• 폴리머
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• 제25권2호
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• pp.302-310
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• 2001

무전해도금법을 이용하여 구리/PET 필름 복합재료를 제조하였으며 에칭방법과 촉매액의 조성 및 acceleration 방법을 달리하여 PET 필름과 무전해도금된 구리 피막간의 접착력을 향상시키고자 하였다. HCl 용액으로 에칭된 PET 필름은 NaOH에 의한 것보다 더욱 세밀하게 에칭되어져 구리와 PET 필름간의 접착력은 향상되었으나 전자파 차폐효과는 유사한 경향을 보였다. 촉매액의 조성변화에 따른 영향을 살펴본 결과 PdCl$_2$:SnCl$_2$의 몰비가 1:4에서 1:16으로 증가할수록 PET 필름 위에 적층된 Pd/Sn 콜로이드 입자들의 크기가 감소하며 고르게 분포되는 경향을 보였다. 따라서 이들의 몰비가 증가할수록 구리도금이 균일하고 조밀하게 이루어져 접착력 및 차폐효과가 증가하였다. 또한 NaOH보다 HCl로 acceleration한 경우 촉매 입자의 크기가 작고 더 균일하게 분포되어 우수한 접착력과 도금물성을 나타내었다.

• 한국표면공학회지
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• 제32권6호
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• pp.709-716
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• 1999

Ceramic is select for an alternative substrate material for high-speed circuits due to its low-thermal expansion. As, in this study, ceramic was prepared by ISG (interlayer sol-gel) process using metal salts and a metal alkoxide as the starting materials. Generally ceramic substrate is used electroless copper plating for the metallization. But it has been indicate weakely the adhesion strength between the substrate and copper layer. Therefore, this research, using the ISG process on the preparation of homogeneous and possible preparation at law temperature fabricated sol solution. Using of the dip coating method was coated for the purpose of giving the anchoring effect on the coating layer and enhancing the adhesion strength between the $Al_2$O$_3$ substrate and copper layer. This study examined primary the characteristic of the sol making condition and differential thermal analysis (DTA) X-ray diffraction (XRD) were mearsured to identify the crystal phase of heat treatment specimens. The morphology of the coated films were studied by scanning electron microscopy(SEM). As a resurt, XRD analysis was obtained patterns of $\alpha$-cordierite after heat-treatment about 2 hours at $1000^{\circ}C$. SEM analysis could have seen a large number of voids on coated film. The more contants of$ Al_2$$O_3$ Wt% was increased the more voids was advanced. Peel adhesion strength has a maximum in the contants of the TEOS:ANE of 1:0.7 mole%. In this case, adhesion strength has been measured 1150gf, peel adhesion strength were about 10 times more than uncoated of the ceramics film.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2003년도 추계학술발표회초록집
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• pp.96-97
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• 2003

• Journal of Welding and Joining
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• 제19권5호
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• pp.520-525
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• 2001

The Sn-Pb eutectic solder bump formation ($150\mu\textrm{m}$ diameter, $250\mu\textrm{m}$ pitch) by electroplating was studied for flip chip package fabrication. The effect of current density and plating time on Sn-Pb deposit was investigated. The morphology and composition of plated solder surface was examined by scanning electron microscopy. The plating thickness increased wish increasing time. The plating rate became constant at limiting current density. After the characteristics of Sn-Pb plating were investigated, Sn-Pb solder bumps were fabricated in optimal condition of $7A/dm^$. 4hr. Ball shear test after reflow was performed to measure adhesion strength between solder bump and UBM (Under Bump Metallurgy). The shear strength of Sn-Pb bump after reflow was higher than that of before reflow.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2005년도 International Meeting on Information Displayvol.II
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• pp.1459-1461
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• 2005

Carbon nanotube -copper composite structures were fabricated using composite plating method and their field emission characteristics were investigated. Multi-walled carbon nanotubes synthesized by chemical vapor deposition were used in the present study. It was revealed that turn-on field of the structures was about 3.0 $V/{\mu}m$ at the current density of 0.1 ${\mu}A/cm^2$. We observed relatively uniform emission characteristics as well as stable emission currents. CNT-Cu composite plating method is efficient and it has no intrinsic limit on the plating area. Moreover, it gives strong adhesion between emitters and an electrode. The refore, we expect that CNT-Cu composite plating method can be applied to fabricate electron field emitters for large area FEDs and large area vacuum lighting sources.

• 한국표면공학회지
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• 제24권2호
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• pp.73-79
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• 1991

Recent studies son surface coatings have shown that the change of physical, chemical and crystallographic structure analysed and observed according to the deposition process variables has the effects on the resultant film properties. Under the same preparation condition conditions of the substrate and process variables, physical morphology variations characterized by substrate temperature and bias which offect the surface mobility of adatom and adhesion variations related to the formation of Ti interlayer were considered in the present study. Microhardness showed the highest value around 40$0^{\circ}C$ of the substrate temperature and increased with the substrate bias. Adhesion was improved with the increase of substrate temperature and bias. An interlayer of pure titanium formed prior to deposition of TiN improves the adhesion at its optimum thickness. These results were explained by the change of physical morphology and phase analysis.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2007년도 추계학술대회 논문집
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• pp.140-141
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• 2007

The arc ion plating (AIP) technique has been used widely for thin coating in the area of surface engineering. The TiN coating is important in the field of dies, cutting tools and other mechanical parts. When forming the TiN films by AIP technique, the processing parameters such as arc power, bias voltage, working pressure, temperature of substrate and pre-treatment affected the adhesion respectively. The results of scratch test revealed that the adhesion strength was influenced by arc power most strongly. And a sequence of the importance of each parameters has been obtained. The crystal structure and cross-section of TiN films are also be investigated.

• 한국산학기술학회논문지
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• 제5권5호
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• pp.433-437
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• 2004

The MmSH is a process of injecting ABS to produce innovated physical properties compared to the conventional injection process. Physical properties such as thickness and adhesion strength of Ni plate electrolessly coated on a conventional and a MmSH injected ABS have been studied in the pH range 4~8. Thickness of the plate on the MmSH and the conventionally injected ABS appeared to be directly proportional to pH. The ABS processed by the conventional injection showed adhesion strength corresponded to ASTM 4B above pH 5. On the other hand, the ABS processed by the MmSH injection showed a superior adhesion strength corresponded to ASTM 5B above pH 6. It was calculated the shielding effectiveness of above 50 dB in all conditions.

• 한국표면공학회지
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• 제49권5호
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• pp.401-407
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• 2016

In this work, effect of zincate treatment of AZ91 Mg alloy on the following electrodeposition of copper was examined in a non-cyanide bath containing pyrophosphate ions in view of surface morphology and adhesion of the electrodeposited copper layer. Without zincate treatment, the electrodeposited copper layer showed very porous structure and poor adhesion. On the other hand, the copper layer electrodeposited on the zincate-treated surface showed dense structure and good adhesion. The dissolution rate of AZ91 Mg alloy after the zincate treatment appeared to decrease about 40 times in the copper pyrophosphate bath, as compared to that of the surface without zincate treatment. The porous morphology and poor adhesion of a copper layer on the AZ91 Mg alloy surface without zincate treatment were attributed to small number of nucleation sites of copper because of rapid dissolution of the magnesium substrate in the pyrophosphate bath. Based on the experimental results, it is concluded that the zincate treatment to form a conducting and protecting layer on the AZ91 Mg alloy surface is essential for successful electrodeposition of a copper layer on AZ91 Mg alloy with good adhesion and dense structure in the copper pyrophosphate bath.

• 한국태양에너지학회:학술대회논문집
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• 한국태양에너지학회 2009년도 춘계학술발표대회 논문집
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• pp.214-219
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• 2009

In high-efficiency crystalline silicon solar cells, If high-efficiency solar cells are to be commercialized. It is need to develop superior contact formation method and material that can be inexpensive and simple without degradation of the solar cells ability. For reason of plated metallic contact is not only high metallic purity but also inexpensive manufacture. It is available to apply mass production. Especially, Nickel, Copper and Silver are applied widely in various electronic manufactures as easily formation is available by plating. The metallic contact system of silicon solar cell must have several properties, such as low contact resistance, easy application and good adhesion. Ni is shown to be a suitable barrier to Cu diffusion as well as desirable contact metal to silicon. Nickel monosilicide(NiSi) has been suggested as a suitable silicide due to its lower resistivity, lower sintering temperature and lower layer stress than $TiSi_2$. Copper and Silver can be plated by electro & light-induced plating method. Light-induced plating makes use the photovoltaic effect of solar cell to deposite the metal on the front contact. The cell is immersed into the electrolytic plating bath and irradiated at the front side by light source, which leads to a current density in the front side grid. Electroless plated Ni/ Electro&light-induced plated Cu/ Light-induced plated Ag contact solar cells result in an energy conversion efficiency of 14.68 % on $0.2{\sim}0.6{\Omega}{\cdot}cm,\;20{\times}20mm^2$, CZ(Czochralski) wafer.