• 제목/요약/키워드: Plating adhesion

검색결과 135건 처리시간 0.023초

방열기판 전극형성 기술 동향

  • 김단비;김지원;엄누시아;임재홍
    • 세라미스트
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    • 제21권2호
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    • pp.83-88
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    • 2018
  • There is close relation between the heat generation and the performance of electronic device. The durability and efficiency of the device are degraded due to heat generation. It is necessary to release the generated heat from an electronic device. Based on demands of the printed circuit board (PCB) manufacturing, the robust and reliable plating technique of PCB is necessary. In this study, we review various methods for improving the heat sink property. These methods were considered to enhance the adhesion between ceramic substrate as heat sink and metal layer as electrode.

전기화학 공정을 이용한 질화규소 기판 상의 금속 전극 형성에 관한 연구 (Formation of Metal Electrode on Si3N4 Substrate by Electrochemical Technique)

  • 신성철;김지원;권세훈;임재홍
    • 한국표면공학회지
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    • 제49권6호
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    • pp.530-538
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    • 2016
  • There is a close relationship between the performance and the heat generation of the electronic device. Heat generation causes a significant degradation of the durability and/or efficiency of the device. It is necessary to have an effective method to release the generated heat. Based on demands of the printed circuit board (PCB) manufacturing, it is necessary to develop a robust and reliable plating technique for substrates with high thermal conductivity, such as alumina ($Al_2O_3$), aluminium nitride (AlN), and silicon nitride ($Si_3N_4$). In this study, the plating of metal layers on an insulating silicon nitride ($Si_3N_4$) ceramic substrate was developed. We formed a Pd-$TiO_2$ adhesion layer and used APTES(3-Aminopropyltriethoxysilane) to form OH groups on the surface and adhere the metal layer on the insulating $Si_3N_4$ substrate. We used an electroless Ni plating without sensitization/activation process, as Pd particles were nucleated on the $TiO_2$ layer. The electrical resistivity of Ni and Cu layers is $7.27{\times}10^{-5}$ and $1.32{\times}10^{-6}ohm-cm$ by 4 point prober, respectively. The adhesion strength is 2.506 N by scratch test.

SKD61과 Radical Nitriding 처리된 SKD61 기판상에 Arc Ion Plating으로 증착된 TiN 박막의 미세구조 및 기계적 특성, 마찰 및 접착력에 관한 연구 (A Study on Microstructure, Mechanical Properties, Friction and Adhesion of TiN Thin Films Coated on SKD61 and Radical Nitrided SKD61 Substrates by Arc Ion Plating)

  • 주윤곤;윤재홍;방위;장세굉;조동율;하성식
    • 한국표면공학회지
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    • 제40권6호
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    • pp.254-257
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    • 2007
  • TiN coating on tool steel has been widely used for the improvement of durability of tools. In this work, radical nitriding(RN) is carried out on SKD61 at $450^{\circ}C$ for 5 hours in the ammonia gas pressure $2.7{\times}10^3\;Pa$. The TiN coating is carried out by arc ion plating(AIP) with the process parameters: arc power 150 A, bias voltage -50V, coating time 40 minutes and nitrogen gas pressure $4{\times}10^3\;Pa$. Hardness, elastic modulus, friction coefficient and adhesion of TiN coating on substrates of both TiN/SKD61 and TiN/RN SKD61 coatings are investigated comparatively. The primary crystalline faces of TiN surface are(200) and(111) for TiN/SKD61 and TiN/RN SKD61 respectively. In addition to the primary phase, Fe phase exists in TiN/SKD61 coating, but not in TIN/RN SKD61. The hardness of TiN/RN SKD61 is about 700 Hv, 250 Hv(56%) higher than that of TiN/SKD61 at the near interface of TiN and substrates. At the TiN surface, hardness of TiN/RN SKD61 is 2,149 Hv, 71 Hv(3%) higher than that of TiN/SKD61. The elastic modulus of TiN coating is improved to 26.7 GPa(6%) by radical nitriding. The adhesion is improved by the RN coating showing no spalling. buckling and chipping on the scratch test track which are shown on the non-RN TiN/SKD61.

AIP 와 스퍼터링으로 복합증착된 420 스테인리스강의 TiN과 CrN 박막에 미치는 중간층의 영향 (Effect of Interlayer on TiN and CrN Thin Films of STS 420 Hybrid-Deposited by AlP and DC Magnetron Sputtering)

  • 최웅섭;김현승;박범수;이경구;이도재;이광민
    • 한국재료학회지
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    • 제17권5호
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    • pp.256-262
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    • 2007
  • Effects of interlayer and the combination of different coating methods on the mechanical and corrosion behaviors of TiN and CrN coated on 420 stainless steel have been studied. STS 420 specimen were tempered at $300^{\circ}C$ for 1 hr in vacuum furnace. The TiN and CrN thin film with 2 ${\mu}m$ thickness were coated by arc ion plating and DC magnetron sputtering following the formation of interlayer for pure titanium and chromium with 0.2 ${\mu}m$ thickness. The microstructure and surface analysis of the specimen were conducted by using SEM, XRD and roughness tester. Mechanical properties such as hardness and adhesion also were examined. XRD patterns of TiN thin films showed that preferred TiN (111) orientation was observed. The peaks of CrN (111) and $Cr_2N$ (300) were only observed in CrN thin films deposited by arc ion plating. Both TiN and CrN deposited by arc ion plating had the higher adhesion and hardness compared to those formed by magnetron sputtering. The specimen of TiN and CrN on which interlayer deposited by magnetron sputtering and thin film deposited by arc ion plating had the highest adhesion with 22.2 N and 19.2 N. respectively. TiN and CrN samples shown the most noble corrosion potentials when the interlayers were deposited by using magnetron sputtering and the metal nitrides were deposited by using arc ion plating. The most noble corrosion potentials of TiN and CrN were found to be approximately -170 and -70 mV, respectively.

Effects of Hot Rolling on Microstructures and Magnetic Properties

  • Hong, Byung-Deug;Kim, Jae-Kwan;Cho, Kyung-Mox
    • Journal of Magnetics
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    • 제11권3호
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    • pp.111-114
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    • 2006
  • We electroplated copper-cobalt thin films on a silicon substrate, which had 150 nm thick copper seed layer. The adhesion between the two metallic layers could be increased by utilizing a proper organic additive, pulse plating technique, and high temperature annealing. The thin films exhibited columnar growth of the deposits and enhanced adhesion. This is attributed to the grain growth mechanism introduced by the additive and annealing.

태양전지의 저가격.고효율화를 위한 Ni/Cu/Ag 전극에 관한 연구 (The Research of Solar Cells Applying Ni/Cu/Ag Contact for Low Cost & High Efficiency)

  • 조경연;이지훈;이수홍
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2009년도 하계학술대회 논문집
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    • pp.444-445
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    • 2009
  • The metallic contact system of silicon solar cell must have several properties, such as low contact resistance, easy application and good adhesion. Ni is shown to be a suitable barrier to Cu diffusion as well as desirable contact metal to silicon. Nickel monosilicide(NiSi) has been suggested as a suitable silicide due to its lower resistivity, lower sintering temperature and lower layer stress than $TiSi_2$. Copper and Silver can be plated by electro & light-induced plating method. Light-induced plating makes use the photovoltaic effect of solar cell to deposit the metal on the front contact. The cell is immersed into the electrolytic plating bath and irradiated at the front side by light source, which leads to a current density in the front side grid. Electroless plated Ni/ Electro&light-induced plated Cu/ Light-induced plated Ag contact solar cells result in an energy conversion efficiency of 16.446 % on $0.2\sim0.6\;{\Omega}{\cdot}cm$, $20\;\times\;20\;mm^2$, CZ(Czochralski) wafer.

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질화 티타늄이 코팅된 절삭공구의 수명에 영향을 미치는 인자 (Parameters Affecting the TiN Coated Machining Tool's Life)

  • 최병대;김동수
    • 한국표면공학회지
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    • 제28권2호
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    • pp.77-82
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    • 1995
  • In this study, we examined the relationships between the coating film's properties, such as microhardness, adhesion of coating fil $m_strate, and machining tool's life time. Samples were prepared by coating TiN on the 5.5 diameter twist drills using reactive ion plating technology, For measuring microhardness and adhesion of fil $m_strate, HSS plate was used for substrate. TiN coated drill's life time was dependent on the adhesion of fil $m_strate and averagely increased by several ten times more than uncoated drill's. The major parameter affecting TiN coated drill's life time was the strong adhesion between coating film and substrate.ate.

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이온도금된 Ti(C, N)피막의 물성에 대한 전자빔가열 효과 (Effects of Electron Beam Heating(EBH) on the Properties of ion Plated Ti(C, N) Films)

  • 김치명;고경현;안재환;배종수;정형식
    • 한국표면공학회지
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    • 제28권5호
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    • pp.267-275
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    • 1995
  • Electron beam can provide convenient way to heat the substrate during Hollow Cathode Discharge (HCD) ion plating of Ti(C, N)films. Densification of columnar structrue is enhanced by longer duration of electron beam heating(EBH). While strong(111) texture is identified always to be formed, the amount of (200) oriented grains which coherently interfaced with carbide particles of the substrate increased with heating(EBH). In turns, these crystallogaphical change lead to the increase of micro hardness and adhesion of coating. Adhesion of Ti(C, N) films increased more dramatically in case of ASP30 substrate of which carbide particles dispersed more finely than M42. Therefore, it could be concluded that both the density of film and interfacial structure can affect the adhesion property. Overheating of substrate could be resulted in low adhesion resistance due to high residual stress developed in the film.

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파라듐 촉매화 처리에 미치는 초음파 교반의 영향 (Effect of Ultrasonic Agitation on Pd Catalyst Treatment)

  • 김동규;이홍로;추현식
    • 한국표면공학회지
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    • 제34권6호
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    • pp.545-552
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    • 2001
  • Effect of ultrasonic agitation on Pd catalyst treatment was studied in metallization of ceramic boards by Cu electroless plating method.96% $Al_{2}$$O_{3}$ ceramic boards were used as substrate. In this study, the ultrasonic frequency of 28kHz was applied. In Pd catalyst, high density Pd nuclei of small size were formed during ultrasonic agitation. Density of Pd was more improved when using of ultrasonic then no stirring. In electroless plating, plating rate was in the range of 0.6~1.8$\mu\textrm{m}$/hr, which value increased with Rochelle Salts addition. Adhesion strength between ceramic boards and Cu layer was improved of 20% when using ultrasonic agitation at $30^{\circ}C$ ,5min.

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감마선 자극에 의한 금속이온 이식 도전성 폴리머 (Surface Metallization of Polyethylene Films Modified by Radiation Grafting of N-vinyl Pyrollidone)

  • A. Aal;V. V. Khutoryanskiy;Z. S. Nurkeeva;G. A. Mun;Soh, Dea-Wha
    • 한국정보통신학회:학술대회논문집
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    • 한국해양정보통신학회 2003년도 추계종합학술대회
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    • pp.403-406
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    • 2003
  • Poyethylene(PE) films could be modified by radiation grafting of N-vinyl pyrollidone(NVP) using radiation. FTIR spectra was used to confirm the modification of PE films. The modified films were activated by one-step or two-step methods for electroless Cu plating. Morphology of metallized films has been investigated. Electroless Cu plating onto the modified films depends mainly on the grafting degree and activation type. The electrical conductivity and adhesion of the metallized films has been investigated and tested in regard of grafting degree of samples.

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