species from the bulk of Ni-P film upon annealing could leave a porous structure in the Ni films. Porous materials can be of potential applications in diverse fields due to their interesting physical properties such as high surface area, and methods for fabricating porous Ni films introduced here could be easily applied to a large-scale production, and therefore applicable in diverse fields such as environmental filters.

• Corrosion Science and Technology
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• v.11 no.6
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• pp.275-279
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• 2012

Ni-W alloy deposits have lately attracted the interest as an alternative surface treatment method for hard chromium electrodeposits because of higher wear resistance, hardness at high temperature, and corrosion resistance. This study deals with influences of process variables, such as electodeposition current density, plating temperature and pH, on the internal stress of Ni-W nanocrystalline deposits. The internal stress was increased with increasing the applied current density. With increasing applied current density, the grain size of the deposit decreases and concentration of hydrogen in the deposit increases. The subsequent release of the hydrogen results in shrinkage of the deposit and the introduction of tensile stress in the deposit. Consequently, for layers deposited at high current density, cracking occurs readily owing to high tensile stress value. By increasing the temperature of the electrodeposition from $60^{\circ}C$ to $80^{\circ}C$, the internal stress was decreased. It seems that an increase in the number of active ions overcoming the activation energy at elevated temperature caused a decline in the concentration polarization and surface diffusion. It decreased the level of hydrogen absorption due to the lessened hydrogen evolution reaction. Therefore, the lower level of hydrogen absorption degenerated the hydride on the surface of the electrode, resulting in the reduction of the internal stress of the deposits. By increasing the pH of the electrodeposition from 5.6 to 6.8, the internal stress in the deposits were slightly decreased. It is considered that the decrease in internal stess of deposits was due to supply of W complex compound in cathode surface, and hydrogen ion resulted from decrease of activity.

• Korean Journal of Materials Research
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• v.19 no.3
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• pp.151-155
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• 2009

Micro-scale copper bumps for build-up PCB were electroplated using a pulse-reverse method. The effects of the current density, pulse-reverse ratio and brightener concentration of the electroplating process were investigated and optimized for suitable performance. The electroplated micro-bumps were characterized using various analytical tools, including an optical microscope, a scanning electron microscope and an atomic force microscope. Surface analysis results showed that the electroplating uniformity was viable in a current density range of 1.4-3.0 A/$dm^2$ at a pulse-reverse ratio of 1. To investigate the brightener concentration on the electroplating properties, the current density value was fixed at 3.0 A/$dm^2$ as a dense microstructure was achieved at this current density. The brightener concentration was varied from 0.05 to 0.3 ml/L to study the effect of the concentration. The optimum concentration for micro-bump electroplating was found to be 0.05 ml/L based on the examination of the electroplating properties of the bump shape, roughness and grain size.

• Development and Reproduction
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• v.12 no.1
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• pp.51-56
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• 2008

To optimize the cell culture conditions of zebrafish embryonic cells, we compared the efficiency of three types of medium, DMEM, K-NAC and D-NAC. In this study, we showed that the cells grown in K-NAC have better plating efficiency than DMEM, especially in the case of low cell seeding density. However, cells grew slower in K-NAC than those in DMEM in confluent cultures. The effect of 0.1% zebrafish embryo extracts was minimal. The presence of 1% trout serum in culture medium significantly increased the growth rate of cells(p<0.05). No difference was found at $2{\sim}3{\times}10^5$ cell seeding density(p<0.05). At $4{\sim}5{\times}10^5$ cell seeding density, cells grew better in DMEM than K-NAC (p<0.1). The results suggest that supplementation of NAC and A2P in Keratinocyte SFM may improves plating efficiency when cells are plated at low population. No difference was found for cell growth in either medium with 5%, 10% or 15% FBS supplemented (p<0.05). Cells culture in D-NAC grew significantly better than those in DMEM(p<0.05). Our results clearly showed that the use of NAC and A2P in the culture medium has a positive effect on cell growth regardless of the amount of FBS added.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.23 no.12
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• pp.919-923
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• 2010

Copper pillar tin bump (CPTB) was developed for high density chip interconnect technology. Copper pillar tin bumps that have $100{\mu}m$ pitch were introduced with fabrication process using a KM -1250 dry film photoresist (DFR), copper electroplating method and Sn electro-less plating method. Mechanical shear strength measurements were introduced to characterize the bonding process as a function of thermo-compression. Shear strength has maximum value with $330^{\circ}C$ and 500 N thenno-compression process. Through the simulation work, it was proved that when the copper pillar tin bump decreased in its size, it was largely affected by the copper oxidation.

• Journal of the Korean institute of surface engineering
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• v.15 no.1
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• pp.11-18
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• 1982

80% Ni-Permalloy is soft magnetic material with high initial permeability and low magnetic coercive force Hc, and is used to computer memory cores and minirelays of communication e-ngineering. In this paper 80 Permalloy thin film on copper cathode was alloy-deposited from Watts so-lution contatining FeSO4$.$7H2O. The amount of FeSO4$.$7H2O in the solution, pH, temperature of the solution and plating current density were varied as parameters and the resulting comp-osition changes of deposited film were analyzed electrochemically with respect to the parame-ters. From the above procedure electroplating conditions for deposition of 80 Permalloy were est-ablished as following: 17-21 g/$\ell$ of FeSO4$.$7H2O in Watts solution, current density 1.0-2.0 Amp/dm2, pH 2.5-3.0 and temperature range of 50-60$^{\circ}C$.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2017.05a
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• pp.148-148
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• 2017

Surface modification is a type of mechanical manipulation skills to achieve extensive aims including corrosion control, exterior appearance, abrasion resistance, electrical insulation and electrical conductivity of substrate materials by generating a protective surface using electrical, physical and chemical treatment on the surface of parts made from metallic materials. Such surface modification includes plating, anodizing, chemical conversion treatment, painting, lining, coating and surface hardening; this study conducted cavitation experiment to assess improvement of durability using anodizing. In order to observe surface characteristics with applied current density, the electrolyte temperature, concentration was maintained at constant condition. To prevent hindrance of stable growth of oxide layer due to local temperature increase during the experiment, stirring was maintained at constant speed. In addition, using galvanostatic method, it was maintained at processing time of 40minutes for 10 to $30mA/cm^2$. The cavitation experiment was carried out with an ultra sonic vibratory apparatus using piezo-electric effect with modified ASTM-G32. The peak-to-peak amplitude was $30{\mu}m$ and the distance between the horn tip and specimen was 1mm. The specimen after the experiment was cleaned in an ultrasonic bath, dried in a vacuum oven for more than 24 hours, and weighed with an electric balance. The surface damage morphology was observed with 3D analysis microscope. As a result of the study, differences were observed surface hardness and anti-cavitation characteristics depending on the development of oxide film with the anodizing process time.